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公开(公告)号：SG136116A1
公开(公告)日：2007-10-29
申请号：SG2007025166
申请日：2007-04-04
Applicant: ASML NETHERLANDS BV
Inventor： WERKMAN ROY , MOS EVERHARDUS CORNELIS
Abstract: Correcting for misalignment of a substrate before it is exposed is performed using offset corrections and process corrections that are calculated based on alignment offset measurements of alignment marks and overlay measurements of overlay targets on substrates in previous batches.
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