Abstract:
PROBLEM TO BE SOLVED: To provide an alignment apparatus for a substrate bonding system. SOLUTION: A primary optical arm 12a configured so that radiation from primary alignment marks 6a and 6b on a primary substrate 6 may be guided to a detector, and a secondary optical arm 12b configured so that radiation from secondary alignment marks 8a and 8b on a secondary substrate 8 may be guided to a detector 28a are arranged. The primary alignment mark has a known position against a functional pattern arranged on the opposite side of the primary substrate, while the secondary alignment mark has a known position against a functional pattern arranged on the opposite side of the secondary substrate. In addition, the substrate bonding system has primary and secondary substrate tables 4 that are configured so that the primary and secondary substrates may be held, and at least one of the substrate tables can move in response to a signal output from the detector. The primary and secondary substrates can be aligned against each other for bonding. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method of selecting a grid model for correcting a process recipe for grid deformations in a lithographic apparatus. SOLUTION: First a set of grid models is provided. Subsequently, alignment data is obtained by performing an alignment measurement on a plurality of alignment marks on a number of substrates. For each grid model, it is checked whether the alignment data is suitable to solve the grid model. If so, the grid model is added to a subset of grid models. The grid model with the lowest residual is selected. In addition to alignment data, metrology data may be obtained by performing overlay measurement on a plurality of overlay marks on the number of substrates. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method for optimizing an alignment strategy that processes batches of substrates in a lithographic projection apparatus. SOLUTION: First, all of the substrates in the batches in the lithographic projection apparatus are sequentially aligned using a predefined alignment strategy and exposed (804). Next, alignment data is determined for each substrate in the batches (805). At least one substrate in each batch is selected to obtain a set of selected substrates (806-809). By a metrology tool, overlay data for each of the selected substrates is determined and overlay indicator values for a predefined overlay indicator are calculated (810) for the predefined alignment strategy and for other possible alignment strategies, and an optimal alignment strategy is determined, the strategy being defined as alignment strategy among the predefined alignment strategy and the other possible alignment strategies with a lowest overlay indicator value (811). COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide an apparatus capable of improving image quality in a plurality of focal depths. SOLUTION: When using a scatterometer, different sections of a target region have different focal depths, respectively, and therefore, when measuring an entire region, a result of the measurement is partially out of a focus. In order to compensate this, a lens array is arranged in a back focal plane of a high numerical aperture lens. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To suppress an extreme misalignment caused by insufficient usable information on positioning in a method for positioning a substrate. SOLUTION: The compensation of the misalignment in the substrate is executed before exposure by using a compensation value and a process compensation value calculated based on the positioning offset measured value of a positioning mark present on a substrate and the overlay measured value of an overlay target in the preceding batch. Fluctuations in overlays of the positioning mark are measured on at least one substrate in the preceding batch and overlay fluctuations with weights are all totalled on the positioning mark of at least one substrate in the preceding batch to calculate a process compensation of the substrate, and the process compensation is applied to the positioning of the substrate and the substrate is exposed. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a selection method of a lattice model for correcting a treatment recipe of lattice deformations in lithographic equipment. SOLUTION: A plurality of sets of lattice models are provided. Alignment data is acquired by executing alignment measurement for a plurality of alignment marks on a plurality of substrates. Whether the acquired alignment data is suitable for solving the lattice models is checked for each lattice model. When the acquired alignment data is suitable for solving the lattice model, this lattice model is added to a subset of the plurality of lattice models. The lattice model with the least excess is selected. Besides the alignment data, metrological data can be obtained, by executing overlay measurement on a plurality of overlay marks on the plurality of substrates. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
Ein Verfahren, System und Programm zum Bestimmen des Beitrags eines Fingerabdrucks eines Parameters. Das Verfahren umfasst das Bestimmen eines Beitrags von einer Vorrichtung aus einer Vielzahl von Vorrichtungen zu einem Fingerabdruck eines Parameters. Das Verfahren beinhaltet Folgendes:Erhalten von Parameterdaten und Verwendungsdaten, wobei die Parameterdaten auf Messungen für mehrere Substrate, die von der Vielzahl von Vorrichtungen verarbeitet worden sind, basieren und die Verwendungsdaten angeben, welche der Vorrichtungen aus der Vielzahl der Vorrichtungen bei der Verarbeitung jedes Substrats verwendet wurden; undBestimmen des Beitrags unter Verwendung der Verwendungsdaten und Parameterdaten.
Abstract:
The invention relates to a method of selecting a grid model for correcting a process recipe for grid deformations in a lithographic apparatus. First a set of grid models is provided. Subsequently, alignment data are obtained by performing an alignment measurement on a plurality of alignment marks on a number of substrates. For each grid model it is checked whether the alignment data is suitable to solve the grid model. If so, the grid model is added to a subset of grid models. The grid model with lowest residuals is selected. In addition to alignment data, metrology data may be obtained by performing an overlay measurement on a plurality of overlay marks on the number of substrates. For each grid model of the subset simulated metrology data may then be determined that is used to determine overlay performance indicators. The grid model is then selected using the overlay performance indicators.
Abstract:
Ein Verfahren zum Bestimmen eines charakteristischen Beitrags einer Vorrichtung aus einer Vielzahl von Vorrichtungen zu einem Fingerabdruck eines Parameters, wobei der Parameter mit der Verarbeitung eines Substrats assoziiert ist, wobei das Verfahren Folgendes beinhaltet:Erhalten von Parameterdaten und Verwendungsdaten, wobei die Parameterdaten auf Messungen für mehrere Substrate, die von der Vielzahl von Vorrichtungen verarbeitet worden sind, basieren und die Verwendungsdaten angeben, welche der Vorrichtungen aus der Vielzahl von Vorrichtungen bei der Verarbeitung jedes Substrats verwendet wurden;Bestimmen des Beitrags unter Verwendung der Verwendungsdaten und Parameterdaten; undAnalysieren der Variation der Parameterdaten unter Verwendung der Verwendungsdaten, wobei das Bestimmen des Beitrags zu dem Parameter für eine Vorrichtung das Gruppieren der Daten unter Verwendung der analysierten Variation beinhaltet.