公开(公告)号：US09953851B2

公开(公告)日：2018-04-24

申请号：US15207226

申请日：2016-07-11

Applicant: Applied Materials, Inc.

Inventor： Jiping Li ,  Aaron Muir Hunter ,  Bruce E. Adams ,  Kim Vellore ,  Samuel C. Howells ,  Stephen Moffatt

IPC: H01L21/00 ,  H01L21/20 ,  H01L21/36 ,  H01L21/26 ,  H01L21/42 ,  H01L21/44 ,  H01L21/67 ,  H01L21/268 ,  B23K26/00 ,  B23K26/03 ,  B23K26/0622 ,  B23K26/066 ,  H01L21/324 ,  B23K101/40

CPC classification number: H01L21/67115 ,  B23K26/009 ,  B23K26/034 ,  B23K26/0622 ,  B23K26/066 ,  B23K26/352 ,  B23K2101/40 ,  H01L21/268 ,  H01L21/324

Abstract: Embodiments described herein relate to apparatus and methods of thermal processing. More specifically, apparatus and methods described herein relate to laser thermal treatment of semiconductor substrates by increasing the uniformity of energy distribution in an image at a surface of a substrate.

公开(公告)号：US09390926B2

公开(公告)日：2016-07-12

申请号：US14159228

申请日：2014-01-20

Applicant: Applied Materials, Inc.

Inventor： Jiping Li ,  Aaron Muir Hunter ,  Bruce E. Adams ,  Kim Vellore ,  Samuel C. Howells ,  Stephen Moffatt

IPC: H01L21/00 ,  H01L21/268 ,  B23K26/00 ,  B23K26/03 ,  H01L21/20 ,  H01L21/26 ,  H01L21/36 ,  H01L21/42 ,  H01L21/44

CPC classification number: H01L21/67115 ,  B23K26/009 ,  B23K26/034 ,  B23K26/0622 ,  B23K26/066 ,  B23K26/352 ,  B23K2101/40 ,  H01L21/268 ,  H01L21/324

Abstract: Embodiments described herein relate to apparatus and methods of thermal processing. More specifically, apparatus and methods described herein relate to laser thermal treatment of semiconductor substrates by increasing the uniformity of energy distribution in an image at a surface of a substrate.

Abstract translation: 本文所述的实施例涉及热处理的装置和方法。 更具体地，本文所述的装置和方法涉及通过增加基板表面上的图像中的能量分布的均匀性来对半导体基板进行激光热处理。

公开(公告)号：US12078547B2

公开(公告)日：2024-09-03

申请号：US17487993

申请日：2021-09-28

Applicant: Applied Materials, Inc.

Inventor： Bruce E. Adams ,  Samuel C. Howells ,  Alvaro Garcia ,  Barry P. Craver ,  Tony Jefferson Gnanaprakasa ,  Lei Lian

IPC: G01J5/58 ,  H01J37/32 ,  H01L21/66

CPC classification number: G01J5/58 ,  H01J37/32522 ,  H01L22/12 ,  G01J2005/583 ,  H01J2237/24585 ,  H01J2237/334

Abstract: A method and apparatus for determining the temperature of a substrate within a processing chamber are described herein. The methods and apparatus described herein utilize an etalon assembly and a heterodyning effect to determine a first temperature of a substrate. The first temperature of the substrate is determined without physically contacting the substrate. A separate temperature sensor also measures a second temperature of the substrate and/or the substrate support at a similar location. The first temperature and the second temperature are utilized to calibrate one of the temperature sensors disposed within the substrate support, a model of the processes performed within the processing chamber, or to adjust a process parameter of the process performed within the processing chamber.

公开(公告)号：US10948353B2

公开(公告)日：2021-03-16

申请号：US16741907

申请日：2020-01-14

Applicant: Applied Materials, Inc.

Inventor： Lara Hawrylchak ,  Samuel C. Howells ,  Wolfgang R. Aderhold ,  Leonid M. Tertitski ,  Michael Liu ,  Dongming Iu ,  Norman L. Tam ,  Ji-Dih Hu

IPC: G01J5/00 ,  H01L21/324 ,  G05D23/19 ,  H01L21/66 ,  H05B1/02 ,  G01J5/60 ,  H01L21/687 ,  H05B3/00 ,  H01L21/67

Abstract: Examples described herein generally relate to apparatus and methods for rapid thermal processing (RTP) of a substrate. In one or more embodiments, a process chamber includes chamber body, a window disposed on a first portion of the chamber body, a chamber bottom, and a shield disposed on a second portion of the chamber body. The shield has a flat surface facing the window to reduce reflected radiant energy to a back side of a substrate disposed in the process chamber during operation. The process chamber further includes an edge support for supporting the substrate and a cooling member disposed on the chamber bottom. The cooling member is disposed in proximity of the edge support to cool the edge support during low temperature operation in order to improve the temperature uniformity of the substrate.

公开(公告)号：US10281335B2

公开(公告)日：2019-05-07

申请号：US15656662

申请日：2017-07-21

Applicant: Applied Materials, Inc.

Inventor： Samuel C. Howells

IPC: G01J5/08 ,  G01J5/20 ,  H05B3/00 ,  H01L21/67 ,  H01L33/00

Abstract: Examples described herein generally relate to apparatus and methods for rapid thermal processing (RTP) of a substrate. The present disclosure discloses pulsed radiation sources, used to measure a broad range of low to high temperatures in the RTP chamber. In one example, two or more lasers, one of which emits pulses of radiation at 1,030 nm and one of which emits pulses of radiation at 1,080 nm, which measures temperatures below about 200° C., are used. In another example, two or more LEDs, one of which emits pulses of radiation at 1,030 nm and one of which emits pulses of radiation at 1,080 nm, are used. In yet another example, a broadband radiation source is used to emit pulses of radiation at least at 1,030 nm and 1,080 nm. These radiation sources are useful for detection of a broad range of low to high temperatures in the RTP chamber.

公开(公告)号：US09927622B2

公开(公告)日：2018-03-27

申请号：US15003996

申请日：2016-01-22

Applicant: Applied Materials, Inc.

Inventor： Stephen Moffatt ,  Douglas E. Holmgren ,  Samuel C. Howells ,  Edric Tong ,  Bruce E. Adams ,  Jiping Li ,  Aaron Muir Hunter

IPC: G02B27/12 ,  G02B27/10 ,  G02B27/14 ,  G02B27/00 ,  G02B27/30 ,  G02B17/08

CPC classification number: G02B27/106 ,  G02B17/0888 ,  G02B27/0025 ,  G02B27/10 ,  G02B27/1006 ,  G02B27/12 ,  G02B27/123 ,  G02B27/126 ,  G02B27/14 ,  G02B27/143 ,  G02B27/30

Abstract: Apparatus and methods for combining beams of amplified radiation are disclosed. A beam combiner has a collimating optic positioned to receive a plurality of coherent radiation beams at a constant angle of incidence with respect to an optical axis of the collimating optic. The respective angles of incidence may also be different in some embodiments. The collimating optic has an optical property that collimates the beams. The optical property may be refractive or reflective, or a combination thereof. A collecting optic may also be provided to direct the plurality of beams to the collimating optic. The beam combiner may be used in a thermal processing apparatus to combine more than two beams of coherent amplified radiation, such as lasers, into a single beam.

公开(公告)号：US09908200B2

公开(公告)日：2018-03-06

申请号：US14480415

申请日：2014-09-08

Applicant: Applied Materials, Inc.

Inventor： Bruce E. Adams ,  Samuel C. Howells ,  Dean Jennings ,  Jiping Li ,  Timothy N. Thomas ,  Stephen Moffatt

IPC: B23K26/02 ,  B23K26/06 ,  B23K26/073 ,  B23K26/067 ,  G02B27/09 ,  B23K26/0622 ,  B23K103/00

CPC classification number: B23K26/073 ,  B23K26/0613 ,  B23K26/0622 ,  B23K26/067 ,  B23K26/0732 ,  B23K2103/56 ,  G02B27/0961

Abstract: The present invention generally relates to an optical system that is able to reliably deliver a uniform amount of energy across an anneal region contained on a surface of a substrate. The optical system is adapted to deliver, or project, a uniform amount of energy having a desired two-dimensional shape on a desired region on the surface of the substrate. Typically, the anneal regions may be square or rectangular in shape. Generally, the optical system and methods of the present invention are used to preferentially anneal one or more regions found within the anneal regions by delivering enough energy to cause the one or more regions to re-melt and solidify.

公开(公告)号：US20130112667A1

公开(公告)日：2013-05-09

申请号：US13649028

申请日：2012-10-10

Applicant: Applied Materials, Inc.

Inventor： Douglas E. Holmgren ,  Samuel C. Howells

IPC: B23K26/00

CPC classification number: B23K26/0648 ,  B23K26/00 ,  B23K26/0006 ,  B23K26/034 ,  B23K26/06 ,  B23K26/0626 ,  B23K26/082 ,  B23K26/0853 ,  B23K26/0876 ,  B23K2101/40 ,  B23K2103/56 ,  G02B27/09 ,  G02B27/0911 ,  G02B27/0961 ,  G02B27/0966 ,  G02B27/10 ,  H01L21/268 ,  H01L21/67115 ,  H01L24/80

Abstract: Embodiments of the invention provide an apparatus including a substrate support, a source of laser radiation emitting laser radiation along an optical path, and an illumination optics disposed along the optical path. The illumination optics includes a set of slow-axis and fast-axis lenses. The apparatus further includes a homogenizer disposed between of the illumination optics and the substrate support along the optical path. The homogenizer includes a first and a second micro-optic lenslet arrays of cylindrical lenses, wherein the second micro-optic lenslet array of cylindrical lenses has a relatively larger lenslet pitch than that of the first micro-optic lenslet array of cylindrical lenses, and lenslet axes of the first micro-optic lenslet array and lenslet axes of the second micro-optic lenslet array are oriented along an axis that is parallel to a fast axis of the source of laser radiation.

Abstract translation: 本发明的实施例提供了一种装置，包括基板支撑件，沿着光路发射激光辐射的激光辐射源，以及沿光路设置的照明光学器件。 照明光学器件包括一组慢轴和快轴透镜。 该装置还包括沿着光路设置在照明光学器件和衬底支撑件之间的均质器。 均化器包括柱面透镜的第一和第二微小透镜阵列阵列，其中柱面透镜的第二微小透镜小透镜阵列具有比第一微小透镜柱面透镜阵列更小的小透镜间距，以及透镜 第一微光学小透镜阵列的轴线和第二微小透镜阵列的小透镜轴线沿着平行于激光辐射源的快轴的轴线定向。

公开(公告)号：US20220093428A1

公开(公告)日：2022-03-24

申请号：US17026905

申请日：2020-09-21

Applicant: Applied Materials, Inc.

Inventor： Bruce E. Adams ,  Samuel C. Howells ,  Martin A. Hilkene ,  Jose Antonio Marin

IPC: H01L21/67 ,  H01J37/32 ,  H01J37/244 ,  C23C8/10 ,  C23C8/36

Abstract: Semiconductor processing systems are described to measure levels of atomic oxygen using an atomic oxygen sensor positioned within a substrate processing region of a substrate processing chamber. The processing systems may include a semiconductor chamber that has a chamber body which defines a substrate processing region. The processing chamber may also include a substrate support positioned within the substrate processing region. The atomic oxygen sensor may be positioned proximate to the substrate support in the substrate processing region of the chamber. Also described are semiconductor processing methods that include detecting a concentration of atomic oxygen in the substrate processing region with an atomic oxygen sensor positioned in the semiconductor processing chamber. The atomic oxygen sensor may include at least one electrode comprising a material selectively permeable to atomic oxygen over molecular oxygen, and may further include a solid electrolyte that selectively conducts atomic oxygen ions.

公开(公告)号：US10181409B2

公开(公告)日：2019-01-15

申请号：US14163309

申请日：2014-01-24

Applicant: Applied Materials, Inc.

Inventor： Stephen Moffatt ,  Douglas E. Holmgren ,  Samuel C. Howells ,  Edric Tong ,  Bruce E. Adams ,  Jiping Li ,  Aaron Muir Hunter

IPC: B23K26/00 ,  B23K26/04 ,  H01L21/477 ,  F27B5/14 ,  B23K26/354 ,  B23K26/03 ,  B23K26/06 ,  B23K26/08 ,  B23K26/12 ,  H01L21/268 ,  B23K26/0622 ,  B23K101/40 ,  B23K103/00 ,  H01S3/00

Abstract: An optical system that is able to reliably deliver a uniform amount of energy across an anneal region contained on a surface of a substrate. The optical system is adapted to deliver, or project, a uniform amount of energy having a desired two-dimensional shape on a desired region on the surface of the substrate. An energy source for the optical system is typically a plurality of lasers, which are combined to form the energy field.