Reflector manufacturing method and associated reflector

    公开(公告)号:US12269229B2

    公开(公告)日:2025-04-08

    申请号:US17433774

    申请日:2020-01-28

    Abstract: Disclosed is a method of manufacturing a reflector. The method comprises polishing (520) at least the uppermost surface of the uppermost substantially flat substrate of a plurality of substantially flat substrates, deforming (530) each substantially flat substrate into the desired shape, and bonding (540) the deformed substrates together to form said reflector. In an embodiment, the deforming and bonding is performed together using a mold.

    Methods and apparatus for predicting performance of a measurement method, measurement method and apparatus

    公开(公告)号:US11626704B2

    公开(公告)日:2023-04-11

    申请号:US15902454

    申请日:2018-02-22

    Abstract: A radiation source arrangement causes interaction between pump radiation (340) and a gaseous medium (406) to generate EUV or soft x-ray radiation by higher harmonic generation (HHG). The operating condition of the radiation source arrangement is monitored by detecting (420/430) third radiation (422) resulting from an interaction between condition sensing radiation and the medium. The condition sensing radiation (740) may be the same as the first radiation or it may be separately applied. The third radiation may be for example a portion of the condition sensing radiation that is reflected or scattered by a vacuum-gas boundary, or it may be lower harmonics of the HHG process, or fluorescence, or scattered. The sensor may include one or more image detectors so that spatial distribution of intensity and/or the angular distribution of the third radiation may be analyzed. Feedback control based on the determined operating condition stabilizes operation of the HHG source.

    Method and apparatus for determining a radiation beam intensity profile

    公开(公告)号:US11353796B2

    公开(公告)日:2022-06-07

    申请号:US16556603

    申请日:2019-08-30

    Abstract: Methods and apparatus for determining an intensity profile of a radiation beam. The method comprises providing a diffraction structure, causing a relative movement of the diffraction structure relative to the radiation beam from a first position, wherein the radiation beam does not irradiate the diffraction structure to a second position, wherein the radiation beam irradiates the diffraction structure, measuring, with a radiation detector, diffracted radiation signals produced from a diffraction of the radiation beam by the diffraction structure as the diffraction structure transitions from the first position to the second position or vice versa, and determining an intensity profile of the radiation beam based on the measured diffracted radiation signals.

    Illumination source for an inspection apparatus, inspection apparatus and inspection method

    公开(公告)号:US10330606B2

    公开(公告)日:2019-06-25

    申请号:US15683216

    申请日:2017-08-22

    Abstract: Disclosed is an inspection apparatus and associated method for measuring a target structure on a substrate. The inspection apparatus comprises an illumination source for generating measurement radiation; an optical arrangement for focusing the measurement radiation onto said target structure; and a compensatory optical device. The compensatory optical device may comprise an SLM operable to spatially modulate the wavefront of the measurement radiation so as to compensate for a non-uniform manufacturing defect in said optical arrangement. In alternative embodiments, the compensatory optical device may be located in the beam of measurement radiation, or in the beam of pump radiation used to generate high harmonic radiation in a HHG source. Where located in in the beam of pump radiation, the compensatory optical device may be used to correct pointing errors, or impart a desired profile or varying illumination pattern in a beam of the measurement radiation.

    Lithographic apparatus and method for performing a measurement

    公开(公告)号:US10067068B2

    公开(公告)日:2018-09-04

    申请号:US15388463

    申请日:2016-12-22

    Abstract: A lithographic apparatus is a machine that applies a desired pattern onto a substrate, usually onto a target portion of the substrate. A lithographic apparatus can be used, for example, in the manufacture of integrated circuits (ICs). The lithographic apparatus has an inspection apparatus with an illumination system that utilizes illuminating radiation with a wavelength of 2-40 nm. The illumination system includes an optical element that splits the illuminating radiation into a first and a second illuminating radiation and induces a time delay to the first or the second illuminating radiation. A detector detects the radiation that has been scattered by a target structure. The inspection apparatus has a processing unit operable to control a time delay between the first scattered radiation and the second scattered radiation so as to optimize a property of the combined first and second scattered radiation.

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