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公开(公告)号：DE10325243A1
公开(公告)日：2004-12-23
申请号：DE10325243
申请日：2003-06-03
Applicant: BASF AG
Inventor： STERZEL HANS-JOSEF , WITTENBECHER LARS , DECK PATRICK
Abstract: Process for depositing copper layers on a substrate comprises contacting the substrate with a compound consisting of copper-II-formate and alkoxyalkylamines of formula: R1O(CH2)nCHR2NH2 (where R1 = methyl or ethyl; R2 = hydrogen or methyl; and n = 1-4) at 80-200[deg] C and 0.1-5 bar. An independent claim is also included for a mixture containing compounds consisting of copper-II-formate and the above alkoxyalkylamines.
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