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    14.
    发明专利
    未知

    公开(公告)号：DE4132264A1

    公开(公告)日：1993-04-01

    申请号：DE4132264

    申请日：1991-09-27

    Applicant: BASF AG

    Inventor： NIESSNER NORBERT DR ,  NEUMANN RAINER DR ,  RUPPMICH KARL ,  SEITZ FRIEDRICH DR ,  ZELTNER DORIS DR

    IPC: C08L25/08 ,  C08L35/00 ,  C08L43/00 ,  C08L43/02 ,  C08L51/00 ,  C08L51/04 ,  C08L51/06 ,  C08L69/00

    Abstract: A moulding composition containing, based on the total amount of A to E, A: 40-90% by weight of a halogen-free polycarbonate A, B: 5-40% by weight of at least one halogen-free graft polymer B built up from, based on B, B1: 40-80% by weight of an elastomer B1 having a glass transition temperature of below 0 DEG C, B2: 20-60% by weight of a graft shell B2 comprising, based on B2, B21: 40-98% by weight of styrene, alpha -methylstyrene, ring-substituted styrene and/or C1-C8-alkyl (meth)acrylate, B22: 50-1% by weight of (meth)acrylonitrile and/or maleic anhydride, B23: 1-50% by weight of an organic phosphorus compound of the formula (I) in which R is H or CH3, R and R are each, independently of one another, halogen-free C1-C8-alkyl or halogen-free C6-C20-aryl which is optionally substituted by halogen-free substituents, X , X and X are O, S or NR (where R is hydrogen or halogen-free C1-C8-alkyl), and n is from 0 to 10, C: 5-40% by weight of a halogen-free, thermoplastic copolymer C comprising, based on C, C1: from 50 to 95% by weight of styrene, alpha -alkylstyrene, ring-substituted styrene and/or C1-C8-alkyl (meth)acrylate (C1), C2: from 4 to 50% by weight of (meth)acrylonitrile C1-C8-alkyl (meth)acrylate and/or maleic anhydride (C2), C3: from 1 to 46% by weight of a halogen-free phosphorus compound of the formula (I), D: up to 20% by weight of a halogen-free phosphorus compound of the formula (II) in which R , R and R are each, independently of one another, halogen-free C1-C8-alkyl or halogen-free, unsubstituted or substituted C6-C20-aryl E: up to 5% by weight of a tetrafluoroethylene polymer having a mean particle size of from 0.05 to 20 mu m.

    Low-mol.wt. polyphenylene ether] moulding materials - contain impact-modified vinyl] aromatic polymer contg. rubber component, and opt. additives
    16.
    发明专利
    Low-mol.wt. polyphenylene ether] moulding materials - contain impact-modified vinyl] aromatic polymer contg. rubber component, and opt. additives 未知

    公开(公告)号：DE4209033A1

    公开(公告)日：1993-09-23

    申请号：DE4209033

    申请日：1992-03-20

    Applicant: BASF AG

    Inventor： SEELERT STEFAN DR ,  ZELTNER DORIS DR ,  WEISS ROBERT DR

    IPC: C08L51/04 ,  C08L65/00 ,  C08L71/12

    Abstract: Thermoplastic moulding materials (I) contain (A) 5-90 wt.% polyphenylene ether with Mw 800-30,000, (B) 5-90 wt.% impact-modified vinylaromatic polymer contg. 10-25 wt.% rubber component, and (C) 0-60 wt.% normal additives and processing aids. Pref. (A) has Mw 12,000-25,000. Pref., (A) is poly-(2,6-dimethyl-1,4-phenylene ether) (PPE) or a homologue thereof. (B) is high-impact polystyrene (HIPS) contg. 12-17 wt.% rubber, e.g. polybutadiene, polyisoprene etc. (C) can be different impact modifiers, fire retardants, pigments, etc. USE/ADVANTAGE - Used for the prodn. of fibres, film and moulded prods. (claimed). Provides thermoplastic HIPS/PPE moulding materials with good thermal dimensional stability and good multiaxial impact strength, combined with good adhesion to polyurethane (PU) foam, useful esp. for the prodn. of foam-backed dashboard supports etc. for cars.

    Low-molecular wt. polyphenylene ether] moulding materials - including impact-modified vinyl] aromatic polymer contg. soft component with D50 at least 3-5 microns
    17.
    发明专利
    Low-molecular wt. polyphenylene ether] moulding materials - including impact-modified vinyl] aromatic polymer contg. soft component with D50 at least 3-5 microns 未知

    公开(公告)号：DE4209032A1

    公开(公告)日：1993-09-23

    申请号：DE4209032

    申请日：1992-03-20

    Applicant: BASF AG

    Inventor： SEELERT STEFAN DR ,  ZELTNER DORIS DR ,  WEISS ROBERT DR

    IPC: C08L25/02 ,  C08L51/04 ,  C08L71/12

    Abstract: Thermoplastic moulding materials (I) are claimed, contg. (A) 5-90 wt.% polyphenylene ether with Mw 800-30,000, (B) 5-90 wt.% impact-modified vinylaromatic polymer contg. 20-50 wt.% soft component with mean particle size at least 3.5 microns, and (C) 0-60 wt.% normal additives and processing aids. (A) has Mw 12,000-25,000 and (B) contains 25-40 wt.% soft component. Pref. (A) is poly-(2,6-dimethyl- 1,4-phenylene ether) (PPE) or a homologue thereof. (B) is high-impact polystyrene (HIPS) contg. 5-15 wt.% rubber, e.g. polybutadiene, polyisoprene, etc., (C) can be different impact modifiers, fire retardants, pigments, etc. USE/ADVANTAGE - Used for the prodn. of fibres, film and moulded prods. (claimed). The invention provides thermoplastic HIPS/PPE moulding materials with good thermal dimensional stability and good stress cracking resistance, combined with good multiaxial impact strength which is relatively unaffected by repeated processing.

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