公开(公告)号：WO1996017501A1

公开(公告)日：1996-06-06

申请号：PCT/US1995015509

申请日：1995-11-30

Applicant: AUGAT INC.

Inventor： AUGAT INC. ,  CROTZER, David, R. ,  HANRAHAN, Mark, G. ,  PICKLES, Charles, S.

IPC: H05K01/00

CPC classification number: H01R13/035 ,  H01R13/6599 ,  H05K1/095 ,  H05K3/102 ,  H05K3/325 ,  H05K3/38 ,  H05K2201/0133 ,  H05K2201/0329 ,  H05K2203/1168

Abstract: An electrical device is provided having a conductive coating or layer (20) chemically grafted to a support structure (18) to produce a durable, conductive surface permanently attached to the underlying substrate material. The grafted layer (20) can be embodied in an electrical contact (16), and can also be embodied as electrical traces (72) and contact areas (66) of circuit board (60) and electrical and electronic devices and components. In another embodiment, the grafted layer (20) can be provided in an RFI/EMI shield or ground plane.

Abstract translation: 提供了一种电气装置，其具有化学接枝到支撑结构（18）上的导电涂层或层（20），以产生永久地附接到下面的基底材料的耐用导电表面。 接枝层（20）可以实现为电接触（16），并且还可以实现为电路板（72）和电路板（60）的接触区域（66）以及电气和电子设备和部件。 在另一个实施方案中，接枝层（20）可以设置在RFI / EMI屏蔽层或接地平面中。

公开(公告)号：WO1994019844A1

公开(公告)日：1994-09-01

申请号：PCT/US1994001392

申请日：1994-02-08

Applicant: AUGAT INC.

Inventor： AUGAT INC. ,  BROUILLETTE, Peter ,  PICKLES, Charles, S.

IPC: H01R23/72

CPC classification number: H05K5/0265 ,  H01R12/7005 ,  H01R12/722 ,  H05K5/0291

Abstract: A circuit card interface system (10) of minimized vertical clearance, capable of interfacing one or more circuit cards to a relatively small space on a mother board. The interface system includes an interfacing connector assembly (12) and at least one stacking connector assembly (14), each adapted to receive a circuit card. The conductors of the interfacing connector assembly are coupled to a substrate such as a mother board. The interfacing connector assembly can be used alone or with one or more electrically interconnected stacking connector assemblies. Rapid electrical attachment of each stacking connector assembly is accomplished by mating a cooperating portion (100) of the stacking connector assembly with a portion (44) of the underlying interfacing connector assembly.

Abstract translation: 一种电路卡接口系统（10），其具有最小的垂直间隙，能够将一个或多个电路卡连接到母板上较小的空间。 接口系统包括接口连接器组件（12）和至少一个堆叠连接器组件（14），每个堆叠连接器组件适于接收电路卡。 接口连接器组件的导体连接到诸如母板的基板。 接口连接器组件可以单独使用或与一个或多个电互连堆叠连接器组件一起使用。 每个堆叠连接器组件的快速电连接通过将堆叠连接器组件的配合部分（100）与下面的接口连接器组件的部分（44）配合来实现。

公开(公告)号：WO1998002937A1

公开(公告)日：1998-01-22

申请号：PCT/US1997008562

申请日：1997-05-20

Applicant: AUGAT INC.

Inventor： AUGAT INC. ,  KEMPF, Andrew, J. ,  PERRY, Jason ,  LOCATI, Ronald, P.

IPC: H01R09/09

CPC classification number: H01R24/50 ,  H01R13/18 ,  H01R2103/00

Abstract: A printed circuit board to housing interconnect system (10) capable of withstanding "hot" connects and disconnects of conductors (120, 220) carrying currents of up to 15 amperes or more while maintaining RF performance. The interconnect system may be used to couple power lines or RF signal lines from a printed circuit board to a high power system. The interconnect system allows a printed circuit board to be installed or removed from a system without having to power down the system in order to perform installation or removal.

Abstract translation: 一种印刷电路板到外壳互连系统（10），其能够承受高达15安培或更多电流的导体（120,220）的“热”连接和断开，同时保持RF性能。 互连系统可用于将电力线或RF信号线从印刷电路板耦合到高功率系统。 互连系统允许将印刷电路板从系统安装或移除，而无需关闭系统以进行安装或拆卸。

公开(公告)号：WO1994017574A1

公开(公告)日：1994-08-04

申请号：PCT/US1994000722

申请日：1994-01-19

Applicant: AUGAT INC. ,  CYRIX CORPORATION

Inventor： AUGAT INC. ,  CYRIX CORPORATION ,  DELPRETE, Stephen, D. ,  SANTOS, Donald ,  ARNOLD, Kerry, D. ,  SELGAS, Thomas, D. ,  CROWLEY, Sean

IPC: H01R23/72

CPC classification number: H05K7/1023

Abstract: A component carrier and mating system is disclosed for aligning and mating closely spaced leads of integrated circuit (IC) packages, which protects the integrated circuit packages and permits easy installation. A carrier assembly (100) aligns for mating and interconnecting at least two integrated circuit packages (102a, 102b) having a plurality of leads extending from the packages. A protective shroud (101) covers the stacked packages to maintain the packages in electrical and mechanical engagement and to assure that no damage occurs to the integrated circuit packages. In one embodiment, a first package (102a) is installed on the carrier assembly (100) and coupled with the protective shroud (101) to form a pre-engagement assembly, the pre-engagement assembly is then engaged with a second package (102b) mounted on a printed circuit board. An extraction tool (554) facilitates disengagement of the assembly from the second package mounted on the printed circuit board.

Abstract translation: 公开了用于对准和配合集成电路（IC）封装的紧密间隔的引线的部件载体和配合系统，其保护集成电路封装并且允许容易的安装。 载体组件（100）对齐以配合和互连至少两个具有从封装延伸的多个引线的集成电路封装（102a，102b）。 保护罩（101）覆盖堆叠的包装以将包装保持在电气和机械接合中并且确保不会对集成电路封装造成损坏。 在一个实施例中，第一包装（102a）安装在承载组件（100）上并与保护罩（101）联接以形成预接合组件，然后将预接合组件与第二包装（102b）接合 ）安装在印刷电路板上。 提取工具（554）有助于组件与安装在印刷电路板上的第二封装分离。

公开(公告)号：WO1993020598A1

公开(公告)日：1993-10-14

申请号：PCT/US1993003033

申请日：1993-03-30

Applicant: AUGAT INC.

Inventor： AUGAT INC. ,  MALO, Cheryne ,  MARIAN, Steven, Paul ,  MENDENHALL, David, W.

IPC: H01R09/09

CPC classification number: H01R12/79 ,  H01R4/06 ,  H01R12/52 ,  H01R12/62 ,  H01R12/7047 ,  H01R12/714 ,  H01R12/774 ,  H01R13/658

Abstract: A modified high density backplane (MHDB) connector (10) is provided for electrically interconnecting high density printed circuit boards (12, 14) having predetermined interconnect circuitry including high density arrays of ground/signal contact pads, discrete power pads and discrete ground pads. The MHDB connector includes one or more contact modules (30), a connector housing (60), a pcb biasing mechanism, connector end caps (110), a flexible film (140), two interactive biasing modules (150, 170) for each contact module, and a camming member (130) secured to the pcb to be mated. The interactive biasing modules contact with the flexible film to provide uniform contact force distribution over the interconnect regions of the connector and provide contact rivet displacement tolerance relief. The MHDB connector provides sequenced movement of the pcb (12) to be mated into the contact rivets (52) to provide contact wipe and may provide for alignment of the one pcb with the MHDB connector.

Abstract translation: 提供了一种改进的高密度背板（MHDB）连接器（10），用于电连接具有预定互连电路的高密度印刷电路板（12,14），所述互连电路包括接地/信号接触焊盘的高密度阵列，离散功率垫和离散接地焊盘。 MHDB连接器包括一个或多个接触模块（30），连接器壳体（60），pcb偏置机构，连接器端盖（110），柔性膜（140），用于每个的两个交互偏置模块（150,170） 接触模块和固定到要被配合的pcb的凸轮构件（130）。 交互式偏压模块与柔性膜接触，以在连接器的互连区域上提供均匀的接触力分布，并提供接触铆钉位移公差。 MHDB连接器提供pcb（12）的顺序运动，以配合到接触铆钉（52）中以提供接触擦拭，并且可以提供一个pcb与MHDB连接器的对准。

公开(公告)号：WO1993018559A1

公开(公告)日：1993-09-16

申请号：PCT/US1993002013

申请日：1993-03-04

Applicant: AUGAT INC.

Inventor： AUGAT INC. ,  BELLOMO, Michael, J. ,  SANTOS, Donald ,  JOHNSON, Wayne

IPC: H01R13/62

CPC classification number: H01R12/707 ,  H01R12/7023 ,  H01R12/7029

Abstract: An edge card interconnection system (30) provides enhanced electrical interconnection between a module (36) and a circuit board (33). A latching mechanism (40) is easily manipulated and provides significant protection to modules (36) being installed/extracted. An insulative connector portion (42) includes a back-up spring (50) that pushes an inserted module (36) against a set of contacts (44). Deflection of the contacts (44) is controlled by a wall (88) of the connector portion (32) that prohibits the module (36) from deflecting the contacts (44) beyond a present amount. The back-up spring (50) absorbs any tolerance(s) in board thickness. The latching mechanism (40) includes latch arms (92) which have tabs (96) disposed thereon upon which manual forces are exerted to release the latch arms (92) from the connector portion (32). A connector hold-down mechanism (114) snaps onto ends of the insulative connector housing (42) and is soldered into a plated through-hole, to fasten the edge card interconnection system (30) to a printed circuit board (33).

Abstract translation: 边缘卡互连系统（30）提供模块（36）和电路板（33）之间的增强的电互连。 锁定机构（40）容易操纵，并且对被安装/提取的模块（36）提供显着的保护。 绝缘连接器部分（42）包括备用弹簧（50），其将插入的模块（36）推靠在一组触点（44）上。 触头（44）的偏转由连接器部分（32）的壁（88）控制，该壁（88）禁止模块（36）将触点（44）偏转超过当前的量。 备用弹簧（50）吸收板厚度的任何公差。 锁定机构（40）包括锁定臂（92），其具有设置在其上的突片（96），在该臂上施加手动力以从连接器部分（32）释放闩锁臂（92）。 连接器压紧机构（114）卡扣在绝缘连接器壳体（42）的端部上，并焊接到电镀通孔中，将边缘卡互连系统（30）固定到印刷电路板（33）上。

公开(公告)号：WO1993004512A1

公开(公告)日：1993-03-04

申请号：PCT/US1992005615

申请日：1992-07-02

Applicant: AUGAT INC.

Inventor： AUGAT INC. ,  DELPRETE, Stephen, D. ,  SANTOS, Donald ,  CORBESERO, Steven, R. ,  D'AMICO, Richard, J.

IPC: H01R09/09

CPC classification number: H05K7/1069 ,  G01R1/0483 ,  H01R12/714 ,  H01R13/24

Abstract: A leadless component socket (10) comprises a one- or two- piece leadless component contact socket assembly (12) having a plurality of holes (30) with a respective plurality of spring contacts (46, 50) disposed therein. The socket assembly includes a finger slot (41) or slots to facilitate the manual removal of a chip carrier (14) from the socket and a bias clip (40) and integral keyed corner (36) for assuring proper alignment of the chip carrier with the contacts of the socket assembly. The socket further comprises a cover (64), a cover support (66), an insulator assembly (26) and a backup plate (28) or other fastening means for supporting the socket on a printed circuit board. The socket assembly can be configured with a variety of contact terminal ends adapted for a desired mode of circuit board interface. A variety of cover configurations are also accommodated and disclosed.