公开(公告)号：US20220304175A1

公开(公告)日：2022-09-22

申请号：US17805641

申请日：2022-06-06

Applicant: Apple Inc.

Inventor： Eric W. Hamann ,  Abhijeet Misra ,  Anthony D. Prescenzi ,  Brian M. Gable ,  Christopher D. Prest ,  Hoishun Li ,  James A. Yurko ,  Lee E. Hooton ,  Michael B. Wittenberg ,  Richard H. Dinh ,  Jennifer D. Schuler

IPC: H05K5/04 ,  H05K5/00 ,  H05K5/02

Abstract: A component for an electronic device can include a pre-formed substrate comprising a first metal and an additively manufactured portion bonded to the pre-formed substrate. The additively manufactured portion can include a first portion comprising a second metal and defining a volume, the first portion having a first value of a material property, and a second portion disposed in the volume, the second portion having a second value of the material property that is different from the first value.

公开(公告)号：US11418638B2

公开(公告)日：2022-08-16

申请号：US16569525

申请日：2019-09-12

Applicant: Apple Inc.

Inventor： Abhijeet Misra ,  Steven J. Osborne ,  Ian A. Spraggs ,  Marwan Rammah ,  William A. Counts

IPC: G06F1/16 ,  H04M1/18 ,  H04M1/02

Abstract: Embodiments are directed to an enclosure for an electronic device. In one aspect, an embodiment includes an enclosure having an enclosure component and an internal component that may be affixed along a bonding region. The enclosure component may be formed from an enclosure material and defines an exterior surface of the enclosure and an opening configured to receive a display. The internal component may be formed from a metal material different than the enclosure material. The bonding region may include an interstitial material that has a melting temperature that is less than a melting temperature of either one of the enclosure material or the metal material. The bonding region may also include one or more of the enclosure material or the metal material.

公开(公告)号：US11178781B2

公开(公告)日：2021-11-16

申请号：US16125409

申请日：2018-09-07

Applicant: Apple Inc.

Inventor： Todd S. Mintz ,  Shi Hua Zhang ,  Abhijeet Misra ,  Eric W. Hamann

IPC: H05K5/02 ,  C25F3/14 ,  B29C45/14 ,  C25D11/10 ,  C25D11/08 ,  H05K5/00 ,  H05K5/04 ,  H05K5/06 ,  C23F1/02 ,  H04M1/02 ,  C23G1/12 ,  B29K705/00 ,  C23F1/20

Abstract: This application relates to a composite part that can include a non-metal layer having attachment features, and a metal part that is joined with the non-metal layer. The metal part can include a plurality of interlocking structures that are disposed at an external surface of the metal part, where each of the interlocking structures can include an opening characterized as having a first width, and an undercut region, where the opening leads into the undercut region, and the undercut region is characterized as having a second width that is greater than the first width such that the undercut region captures and retains one of the attachment features of the non-metal layer.

公开(公告)号：US20200157669A1

公开(公告)日：2020-05-21

申请号：US16654855

申请日：2019-10-16

Applicant: Apple Inc.

Inventor： Abhijeet Misra ,  James A. Wright ,  Herng-Jeng Jou

IPC: C22F1/053 ,  C22C21/10 ,  C22C1/02

Abstract: The disclosure provides aluminum alloys having varying ranges of alloying elements and properties.

公开(公告)号：US10544493B2

公开(公告)日：2020-01-28

申请号：US16244750

申请日：2019-01-10

Applicant: Apple Inc.

Inventor： Abhijeet Misra ,  James A. Wright ,  Herng-Jeng Jou

IPC: C22F1/053 ,  C22C1/02 ,  C22C21/10

Abstract: The disclosure provides aluminum alloys having varying ranges of alloying elements and properties. The aluminum alloys have a wt % ratio of Zn to Mg from 2.5 to 3.5.

公开(公告)号：US10208371B2

公开(公告)日：2019-02-19

申请号：US15406153

申请日：2017-01-13

Applicant: Apple Inc.

Inventor： Abhijeet Misra ,  James A. Wright ,  Herng-Jeng Jou

IPC: C22C1/02 ,  C22C21/00 ,  C22C21/10 ,  C22F1/053

Abstract: The disclosure provides aluminum alloys having varying ranges of alloying elements and properties. In some variations, the alloy can include 3.4 to 4.9 wt % Zn, 1.3 to 2.1 wt % Mg, no greater than 0.06 wt % Cu, no greater than 0.06 wt % Zr, 0.06 to 0.08 wt % Fe, no greater than 0.05 wt % Si, and the balance is aluminum and incidental impurities.

公开(公告)号：US20240375181A1

公开(公告)日：2024-11-14

申请号：US18784470

申请日：2024-07-25

Applicant: Apple Inc.

Inventor： Anthony D. Prescenzi ,  Abhijeet Misra ,  Adam T. Clavelle ,  Eric W. Hamann ,  Isabel Yang ,  Brian M. Gable ,  James A. Yurko

IPC: B22F10/25 ,  B22F10/66 ,  B32B15/01 ,  B33Y10/00 ,  B33Y40/20 ,  B33Y80/00

Abstract: A 3D printed metallic structure can include an elongated body defining an orifice, the elongated body divisible into a plurality of sectioned elements. The plurality of sectioned elements configured for use a housing or enclosures of electronic devices.

公开(公告)号：US11345980B2

公开(公告)日：2022-05-31

申请号：US16530830

申请日：2019-08-02

Applicant: Apple Inc.

Inventor： Brian M. Gable ,  Herng-Jeng Jou ,  Weiming Huang ,  Graeme W. Paul ,  William A. Counts ,  Eric W. Hamann ,  Katie L. Sassaman ,  Abhijeet Misra ,  Zechariah D. Feinberg ,  James A. Yurko ,  Brian P. Demers ,  Rafael Yu ,  Anuj Datta Roy ,  Susannah P. Calvin

IPC: C22C21/00 ,  C22C1/02 ,  C22F1/04

Abstract: The disclosure provides an aluminum alloy may include iron (Fe) of at least 0.10 wt %, silicon (Si) of at least 0.35 wt %, and magnesium (Mg) of at least 0.45 wt %, manganese (Mn) in amount of at least 0.005 wt %, and additional elements, the remaining wt % being Al and incidental impurities.

公开(公告)号：US10447834B2

公开(公告)日：2019-10-15

申请号：US15606920

申请日：2017-05-26

Applicant: Apple Inc.

Inventor： Abhijeet Misra ,  Steven J. Osborne ,  Ian A. Spraggs ,  Marwan Rammah ,  William A. Counts

IPC: H05K5/00 ,  H04M1/18 ,  G06F1/16 ,  H04M1/02

Abstract: Embodiments are directed to an enclosure for an electronic device. In one aspect, an embodiment includes an enclosure having an enclosure component and an internal component that may be affixed along a bonding region. The enclosure component may be formed from an enclosure material and defines an exterior surface of the enclosure and an opening configured to receive a display. The internal component may be formed from a metal material different than the enclosure material. The bonding region may include an interstitial material that has a melting temperature that is less than a melting temperature of either one of the enclosure material or the metal material. The bonding region may also include one or more of the enclosure material or the metal material.

公开(公告)号：US09970080B2

公开(公告)日：2018-05-15

申请号：US14927225

申请日：2015-10-29

Applicant: Apple Inc.

Inventor： James A. Curran ,  William A. Counts ,  Abhijeet Misra

IPC: B32B9/00 ,  F01C21/00 ,  B21B1/46 ,  C22C1/06 ,  C22C21/10 ,  C25D11/06 ,  C25D11/16 ,  C25D11/14 ,  C25D11/24

CPC classification number: C22C1/06 ,  C22C21/10 ,  C25D11/06 ,  C25D11/14 ,  C25D11/16 ,  C25D11/243

Abstract: Micro additions of certain elements such as zirconium or titanium are added to high strength aluminum alloys to counter discoloring effects of other micro-alloying elements when the high strength alloys are anodized. The other micro-alloying elements are added to increase the adhesion of an anodic film to the aluminum alloy substrate. However, these micro-alloying elements can also cause slight discoloration, such as a yellowing, of the anodic film. Such micro-alloying elements that can cause discoloration can include copper, manganese, iron and silver. The micro additions of additional elements, such as one or more of zirconium, tantalum, molybdenum, hafnium, tungsten, vanadium, niobium and tantalum, can dilute the discoloration of the micro-alloying elements. The resulting anodic films are substantially colorless.