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    Mold materials for formed ceramic
    2.
    发明授权
    Mold materials for formed ceramic 有权

    公开(公告)号：US11207795B1

    公开(公告)日：2021-12-28

    申请号：US16137434

    申请日：2018-09-20

    Applicant: Apple Inc.

    Inventor： Jeffrey L. Mattlin ,  Abhijeet Misra ,  Herng-Jeng Jou ,  James A. Wright ,  James A. Yurko ,  Lei Gao ,  Weiming Huang ,  William A. Counts

    IPC: B28B7/36 ,  B29C43/32

    Abstract: A mold apparatus to form a ceramic (or glass) includes a first mold portion having a first coefficient of thermal expansion and a second mold portion having a second coefficient of thermal expansion. In some embodiments, the first mold portion and/or the second mold portion are substantially immiscible with the ceramic material, such as silicon oxide, at a temperature greater than 600° C. In some embodiments, the first coefficient of thermal expansion and the second coefficient of thermal expansion are substantially similar to that of the glass or ceramic material. In some embodiments, the first coefficient of thermal expansion is different from the second coefficient of thermal expansion. In some embodiments, the first mold portion and the second mold portion contain a surface coating and a passivation layer.

    Cladded metal structures for dissipation of heat in a portable electronic device
    3.
    发明授权
    Cladded metal structures for dissipation of heat in a portable electronic device 有权

    公开(公告)号：US10856443B2

    公开(公告)日：2020-12-01

    申请号：US16407011

    申请日：2019-05-08

    Applicant: Apple Inc.

    Inventor： William A. Counts ,  Abhijeet Misra ,  Nagarajan Kalyanasundaram ,  James A. Yurko

    IPC: H05K7/20 ,  H05K5/04

    Abstract: This application relates to an enclosure for a portable electronic device is described. The enclosure can include metal bands included along the enclosure and a support structure. The support structure can include a thermally conductive core that is capable of conducting thermal energy generated by the operational components and rails that are bound between the metal bands and the thermally conductive core, where the rails are characterized as having a rate of thermal conductivity that is less than a rate of thermal conductivity of the thermally conductive core so that the thermal energy generated by the operational component is directed away from the operational component and away from the metal bands.

    Radio-frequency transparent window
    8.
    发明授权
    Radio-frequency transparent window 有权
    射频透明窗口

    公开(公告)号：US09300036B2

    公开(公告)日：2016-03-29

    申请号：US13913382

    申请日：2013-06-07

    Applicant: Apple Inc.

    Inventor： Abhijeet Misra ,  Brian S. Tryon ,  Charles J. Kuehmann ,  Stephen B. Lynch ,  James A. Wright

    IPC: H01Q1/24 ,  H01Q1/42

    CPC classification number: H01Q1/42 ,  H01Q1/243 ,  H01Q1/44

    Abstract: A patch for a device in an electronic housing including an aluminum layer having a threshold thickness, a non-conductive layer on a first side of the aluminum layer, and a radio-frequency (RF) transparent layer on a second side of the aluminum layer is provided. A method for manufacturing an antenna window including a patch as above is also provided, the method including determining a thickness of the aluminum layer adjacent to an anodized aluminum layer. A method for manufacturing an antenna window including coating an aluminum layer having a threshold thickness on a radio-frequency (RF) transparent layer to form an RF transparent laminate is also provided. A method for manufacturing an antenna window including removing a thickness of aluminum is also provided. A method for manufacturing an antenna window including disposing a mask on an aluminum substrate and anodizing the aluminum substrate to a selected thickness is also provided.

    Abstract translation: 一种用于电子外壳中的装置的贴片，包括具有阈值厚度的铝层，在铝层的第一侧上的非导电层和在铝层的第二侧上的射频（RF）透明层 被提供。 还提供了一种用于制造包括如上所述的贴片的天线窗的方法，所述方法包括确定与阳极化铝层相邻的铝层的厚度。 还提供一种用于制造天线窗的方法，包括在射频（RF）透明层上涂覆具有阈值厚度的铝层以形成RF透明层压板。 还提供了一种用于制造包括去除铝厚度的天线窗的方法。 还提供了一种制造天线窗的方法，包括在铝基板上设置掩模并将铝基板阳极氧化至所选择的厚度。

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