METROLOGY METHOD FOR MEASURING AN EXPOSED PATTERN AND ASSOCIATED METROLOGY APPARATUS

    公开(公告)号:EP3958052A1

    公开(公告)日:2022-02-23

    申请号:EP20192002.2

    申请日:2020-08-20

    Inventor: COTTAAR, Jeroen

    Abstract: Disclosed is a method for performing a measurement of an exposed pattern in photoresist on a substrate and an associated metrology device. The method comprises imparting a beam of measurement radiation on said exposed pattern over a measurement area of a size which prevents or mitigates photoresist damage from the measurement radiation; capturing scattered radiation comprising said measurement radiation subsequent to it having been scattered from said exposed pattern and detecting the scattered radiation on at least one detector. A value for a parameter of interest is determined from the scattered radiation.

    ASSEMBLIES AND METHODS FOR GUIDING RADIATION
    16.
    发明公开

    公开(公告)号:EP3869270A1

    公开(公告)日:2021-08-25

    申请号:EP20157939.8

    申请日:2020-02-18

    Abstract: Apparatus and method for measuring one or more parameters of a substrate (300) using source radiation emitted from a radiation source (100) and directed onto the substrate. The apparatus comprises at least one reflecting element (710a) and at least one detector (720, 721). The at least one reflecting element is configured to receive a reflected radiation resulting from reflection of the source radiation from the substrate and further reflect the reflected radiation into a further reflected radiation. The at least one detector is configured for measurement of the further reflected radiation for determination of at least an alignment of the source radiation and/or the substrate

    METHOD FOR CONTROLLING A LITHOGRAPHIC APPARATUS

    公开(公告)号:EP3848757A1

    公开(公告)日:2021-07-14

    申请号:EP20151440.3

    申请日:2020-01-13

    Abstract: A method of determining a control setting for a lithographic apparatus. The method comprises obtaining a first correction for a current layer on a current substrate based on first metrology data associated with one or more previous substrates, and obtaining a second correction for the current layer on the current substrate. The second correction is obtained based on a residual determined based on second metrology data associated with a previous layer on the current substrate. The method further comprises determining the control setting for the lithographic apparatus for patterning the current layer on the current substrate by combining the first correction and the second correction.

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