公开(公告)号：DE3724055A1

公开(公告)日：1989-02-02

申请号：DE3724055

申请日：1987-07-21

Applicant: BASF AG

Inventor： EISENBARTH PHILIPP DR ,  FRANZ LOTHAR DR

IPC: C08G73/00 ,  C03C17/32 ,  C08F222/40 ,  C08G65/40 ,  C08G73/12

Abstract: The resins contain a bismaleimide of the formula … … where R and R' are hydrogen, methyl or phenyl.

公开(公告)号：DE59003522D1

公开(公告)日：1993-12-23

申请号：DE59003522

申请日：1990-08-28

Applicant: BASF AG

Inventor： EISENBARTH PHILIPP DR ,  PETER ROLAND DR ,  FOLDA THOMAS DR

IPC: C08F222/40 ,  C08G73/12 ,  C08J5/24 ,  C08L79/08

Abstract: Heat-curable bismaleimide resins containing an aromatic alkenyl compound, preferably o,o'-diallylbisphenol A, and a Lewis acid as an additive for prolonging the pot life at elevated temperatures are suitable for impregnating reinforcing fibers, rovings so impregnated having a prolonged gel time and being usable for fabrication of wound structures.

公开(公告)号：DE3879304D1

公开(公告)日：1993-04-22

申请号：DE3879304

申请日：1988-07-12

Applicant: BASF AG

Inventor： EISENBARTH PHILIPP DR ,  FRANZ LOTHAR DR

IPC: C08G73/00 ,  C03C17/32 ,  C08F222/40 ,  C08G65/40 ,  C08G73/12

Abstract: New thermosetting bismaleimide resins contain a bismaleimide (I) and 5-100wt.% comonomer (II) w.r.t. (I). The novelty is that (I) contains at least 1(wt.)% bis-(maleimidophenoxy) benzene of formula (IA) where R and R' = H, Me or Ph. (II) can be polyamines, polyphenols, alkenylphenols, alkenylphenol ethers, aminophenols, vinyl cpds. or allyl cpds., esp. a bis(aminophenoxy)benzene of formula (IIA).

公开(公告)号：DE3835197A1

公开(公告)日：1990-04-19

申请号：DE3835197

申请日：1988-10-15

Applicant: BASF AG

Inventor： PETER ROLAND DR ,  HOLOCH JAN DR ,  EISENBARTH PHILIPP DR

IPC: C08F299/00 ,  C08F290/00 ,  C08L63/10 ,  C08L67/07 ,  C08L79/08

公开(公告)号：DE3744389A1

公开(公告)日：1989-07-13

申请号：DE3744389

申请日：1987-12-29

Applicant: BASF AG

Inventor： EISENBARTH PHILIPP DR ,  DITTRICH UWE DR

IPC: C08F212/14 ,  C08F12/00 ,  C08F16/16 ,  C08F20/52 ,  C08F22/40 ,  C08F216/16 ,  C08F222/40 ,  C08G73/00 ,  C08G73/12

Abstract: The bismaleimide resins contain a bismaleimide of the formula in which X is -CH2-, -C6H4-CO2-CH2- or -C6H4-CO-NH-CH2-, X' is correspondingly -CH2-, -CH2-O2C-C6H4- or -CH2-NH-CO-C6H4-, and R and R' may be hydrogen, methyl or phenyl.

公开(公告)号：DE3622088A1

公开(公告)日：1988-01-07

申请号：DE3622088

申请日：1986-07-02

Applicant: BASF AG

Inventor： EISENBARTH PHILIPP DR ,  HESSE ANTON DR

IPC: C07D207/44 ,  C07D207/452 ,  C07D401/12 ,  C08G65/32 ,  C08G65/332 ,  C08G65/333 ,  C08G73/12 ,  C08L63/10 ,  C08L67/06 ,  C08L79/08 ,  C08G65/06

公开(公告)号：DE3604872A1

公开(公告)日：1987-08-20

申请号：DE3604872

申请日：1986-02-15

Applicant: BASF AG

Inventor： EISENBARTH PHILIPP DR ,  HEYM MANFRED DR ,  STUTZ HERBERT DR ,  SCHORNICK GUNNAR DR

IPC: C08F222/40 ,  C08G73/12 ,  C08J5/24 ,  C08G69/44 ,  C08G59/44

Abstract: In the process, a mixture of bismaleimide and aminophenol is heated in the presence of an amine as addition catalyst and in the presence of an inhibitor, vinyl or allyl monomers and, if desired, epoxy resins and peroxide initiators are added, and the mixture, as a melt, is applied to reinforcing fibres. The prepregs and semifinished products can be cured to form composite materials for the automotive and aerospace industries.

公开(公告)号：DE3769212D1

公开(公告)日：1991-05-16

申请号：DE3769212

申请日：1987-06-23

Applicant: BASF AG

Inventor： EISENBARTH PHILIPP DR ,  HESSE ANTON DR ,  HOLOCH JAN DR ,  PETER ROLAND DR

IPC: C07D207/44 ,  C07D207/452 ,  C07D401/12 ,  C08G65/32 ,  C08G65/332 ,  C08G65/333 ,  C08G73/12 ,  C08L63/10 ,  C08L67/06 ,  C08L79/08

公开(公告)号：DE4027385A1

公开(公告)日：1991-03-07

申请号：DE4027385

申请日：1990-08-30

Applicant: BASF AG

Inventor： EISENBARTH PHILIPP DR ,  GERTH DALE DR

IPC: C07C39/17 ,  C07C39/23 ,  C08F222/40 ,  C08G73/12 ,  H01B3/30

Abstract: Thermosetting bismaleimide moulding compsn. contains a bismaleimide and 1-100 wt.% 6,6'-dialkenyloxy- or dialkenyl-6,6'-dihydroxy-3,3,3',3' -tetramethyl-1,1'-spirobiindan of formula (I) as comonomer. In (I) one of R and R1 = 3-6C alkenyl and the other = H. USE/ADVANTAGE - The resin has good solubility and a relatively long gel time, facilitating conversion to semifinished prods. or mouldings. The cured mouldings have a very high Tg and good heat resistance. The resin is useful e.g. for insulating materials, structural components, housings for appts. and electrical pts. exposed to high temps.

公开(公告)号：DE3929386A1

公开(公告)日：1991-03-07

申请号：DE3929386

申请日：1989-09-05

Applicant: BASF AG

Inventor： EISENBARTH PHILIPP DR ,  PETER ROLAND DR ,  FOLDA THOMAS DR

IPC: C08F222/40 ,  C08G73/12 ,  C08J5/24 ,  C08L79/08

Abstract: Heat-curable bismaleimide resins containing an aromatic alkenyl compound, preferably o,o'-diallylbisphenol A, and a Lewis acid as an additive for prolonging the pot life at elevated temperatures are suitable for impregnating reinforcing fibers, rovings so impregnated having a prolonged gel time and being usable for fabrication of wound structures.