中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

8 records (took 0.021 seconds)

    Deposition of copper on substrate
    1.
    发明专利
    Deposition of copper on substrate 审中-公开
    铜基沉积在基材上

    公开(公告)号：JP2005002471A

    公开(公告)日：2005-01-06

    申请号：JP2004164244

    申请日：2004-06-02

    Applicant: Basf Ag ,  ビーエーエスエフ アクチェンゲゼルシャフト

    Inventor： STERZEL HANS-JOSEF DR ,  WITTENBECHER LARS ,  DECK PATRICK

    IPC: C09K3/16 ,  C09D1/00 ,  C23C18/08 ,  H05K3/10

    CPC classification number: B22F1/025 ,  B22F9/026 ,  C23C18/08 ,  H05K3/105 ,  H05K2203/1105 ,  H05K2203/121

    Abstract: PROBLEM TO BE SOLVED: To provide a method for depositing copper layers on substrates without the aid of an electroless plating method and a dispersion liquid method including metallic particulates.
    SOLUTION: The copper layers are deposited on the substrates by bringing the substrate into contact with a product mixture composed of copper (II) formate and alkoxyalkylamines of formula I: R
    1 -O-(CH
    2 )
    n -CHR
    2 -NH
    2 (R
    1 is methyl or ethyl, R
    2 is hydrogen or methyl and n is 1, 2, 3 or 4) at 80-200°C and under a pressure of 0.1-5 bar.
    COPYRIGHT: (C)2005,JPO&NCIPI

    Abstract translation: 要解决的问题：提供一种无需化学镀方法和包括金属微粒的分散液体方法在基板上沉积铜层的方法。 解决方案：通过使基板与由式I的（II）甲酸盐和式I的烷氧基烷基胺组成的产物混合物与底物沉积在基底上：R 1 SP （R SP）2 乙基，R 2 SP 2是氢或甲基，n是1,2,3或4）在80-200℃和0.1-5巴的压力下进行。 版权所有（C）2005，JPO＆NCIPI

    COPPER (I) FORMATE COMPLEXES
    3.
    发明申请
    COPPER (I) FORMATE COMPLEXES 审中-公开
    铜（I）甲

    公开(公告)号：WO2005058789A3

    公开(公告)日：2005-12-08

    申请号：PCT/EP2004014275

    申请日：2004-12-15

    Applicant: BASF AG ,  WITTENBECHER LARS ,  LANG HEINRICH ,  SHEN YINGZHONG

    Inventor： WITTENBECHER LARS ,  LANG HEINRICH ,  SHEN YINGZHONG

    IPC: C07C53/06 ,  C07F1/00 ,  C07F1/08 ,  C07F9/50 ,  C23C16/18 ,  C23C18/08 ,  C23C18/12 ,  C23C16/00

    CPC classification number: C23C18/1216 ,  C07F1/005 ,  C07F9/5045 ,  C23C16/18 ,  C23C18/08

    Abstract: Copper (I) formate complexes of general formula LnCu(HCOO) . x COOH are decomposed in order to separate metallic copper, wherein x is a number from 0 to 10, n amounts to, 2, 3 or 4 and the n ligands L represent, independent of one another, one of the following ligands: a phosphane of formula R R R P; a phosphite of formula (R O)(R O)(R O)P; an isocyanide of formula R -NC; an alkene of general formula R R C=CR R ; or an alkyne of general formula R C=CR ; wherein R , R , R and R represent, independent of one another, hydrogen, a linear or branched, optionally partly or fully fluorinated alkyl, aminoalkyl, alkyoxialkyl, hydroxialkyl, phosphinoalkyl or aryl radical having up to 20 carbon atoms, with the exception of triphenylphosphino-copper (I) formate and 1,1,1-tris(diphenylphosphinomethyl)ethane-copper (I) formate.

    Abstract translation: 通式LnCu（HCOO）的铜（I）甲酸盐。 X HCOOH，其中x是一个从0到10，n是1，2，3或4，并且各自表示下面的配位体的一个n配位体L各自独立地为：式R <1>的膦 - [R <2> [R < 3> P： 下式的亚磷酸酯（R <1> O）（R <2> O）（R <3> 0）P; 式R的异氰化物<1> -N-C; 式R <1> R的烯烃<2> C = CR <3> [R <4>; 或通式R的炔<1> C = CR <2>; 其中R <1>，R <2>，R <3>和R <4>独立地是氢，直链或支链的，任选地部分或完全氟化的烷基，氨基烷基，Alkyoxialkyl-，羟基烷基，或芳基Phosphinoalkyl- 与平均至多20个碳原子; 除三苯基膦 - 铜（I）的甲酸盐和1,1,1-三（二苯基膦基）乙烷 - 铜（I）酸盐; 被分解为金属铜的沉积。

    4.
    发明专利
    未知

    公开(公告)号：DE10360046A1

    公开(公告)日：2005-07-21

    申请号：DE10360046

    申请日：2003-12-18

    Applicant: BASF AG

    Inventor： WITTENBECHER LARS ,  LANG HEINRICH ,  SHEN YINGZHONG

    IPC: C07C53/06 ,  C07F1/00 ,  C07F1/08 ,  C07F9/50 ,  C23C16/18 ,  C23C18/08 ,  C23C18/12 ,  C07F9/141 ,  C07C47/04 ,  C07C53/02 ,  C07C265/00 ,  C03C17/10

    Abstract: Copper (I) formate complexes of general formula LnCu(HCOO).x COOH are decomposed in order to separate metallic copper, wherein x is a number from 0 to 10, n amounts to, 2, 3 or 4 and the n ligands L represent, independent of one another, one of the following ligands: a phosphane of formula R1R2R3P; a phosphite of formula (R1O)(R2O)(R3O)P; an isocyanide of formula R1—NC; an alkene of general formula R1R2C═CR3R4; or an alkyne of general formula R1C═CR2; wherein R1, R2, R3 and R4 represent, independent of one another, hydrogen, a linear or branched, optionally partly or fully fluorinated alkyl, aminoalkyl, alkyoxialkyl, hydroxialkyl, phosphinoalkyl or aryl radical having up to 20 carbon atoms, with the exception of triphenylphosphino-copper (I) formate and 1,1,1-tris(diphenylphosphinomethyl)ethane-copper (I) formate.

    5.
    发明专利
    未知

    公开(公告)号：DE10325243A1

    公开(公告)日：2004-12-23

    申请号：DE10325243

    申请日：2003-06-03

    Applicant: BASF AG

    Inventor： STERZEL HANS-JOSEF ,  WITTENBECHER LARS ,  DECK PATRICK

    IPC: C09K3/16 ,  C09D1/00 ,  C23C18/08 ,  H05K3/10 ,  C23C18/38

    Abstract: Process for depositing copper layers on a substrate comprises contacting the substrate with a compound consisting of copper-II-formate and alkoxyalkylamines of formula: R1O(CH2)nCHR2NH2 (where R1 = methyl or ethyl; R2 = hydrogen or methyl; and n = 1-4) at 80-200[deg] C and 0.1-5 bar. An independent claim is also included for a mixture containing compounds consisting of copper-II-formate and the above alkoxyalkylamines.

    6.
    发明专利
    未知

    公开(公告)号：DE102005057715A1

    公开(公告)日：2007-06-06

    申请号：DE102005057715

    申请日：2005-12-02

    Applicant: BASF AG

    Inventor： SCHERHAG GUNTER ,  WITTENBECHER LARS

    IPC: C07C239/10 ,  C07C209/60

    Abstract: A process for preparing N,N-dihydrocarbylhydroxylamines of the general formula (I) where R 1 , R 2 , R 3 and R 4 are selected independently from among hydrogen, aliphatic, cycloaliphatic, heteroaromatic and aromatic radicals, or R 1 and R 2 and/or R 3 and R 4 are joined to form a ring, and not more than one radical among R 1 , R 2 , R 3 and R 4 is hydrogen, which comprises the steps a) reaction of hydroxylamine H 2 NOH or a salt of hydroxylamine with a compound of the general formula (II) or (III) where R 1 , R 2 , R 3 and R 4 are as defined in formula (I), b) hydrogenation of the compound formed in step a) in the presence of a catalyst, c) further reaction of the compound formed in step b) with a compound of the general formula (II) or (III) and hydrogenation of the reaction mixture in the presence of a catalyst and d), if appropriate, reaction of the salt of the dihydrocarbylhydroxylamine formed in step c) with a base.

    CATALYST FOR CURING EPOXIDES
    7.
    发明专利
    CATALYST FOR CURING EPOXIDES 未知

    公开(公告)号：CA2690295A1

    公开(公告)日：2008-12-18

    申请号：CA2690295

    申请日：2008-06-06

    Applicant: BASF AG

    Inventor： DEGEN GEORG ,  MAASE MATTHIAS ,  WITTENBECHER LARS ,  DOERING MANFRED ,  ARNOLD ULRICH

    IPC: C08G59/00 ,  C08G59/68 ,  C08L63/00

    Abstract: The invention relates to the use of 1, 3 substituted imidazolium salts of the formula (I), R1 and R3 independently representing an organic group having 1 to 20 C atoms, R2, R4, and R5 independently representing a H atom or an organic group having 1 to 20 C atoms, R4 and R5 also together being able to form an aliphatic or aromatic ring, X representing an anion having a pK B value of less than 13 (measured at 25°C, 1 bar in water or dimethylsulfoxide), and n representing 1, 2 or 3, where 1-ethyl-2,3-dimethylimidazolium acetate and 1-ethyl-2,3-dimethylimidazoliumacetate-acetic acid complex are excluded as the imidazolium salt, as a latent catalyst for curing compositions comprising epoxy compounds.

Patent Agency Ranking