公开(公告)号：CA1120020A

公开(公告)日：1982-03-16

申请号：CA284649

申请日：1977-08-10

Applicant: BASF AG

Inventor： DIEM HANS ,  DUDECK CHRISTIAN ,  SIMMLER WERNER ,  MARQUARDT SIEGFRIED ,  STINGL WALTER

IPC: B01J23/50 ,  B01J37/16 ,  C07C45/38 ,  C07C47/055

Abstract: O.Z. 32,171 An improved process for the manufacture of silver catalysts, in which the silver is applied to conventional dimensionally stable and chemically inert carriers, eg. alumina or quartz moldings, preferably by electroless deposition from silver salt solutions onto a great variety of surfaces acting as carriers, by the use of suitable reducing agents. In a particular embodiment, a uniform deposition of silver and a dense and welladhering silver layer on the surface of the carrier are achieved by adding certain materials to the silver salt solutions.

公开(公告)号：DE3522470A1

公开(公告)日：1987-01-02

申请号：DE3522470

申请日：1985-06-22

Applicant: BASF AG

Inventor： MITULLA KONRAD DR ,  HAMBRECHT JUERGEN DR ,  MARQUARDT SIEGFRIED ,  BRANDT HERMANN DR ,  SCHMITT BURGHARD DR ,  GAUSEPOHL HERMANN DR ,  SIEBEL PETER DR ,  DREHER HERMANN DR

IPC: C02F1/68 ,  C02F9/00 ,  C08G65/46 ,  C02F1/42 ,  C02F1/46 ,  C02F1/62 ,  C08G65/44 ,  C08J11/02

公开(公告)号：DE1521152A1

公开(公告)日：1969-04-24

申请号：DE1521152

申请日：1965-07-16

Applicant: BASF AG

Inventor： DIEBOLD DR ADOLF ,  MARQUARDT SIEGFRIED ,  DOERR LUDWIG ,  LUDWIG RAICHLE DIPL ING

IPC: C08J7/04 ,  C09D175/04 ,  C23C18/20 ,  C25D5/56 ,  G11B5/702 ,  G11B5/72 ,  G11B5/73 ,  H01G13/06 ,  H05K3/18

Abstract: 1,149,033. Coating with metals. BADISCHE ANILIN - & SODA-FABRIK A. G. No. 31866/66. Headings C7B and C7F. In an electroless process for coating a plastics sheet with copper or silver in which the plastics surface is first coated with iron powder in a binder, the binder contains at least 20% by weight of a polyisocyanate. The binder may also include vinyl copolymers, polyvinyl chloride, acetal, formal or butyral or soluble polyamide. The coating may be applied through a stencil, and the powdered iron coating may be annealed at a temperature up to 60 ‹C. prior to deposition. A bath for depositing copper may comprise (g./l.) 150 copper sulphate, 40 triethanolamine, and 27 sulphuric acid. A silver layer may be deposited on the copper using a bath comprising 1À5 silver nitrate, 3 E.D.T.A., 3 sodium thiosulphate, and 2 tartaric acid. The copper surface may be electro-plated with a further layer of copper, using the same bath as for the electroless-plating, and then with Cr, Ni, Co or Rh, and the copper or silver surfaces may be electro-plated with Fe, Ni or Co or mixtures thereof.