中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

55 records (took 0.024 seconds)

    METHOD FOR PRODUCING ELECTRODES FOR SOLAR CELLS
    2.
    发明申请
    METHOD FOR PRODUCING ELECTRODES FOR SOLAR CELLS 审中-公开
    用于生产电极的太阳能电池

    公开(公告)号：WO2009153192A3

    公开(公告)日：2010-11-25

    申请号：PCT/EP2009057103

    申请日：2009-06-09

    Applicant: BASF SE ,  LOCHTMAN RENE ,  WAGNER NORBERT ,  KACZUN JUERGEN ,  PFISTER JUERGEN

    Inventor： LOCHTMAN RENE ,  WAGNER NORBERT ,  KACZUN JUERGEN ,  PFISTER JUERGEN

    IPC: H01L31/0224

    CPC classification number: H01L31/022425 ,  Y02E10/50

    Abstract: The invention relates to a method for producing electrodes for solar cells, the electrode being designed as an electrically conducting layer on a substrate (1) for solar cells. In a first step, a dispersion containing electrically conducting particles is transferred from a support (7) onto the substrate (1) by irradiation of the dispersion with a laser (9), and in a second step, the dispersion transferred onto the substrate (1) is dried and/or cured to form the electrically conducting layer.

    Abstract translation: 本发明涉及一种用于生产用于太阳能电池电极的方法，其中作为底物（1）上的导电层的电极被设计用于太阳能电池，其中包含在所述的载体（7）的第一步骤的分散的导电性粒子 衬底（1）通过用激光（9）照射分散体转移并在该基板（1），用于形成导电层和/或固化分散体上的第二步骤中被干燥发送。

    METHOD FOR CONTACTING ELECTRICAL COMPONENTS
    5.
    发明申请
    METHOD FOR CONTACTING ELECTRICAL COMPONENTS 审中-公开
    连接电子元件的方法

    公开(公告)号：WO2008101884A2

    公开(公告)日：2008-08-28

    申请号：PCT/EP2008051909

    申请日：2008-02-18

    Applicant: BASF SE ,  LOCHTMAN RENE ,  WAGNER NORBERT ,  KACZUN JUERGEN ,  PFISTER JUERGEN ,  ADDAMO RAFFAELE ANTONINO ,  NOERENBERG RALF

    Inventor： LOCHTMAN RENE ,  WAGNER NORBERT ,  KACZUN JUERGEN ,  PFISTER JUERGEN ,  ADDAMO RAFFAELE ANTONINO ,  NOERENBERG RALF

    IPC: H05K3/32

    CPC classification number: H05K3/32 ,  H05K3/246 ,  H05K3/321 ,  H05K2201/0347 ,  H05K2203/0796

    Abstract: The invention relates to a method for electrically contacting electrical components (122) on a carrier (110), said method comprising the following steps: (a) at least one dispersion (116) comprising electroconductive particles is applied in at least one region of the carrier (110); (b) at least one electrical component (122) is applied to the dispersion (116), and (c) the dispersion (116) is fully or partially metallised in a currentless and/or galvanised manner. The invention also relates to an electrical module (134) comprising at least one carrier (110) and at least one electrical component (122). The electrical component (122) is contacted on the carrier (110) using an inventive method. The invention further relates to a device for carrying out the inventive method, to a dispersion (116) for using in the inventive method, and to a use of said dispersion (116).

    Abstract translation: 提出了一种用于在支撑件（110）上电接触电部件（122）的方法，该方法包括以下步骤：（a）在支撑件（110）的至少一个区域中施加至少一个分散体（116），分散体 116）包含导电颗粒; （B）将至少一个电气元件（122）施加到分散体（116）; 和（c）分散体（116）完全或部分无电镀和/或电镀金属。 此外，提出了包括至少一个载体（110）和至少一个电气部件（122）的电气部件（134）。 电气部件（122）在载体（110）上与根据本发明的方法接触。 此外，提出了用于实施根据本发明的方法的装置和用于根据本发明的方法的分散体（116）以及该分散体（116）的用途。

    ELECTROPLATING DEVICE AND METHOD
    6.
    发明申请
    ELECTROPLATING DEVICE AND METHOD 审中-公开
    DEVICE AND METHOD FOR电镀层

    公开(公告)号：WO2007118810A3

    公开(公告)日：2008-05-22

    申请号：PCT/EP2007053401

    申请日：2007-04-05

    Applicant: BASF SE ,  LOCHTMAN RENE ,  KACZUN JUERGEN ,  SCHNEIDER NORBERT ,  PFISTER JUERGEN ,  POHL GERT ,  WAGNER NORBERT

    Inventor： LOCHTMAN RENE ,  KACZUN JUERGEN ,  SCHNEIDER NORBERT ,  PFISTER JUERGEN ,  POHL GERT ,  WAGNER NORBERT

    IPC: C25D7/06 ,  C25D7/00 ,  C25D17/00

    CPC classification number: C25D17/12 ,  C25D7/0657 ,  C25D17/005 ,  C25D17/06 ,  C25D17/28

    Abstract: The invention relates to a device for electroplating at least one electrically conductive substrate or a structured or electrically conductive surface covering the whole area of a non-conductive substrate. Said device comprises at least one bath, an anode and a cathode. The bath contains an electrolyte solution, which comprises at least one metal salt and from which metal ions are deposited on electrically conductive surfaces of the substrate to form a metal layer, as the cathode is brought into contact with the surface of the substrate to be coated and said substrate is conveyed through the bath. The cathode comprises at least two discs (2, 4, 10) that are rotatably mounted on a respective shaft (1, 5, 14), said discs (2, 4, 10) intermeshing. The invention also relates to a method for electroplating at least one substrate, said method being carried out in a device according to the invention. The invention further relates to the use of said device for electroplating electrically conductive structures situated on an electrically non-conductive support.

    Abstract translation: 本发明涉及一种用于至少一个导电基材的电解涂覆或结构化的或全表面导电表面的不导电基板，其包括至少一个浴，在阳极和阴极上，其中电解液中含有至少一个含金属盐的电解液， 从上所述衬底以形成金属层的导电表面中的金属离子被沉积，而阴极被带入与所述表面接触到待涂覆的基材和所述衬底通过所述浴输送。 阴极包括在在任轴（1，5，14）可旋转地安装盘（2，4，10），所述盘（2，4，10）插入每个网格的至少两个。 此外，Erfindüng涉及一种用于至少一个基板，其在根据本发明的装置中进行的电解涂覆的方法。 最后，本发明还可以根据本发明的用于导电结构的不导电的载体上电解涂覆涉及一种使用该装置。

    8.
    发明专利
    未知

    公开(公告)号：BRPI0811751A2

    公开(公告)日：2014-11-11

    申请号：BRPI0811751

    申请日：2008-05-20

    Applicant: BASF SE

    Inventor： LOCHTMAN RENE ,  KACZUN JUERGEN ,  WAGNER NORBERT ,  PFISTER JUERGEN ,  HENTSCHEL DIETER

    IPC: H05K3/02 ,  B05D1/00 ,  B05D1/38 ,  B05D3/10 ,  B05D5/12 ,  B05D7/00 ,  B32B37/02

    Abstract: The invention relates to a method for producing polymer-coated metal foils, comprising the following steps: (a) applying a base layer (7) onto a support foil (3), with a dispersion (5) which comprises electrolessly and/or electrolytically coatable particles in a matrix material, (b) at least partially drying and/or at least partially curing the matrix material, (c) forming a metal layer (19) on the base layer (7) by electroless and/or electrolytic coating of the base layer (7) comprising the electrolessly or electrolytically coatable particles, (d) applying a polymer (23) to the metal layer (19). Furthermore, the invention relates to a use of the polymer-coated metal foil for the production of printed circuit boards.

Patent Agency Ranking