公开(公告)号：WO2022003330A1

公开(公告)日：2022-01-06

申请号：PCT/GB2021/051632

申请日：2021-06-28

Applicant: BAE SYSTEMS PLC

Inventor： BALMOND, Mark David ,  STURLAND, Ian Michael ,  FIGGURES, Christopher Colin

IPC: G01N17/04 ,  G01N17/006 ,  G01N27/04

Abstract: A corrosion sensor (1) is described. The corrosion sensor (1) comprises a substrate (10) and a patterned conductive layer 20 provided on the substrate (10), wherein the conductive layer (20) defines: a common terminal (210); a set of terminals (220), including a first terminal (220A) and a second terminal (220B); and a set of sensing elements (230), including a first sensing element (230A) and a second sensing element (230B); wherein respective sensing elements (230A), (230B) of the set (230) thereof are electrically coupled to the common terminal (210) and to respective terminals (220A), (220B) of the set (220) thereof, such that the respective terminals (220A), (220B) of the set (220) thereof are specific to the respective sensing elements (230A), (230B) of the set (230) thereof.

公开(公告)号：WO2021240151A1

公开(公告)日：2021-12-02

申请号：PCT/GB2021/051277

申请日：2021-05-26

Applicant: BAE SYSTEMS PLC

Inventor： ELEY, Rebecka ,  BALMOND, Mark, David ,  FIGGURES, Christopher, Colin ,  STURLAND, Ian Michael ,  CHURCH, Simon Robert

IPC: G01N17/04

Abstract: Specimens for evaluating corrosion protection of substrates due, at least in part, to coatings applied thereupon are described. A specimen (1) comprises: a first coating (10), comprising a first set of layers (11) including a first layer (11A), on a first substrate (12); and a first set of perforations (100), including a first perforation (100A) and a second perforation (100B), in the first coating (10), wherein the first perforation (100A) has a first depth D1 through the first coating (10) and a first dimension W1 transverse to the first depth, wherein the second perforation (100B) has a second depth D2 through the first coating (10) and a second dimension W2 transverse to the second depth D2 and wherein the first dimension W1 and the second dimension W2 are different.

公开(公告)号：WO2011064569A1

公开(公告)日：2011-06-03

申请号：PCT/GB2010/051939

申请日：2010-11-22

Applicant: BAE SYSTEMS plc ,  ELEY, Rebecka ,  HUCKER, Martyn John ,  STURLAND, Ian Michael

Inventor： ELEY, Rebecka ,  HUCKER, Martyn John ,  STURLAND, Ian Michael

IPC: B81B3/00 ,  H01L41/09 ,  H01L41/22

CPC classification number: H02N2/043 ,  B81B3/0021 ,  B81B2201/032 ,  B81B2203/0109 ,  H01L41/0933 ,  H01L41/22

Abstract: A MEMS device, and method of fabrication thereof, comprising: a wall arranged as a closed loop(for example, comprising a plurality of interconnected lengths (11-18)); and a bridging portion (54) having two ends and an intermediate portion between these ends; the bridging portion (54) is connected at one end to a first portion of the wall and at the other end to a second portion of the wall non-contiguous to the first; whereby when the intermediate portion is displaced in a direction through a plane defined between the two ends, the portions of the wall connected to the bridging portion (54) are each displaced in a respective direction in the plane, and at least one further portion of the wall is displaced in a direction that is in the plane and that is different to the directions that the two portions connected to the bridging portion (54) are displaced in.

Abstract translation: MEMS器件及其制造方法，包括：布置为闭环（例如，包括多个互连长度（11-18））的壁; 以及桥接部分（54），其具有两个端部和在这些端部之间的中间部分; 桥接部分（54）在一端连接到壁的第一部分，而另一端连接到不与第一部分邻接的壁的第二部分; 由此当中间部分沿着穿过限定在两端之间的平面的方向移位时，连接到桥接部分（54）的壁的部分各自在平面中的相应方向上移位，并且至少另外一部分 壁在平面内的方向上移位，并且不同于连接到桥接部分（54）的两个部分移位的方向。

公开(公告)号：WO2011064568A1

公开(公告)日：2011-06-03

申请号：PCT/GB2010/051936

申请日：2010-11-22

Applicant: BAE SYSTEMS PLC ,  HUCKER, Martyn John ,  STURLAND, Ian Michael ,  ELEY, Rebecka

Inventor： HUCKER, Martyn John ,  STURLAND, Ian Michael ,  ELEY, Rebecka

IPC: B81B3/00 ,  H01L41/09 ,  H01L41/22

CPC classification number: H01L41/313 ,  B81B3/0021 ,  B81B2201/032 ,  B81B2203/0118 ,  B81B2203/051 ,  H01L41/096

Abstract: A MEMS device (e.g. a piezoelectric actuator), and method of fabrication thereof, having a moveable portion comprising a layer of material (6) (e.g. a substrate layer formed from a substrate wafer) having relatively low rigidity in a direction in the plane of a surface of the layer of material (6), and relatively high rigidity in a direction through the plane; wherein the relatively low rigidity is provided by ridges and grooves (60) in a further surface of the layer of material (6), the further surface of the material (6) being substantially perpendicular to the direction in the plane. The MEMS device may comprise a layer of piezoelectric material (2) bonded to the surface of the layer of material (6). Actuation of the MEMS device (e.g. actuation in the plane of the surface of the layer of material (6)) may be performed by applying an electrical field across the piezoelectric material.

Abstract translation: MEMS器件（例如压电致动器）及其制造方法具有可移动部分，该可移动部分包括材料层（6）（例如，由衬底晶片形成的衬底层），该材料层在 材料层（6）的表面，并且在穿过该平面的方向上具有相对高的刚性; 其中相对较低的刚度由在所述材料层（6）的另一表面中的脊和槽（60）提供，所述材料（6）的另一表面基本上垂直于所述平面中的方向。 MEMS器件可以包括结合到材料层（6）的表面的压电材料层（2）。 可以通过在压电材料上施加电场来执行MEMS装置的致动（例如，材料层（6）的表面的平面中的致动）。

公开(公告)号：WO2011045583A1

公开(公告)日：2011-04-21

申请号：PCT/GB2010/051674

申请日：2010-10-07

Applicant: BAE SYSTEMS PLC ,  WARSOP, Clyde ,  DAVIES, Alan Geraint ,  HOLDEN, Harriet, Ann ,  STURLAND, Ian Michael

Inventor： WARSOP, Clyde ,  DAVIES, Alan Geraint ,  HOLDEN, Harriet, Ann ,  STURLAND, Ian Michael

IPC: G01K13/02

CPC classification number: G01K13/02 ,  G01K13/028

Abstract: A total air temperature sensing device is disclosed. The device includes a conduit through which an air flow can be maintained; a cross member housed in the conduit and having a leading edge which is profiled so as to bring a portion of the air flow to rest at a stagnation region on the cross member; at least one temperature sensor disposed in or near to the stagnation region; and a sensor interrogation system for measuring the temperature sensed by the temperature sensor and interpreting the measured temperature in order to derive a total air temperature. A corresponding method of sensing total air temperature is also disclosed.

Abstract translation: 公开了一种总的空气温度感测装置。 该装置包括可以保持空气流的导管; 横向构件，其容纳在所述导管中并且具有前缘，所述前缘被成型为使得所述空气流的一部分在所述横向构件上的停滞区域处停放; 设置在停滞区域内或其附近的至少一个温度传感器; 以及传感器询问系统，用于测量由温度传感器感测的温度并解释测量的温度，以得出总的空气温度。 还公开了一种相应的感测总空气温度的方法。

公开(公告)号：EP4172593A1

公开(公告)日：2023-05-03

申请号：EP21740175.1

申请日：2021-06-28

Applicant: BAE SYSTEMS plc

Inventor： STURLAND, Ian Michael ,  FIGGURES, Christopher Colin

IPC: G01N17/04

公开(公告)号：EP2504273B1

公开(公告)日：2016-01-27

申请号：EP10785498.6

申请日：2010-11-22

Applicant: BAE Systems PLC

Inventor： HUCKER, Martyn John ,  STURLAND, Ian Michael ,  ELEY, Rebecka

IPC: B81B3/00 ,  H01L41/09 ,  H01L41/313

CPC classification number: H01L41/313 ,  B81B3/0021 ,  B81B2201/032 ,  B81B2203/0118 ,  B81B2203/051 ,  H01L41/096

Abstract: A MEMS device (e.g. a piezoelectric actuator), and method of fabrication thereof, having a moveable portion comprising a layer of material (6) (e.g. a substrate layer formed from a substrate wafer) having relatively low rigidity in a direction in the plane of a surface of the layer of material (6), and relatively high rigidity in a direction through the plane; wherein the relatively low rigidity is provided by ridges and grooves (60) in a further surface of the layer of material (6), the further surface of the material (6) being substantially perpendicular to the direction in the plane. The MEMS device may comprise a layer of piezoelectric material (2) bonded to the surface of the layer of material (6). Actuation of the MEMS device (e.g. actuation in the plane of the surface of the layer of material (6)) may be performed by applying an electrical field across the piezoelectric material.

公开(公告)号：EP2504274B1

公开(公告)日：2016-04-20

申请号：EP10787532.0

申请日：2010-11-22

Applicant: BAE Systems PLC

Inventor： ELEY, Rebecka ,  HUCKER, Martyn John ,  STURLAND, Ian Michael

IPC: B81B3/00 ,  H01L41/09 ,  H01L41/22

CPC classification number: H02N2/043 ,  B81B3/0021 ,  B81B2201/032 ,  B81B2203/0109 ,  H01L41/0933 ,  H01L41/22

Abstract: A MEMS device, and method of fabrication thereof, comprising: a wall arranged as a closed loop(for example, comprising a plurality of interconnected lengths (11-18)); and a bridging portion (54) having two ends and an intermediate portion between these ends; the bridging portion (54) is connected at one end to a first portion of the wall and at the other end to a second portion of the wall non-contiguous to the first; whereby when the intermediate portion is displaced in a direction through a plane defined between the two ends, the portions of the wall connected to the bridging portion (54) are each displaced in a respective direction in the plane, and at least one further portion of the wall is displaced in a direction that is in the plane and that is different to the directions that the two portions connected to the bridging portion (54) are displaced in.

公开(公告)号：EP2504273A1

公开(公告)日：2012-10-03

申请号：EP10785498.6

申请日：2010-11-22

Applicant: BAE Systems Plc.

Inventor： HUCKER, Martyn John ,  STURLAND, Ian Michael ,  ELEY, Rebecka

IPC: B81B3/00 ,  H01L41/09 ,  H01L41/22

CPC classification number: H01L41/313 ,  B81B3/0021 ,  B81B2201/032 ,  B81B2203/0118 ,  B81B2203/051 ,  H01L41/096

Abstract: A MEMS device (e.g. a piezoelectric actuator), and method of fabrication thereof, having a moveable portion comprising a layer of material (6) (e.g. a substrate layer formed from a substrate wafer) having relatively low rigidity in a direction in the plane of a surface of the layer of material (6), and relatively high rigidity in a direction through the plane; wherein the relatively low rigidity is provided by ridges and grooves (60) in a further surface of the layer of material (6), the further surface of the material (6) being substantially perpendicular to the direction in the plane. The MEMS device may comprise a layer of piezoelectric material (2) bonded to the surface of the layer of material (6). Actuation of the MEMS device (e.g. actuation in the plane of the surface of the layer of material (6)) may be performed by applying an electrical field across the piezoelectric material.

公开(公告)号：EP4158310A1

公开(公告)日：2023-04-05

申请号：EP21730273.6

申请日：2021-05-26

Applicant: BAE SYSTEMS plc

Inventor： ELEY, Rebecka ,  BALMOND, Mark, David ,  FIGGURES, Christopher, Colin ,  STURLAND, Ian Michael ,  CHURCH, Simon Robert

IPC: G01N17/04