11.
    发明专利
    未知

    公开(公告)号:NO20081107L

    公开(公告)日:2008-04-07

    申请号:NO20081107

    申请日:2008-03-04

    Applicant: BASF SE

    Abstract: Dispersion for applying a metal layer on an electrically non-conductive substrate comprises an organic binder component (0.01-30 wt.%); a metal component (30-89.99 wt.%) containing a first metal with a first metal particle (0.01-99.99 wt.%) and a second metal with a second metal particle (99.99-0.01 wt.%); and a solvent component (10-69.99 wt.%); where the first metal and -particle and second metal and -particle are different from each other. Independent claims are included for: (1) a method for preparing the dispersion comprising mixing an organic binder component, a metal component containing a first metal with a first metal particle and a second metal with a second metal particle, a solvent component, dispersing agent, filler components and further components, and dispersing the obtained mixture; (2) preparation of metal layer on at least a part of an electrically non-conductive substrate comprising applying the dispersion on the substrate, drying the dispersion applied layer on the substrate and optionally de-energizing and/or galvanically separating the metal on the dried dispersion layer; and (3) a substrate surface comprising at least a partially electrical conductive metal layer.

    12.
    发明专利
    未知

    公开(公告)号:BRPI0710662A2

    公开(公告)日:2011-08-16

    申请号:BRPI0710662

    申请日:2007-04-05

    Applicant: BASF SE

    Abstract: The invention relates to a device for the electrolytic coating of at least one electrically conductive substrate or a structured or full-surface electrically conductive surface on a nonconductive substrate, which comprises at least one bath, one anode and one cathode, the bath containing an electrolyte solution containing at least one metal salt, from which metal ions are deposited on electrically conductive surfaces of the substrate to form a metal layer while the cathode is brought in contact with the substrate's surface to be coated and the substrate is transported through the bath, wherein the cathode comprises at least two disks (2, 4, 10) mounted on a respective shaft (1, 5, 14) so that they can rotate, the disks (2, 4, 10) engaging in one another. The invention furthermore relates to a method for the electrolytic coating of at least one substrate, which is carried out in a device according to the invention. Lastly, the invention also relates to a use of the device according to the invention for the electrolytic coating of electrically conductive structures on an electrically nonconductive support.

    PROCESS FOR PRODUCING ELECTRODES FOR SOLAR CELLS

    公开(公告)号:CA2728055A1

    公开(公告)日:2009-12-23

    申请号:CA2728055

    申请日:2009-06-09

    Applicant: BASF SE

    Abstract: The invention relates to a method for producing electrodes for solar cells, the electrode being designed as an electrically conducting layer on a substrate (1) for solar cells. In a first step, a dispersion containing electrically conducting particles is transferred from a support (7) onto the substrate (1) by irradiation of the dispersion with a laser (9), and in a second step, the dispersion transferred onto the substrate (1) is dried and/or cured to form the electrically conducting layer.

    DISPERSION FOR APPLYING A METAL LAYER

    公开(公告)号:CA2727215A1

    公开(公告)日:2009-12-17

    申请号:CA2727215

    申请日:2009-06-08

    Applicant: BASF SE

    Abstract: The invention relates to a dispersion for applying a metal layer to an electrically non-conductive substrate, said dispersion containing an organic binder component, a metal component and a solvent component. The invention further relates to methods for producing said dispersion, to methods for producing an optionally structured metal layer using said dispersion and to the substrate surfaces obtained in said manner and the use thereof.

    METHOD FOR PRODUCING METAL-COATED BASE LAMINATES

    公开(公告)号:CA2685517A1

    公开(公告)日:2008-11-27

    申请号:CA2685517

    申请日:2008-05-20

    Applicant: BASF SE

    Abstract: The invention relates to a method for the production of metal-coated base laminates having a carrier (51) made of an electrically non-conductive mate rial (37) that is coated on at least one side with a metal coating (25, 53). In a first step, a base coating (11) is applied onto a substrate (3) having a dispersion (5) containing particles in a matrix material that can be coat ed in a current-free and/or galvanized manner. The matrix material is at lea st partially cured and/or dried. A metal coating is subsequently formed on t he base coating (11) by means of a current-free and/or galvanic coating. The carrier (51) made of the electrically non-conductive material (37) is lamin ated onto the metal coating (25). As a final step, the carrier (51) is remov ed from the substrate (3) along with the metal coating (25) laminated thereo n and at least part of the base coating (11).

    ELECTROPLATING DEVICE AND METHOD
    17.
    发明专利

    公开(公告)号:CA2647969A1

    公开(公告)日:2007-10-25

    申请号:CA2647969

    申请日:2007-04-05

    Applicant: BASF SE

    Abstract: The invention relates to a device for the electrolytic coating of at least one electrically conductive substrate or a structured or full-surface electrically conductive surface on a nonconductive substrate, which comprises at least one bath, one anode and one cathode, the bath containing an electrolyte solution containing at least one metal salt, from which metal ions are deposited on electrically conductive surfaces of the substrate to form a metal layer while the cathode is brought in contact with the substrate's surface to be coated and the substrate is transported through the bath, wherein the cathode comprises at least two disks (2, 4, 10) mounted on a respective shaft (1, 5, 14) so that they can rotate, the disks (2, 4, 10) engaging in one another. The invention furthermore relates to a method for the electrolytic coating of at least one substrate, which is carried out in a device according to the invention. Lastly, the invention also relates to a use of the device according to the invention for the electrolytic coating of electrically conductive structures on an electrically nonconductive support.

    18.
    发明专利
    未知

    公开(公告)号:BRPI0720834A2

    公开(公告)日:2014-03-04

    申请号:BRPI0720834

    申请日:2007-12-21

    Applicant: BASF SE

    Abstract: The invention relates to a method for producing electrically conductive surfaces on a nonconductive substrate, comprising the following steps: a) transferring a dispersion containing electrolessly and/or electrolytically coatable particles from a support onto the substrate by irradiating the support with a laser, b) at least partially drying and/or curing the dispersion transferred onto the substrate, so as to form a base layer, c) electrolessly and/or electrolytically coating the base layer.

    19.
    发明专利
    未知

    公开(公告)号:BRPI0719665A2

    公开(公告)日:2013-12-17

    申请号:BRPI0719665

    申请日:2007-11-26

    Applicant: BASF SE

    Abstract: The invention relates to a device for the electrolytic coating of a structured or full-surface base layer (9) on a surface of a substrate (7), which comprises at least one electrolyte bath (3) having at least one rotatably mounted roller (2) connectable as a cathode, which contacts the base layer (9) during the electrolytic coating, the base layer (9) being covered by an electrolyte solution (5) contained in the electrolyte bath (3) and being moved relative to the at least one roller (2) during the coating. The at least one roller (2) connectable as a cathode is connected cathodically during the contact with the base layer (9) and is connected neutrally or anodically as soon as there is no contact with the base layer (9). The invention furthermore relates to a method for the electrolytic coating of a structured or full-surface base layer (9) on a surface of a substrate (7), the base layer (9) being surrounded by an electrolyte solution (5) and being contacted by at least one roller (2) connectable as a cathode. The roller (2) connectable as a cathode is connected cathodically when it contacts the base layer (9) and is connected neutrally or anodically as soon as there is no contact with the base layer (9).

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