公开(公告)号：EP2504274A1

公开(公告)日：2012-10-03

申请号：EP10787532.0

申请日：2010-11-22

Applicant: BAE Systems Plc.

Inventor： ELEY, Rebecka ,  HUCKER, Martyn John ,  STURLAND, Ian Michael

IPC: B81B3/00 ,  H01L41/09 ,  H01L41/22

CPC classification number: H02N2/043 ,  B81B3/0021 ,  B81B2201/032 ,  B81B2203/0109 ,  H01L41/0933 ,  H01L41/22

Abstract: A MEMS device, and method of fabrication thereof, comprising: a wall arranged as a closed loop(for example, comprising a plurality of interconnected lengths (11-18)); and a bridging portion (54) having two ends and an intermediate portion between these ends; the bridging portion (54) is connected at one end to a first portion of the wall and at the other end to a second portion of the wall non-contiguous to the first; whereby when the intermediate portion is displaced in a direction through a plane defined between the two ends, the portions of the wall connected to the bridging portion (54) are each displaced in a respective direction in the plane, and at least one further portion of the wall is displaced in a direction that is in the plane and that is different to the directions that the two portions connected to the bridging portion (54) are displaced in.

公开(公告)号：EP2126155B1

公开(公告)日：2019-03-13

申请号：EP07824741.8

申请日：2007-11-28

Applicant: BAE Systems PLC

Inventor： STURLAND, Ian Michael ,  HAWKE, Tracey Anne

IPC: C23C14/14 ,  C23C14/34 ,  B01J20/32 ,  G01C19/00 ,  G01C19/56

公开(公告)号：EP2126155A1

公开(公告)日：2009-12-02

申请号：EP07824741.8

申请日：2007-11-28

Applicant: BAE Systems PLC

Inventor： STURLAND, Ian Michael ,  HAWKE, Tracey Anne

IPC: C23C14/14 ,  C23C14/34 ,  B01J20/32 ,  G01C19/00 ,  G01C19/56

CPC classification number: G01C19/5684 ,  B01J20/02 ,  B01J20/28011 ,  B01J20/28026 ,  B01J20/28033 ,  B01J20/28035 ,  B01J20/28057 ,  B01J20/3204 ,  B01J20/3217 ,  B01J20/3236 ,  B01J20/3289 ,  B81B7/0038 ,  C23C14/16 ,  C23C14/34 ,  C23C14/54 ,  Y10T428/24942 ,  Y10T428/24992

Abstract: Improved thin film getter devices (300, 500) comprise a layer (350, 550) of getter material deposited on a substrate (320, 520). The layer has a main portion (340, 540) and a cap portion (360, 560), which forms an external surface of the device. The cap portion has a lower specific area than the main portion.