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    STRUCTURAL THERMAL SOLUTIONS FOR DISPLAY DEVICES
    1.
    发明申请
    STRUCTURAL THERMAL SOLUTIONS FOR DISPLAY DEVICES 审中-公开

    公开(公告)号：WO2020046416A1

    公开(公告)日：2020-03-05

    申请号：PCT/US2019/019930

    申请日：2019-02-28

    Applicant: APPLE INC.

    Inventor： MARIC, Ivan S. ,  HOBSON, Phil M. ,  CAMPO, Laura M. ,  SELVAKUMAR, Sivesh ,  OLSON, Jeffrey C.

    IPC: G02B27/01 ,  G02F1/1333 ,  H05K7/20

    Abstract: In one aspect of the present disclosure, a display system is disclosed, such as a wearable head-mounted display (HMD), that includes an internal system housing and a movable display stack. The display stack includes a display panel, a carrier supporting the display panel, and a heat sink that are secured together such that the display panel, the carrier, and the heat sink are movable in unison within the internal system housing to adjust focus of the display panel. The carrier and/or the heat sink respectively include first and second thermal solutions to facilitate heat transfer away from the display panel, which may include a material having high thermal-conductivity properties and/or any structure that is configured to increase the exposed surface area of the carrier and/or the heat sink, such as projections or extensions (e.g., fins), recesses, slits, openings, or the like.

    ELECTRONIC DEVICES WITH OPTICAL MODULES
    5.
    发明公开
    ELECTRONIC DEVICES WITH OPTICAL MODULES 审中-实审

    公开(公告)号：EP4332657A3

    公开(公告)日：2024-06-12

    申请号：EP24152609.4

    申请日：2021-04-12

    Applicant: Apple Inc.

    Inventor： MARIC, Ivan S. ,  WANG, Forrest C. ,  FRANKLIN, Jeremy C. ,  HOBSON, Phil M. ,  LIN, Wey-Jiun ,  JO, Yoonhoo

    IPC: G02B27/01 ,  G02B27/00

    CPC classification number: G02B27/0176 ,  G02B27/0172 ,  G02B27/0093

    Abstract: A head-mounted device may have left and right optical modules that present images to a user's eyes. Each optical module may have an optical module support structure and a lens and display coupled to the optical module support structure. The head-mounted device may have a head-mounted housing that supports the optical modules. A cover on a rear face of the head-mounted housing may have a pair of openings configured to receive the left and right optical modules. The cover may have a cover layer and left and right cover layer mounting rings respectively configured to engage with the optical module support structures of the left and right optical modules. Sets of magnets in the left and right optical modules may be configured to attract corresponding left and right vision correction lenses. Gaskets may surround the lenses in the optical modules and may prevent environmental contaminant intrusion.

    HEAD-MOUNTED ELECTRONIC DEVICE
    8.
    发明公开
    HEAD-MOUNTED ELECTRONIC DEVICE 审中-公开

    公开(公告)号：EP3901688A3

    公开(公告)日：2022-01-05

    申请号：EP21167896.6

    申请日：2021-04-12

    Applicant: Apple Inc.

    Inventor： MARIC, Ivan S. ,  ZIMMERMANN, Aidan N. ,  BAILLARGEON, Brian ,  CHRISTENSEN, Evan D. ,  SAUERS, Jason C. ,  TAO, Jia ,  HOBSON, Phil M. ,  SELVAKUMAR, Sivesh

    IPC: G02B27/01

    Abstract: A head-mounted device may have a head-mounted housing. The housing may include a chassis with left and right openings that overlap respective left and right optical modules that present images eye boxes. Each optical module may have a lens and display that presents an image through the lens. The chassis may have an inner frame and outer frame. A middle portion of the chassis may form a stiffened nose bridge structure. Components in the housing such as a display, a fan housing, a heat sink layer, optical module guide rods, and a rear cover may span the width of the housing and may be attached to edge portions of the chassis, thereby forming a box-shaped structure that provides rigidity and helps prevent housing deformation.

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