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    ELECTROPLATING DEVICE AND METHOD
    3.
    发明申请
    ELECTROPLATING DEVICE AND METHOD 审中-公开
    DEVICE AND METHOD FOR电镀层

    公开(公告)号：WO2007118810A3

    公开(公告)日：2008-05-22

    申请号：PCT/EP2007053401

    申请日：2007-04-05

    Applicant: BASF SE ,  LOCHTMAN RENE ,  KACZUN JUERGEN ,  SCHNEIDER NORBERT ,  PFISTER JUERGEN ,  POHL GERT ,  WAGNER NORBERT

    Inventor： LOCHTMAN RENE ,  KACZUN JUERGEN ,  SCHNEIDER NORBERT ,  PFISTER JUERGEN ,  POHL GERT ,  WAGNER NORBERT

    IPC: C25D7/06 ,  C25D7/00 ,  C25D17/00

    CPC classification number: C25D17/12 ,  C25D7/0657 ,  C25D17/005 ,  C25D17/06 ,  C25D17/28

    Abstract: The invention relates to a device for electroplating at least one electrically conductive substrate or a structured or electrically conductive surface covering the whole area of a non-conductive substrate. Said device comprises at least one bath, an anode and a cathode. The bath contains an electrolyte solution, which comprises at least one metal salt and from which metal ions are deposited on electrically conductive surfaces of the substrate to form a metal layer, as the cathode is brought into contact with the surface of the substrate to be coated and said substrate is conveyed through the bath. The cathode comprises at least two discs (2, 4, 10) that are rotatably mounted on a respective shaft (1, 5, 14), said discs (2, 4, 10) intermeshing. The invention also relates to a method for electroplating at least one substrate, said method being carried out in a device according to the invention. The invention further relates to the use of said device for electroplating electrically conductive structures situated on an electrically non-conductive support.

    Abstract translation: 本发明涉及一种用于至少一个导电基材的电解涂覆或结构化的或全表面导电表面的不导电基板，其包括至少一个浴，在阳极和阴极上，其中电解液中含有至少一个含金属盐的电解液， 从上所述衬底以形成金属层的导电表面中的金属离子被沉积，而阴极被带入与所述表面接触到待涂覆的基材和所述衬底通过所述浴输送。 阴极包括在在任轴（1，5，14）可旋转地安装盘（2，4，10），所述盘（2，4，10）插入每个网格的至少两个。 此外，Erfindüng涉及一种用于至少一个基板，其在根据本发明的装置中进行的电解涂覆的方法。 最后，本发明还可以根据本发明的用于导电结构的不导电的载体上电解涂覆涉及一种使用该装置。

    5.
    发明专利
    未知

    公开(公告)号：BRPI0710241A2

    公开(公告)日：2011-08-09

    申请号：BRPI0710241

    申请日：2007-04-17

    Applicant: BASF SE

    Inventor： LOCHTMAN RENE ,  KACZUN JUERGEN ,  SCHNEIDER NORBERT ,  PFISTER JUERGEN ,  POHL GERT ,  WAGNER NORBERT

    IPC: C25D17/00 ,  C25D7/00 ,  C25D7/06 ,  H05K3/24

    Abstract: The invention relates to a device for the electrolytic coating of at least one electrically conductive substrate (8) or a structured or full-surface electrically conductive surface on a nonconductive substrate (8), which comprises at least one bath, one anode and one cathode (1), the bath containing an electrolyte solution containing at least one metal salt, from which metal ions are deposited on electrically conductive surfaces of the substrate to form a metal layer while the cathode is brought in contact with the surface to be coated of the substrate and the substrate is transported through the bath. The cathode comprises at least one band (2) having at least one electrically conductive section (12), which is guided around at least two rotatable shafts (3). The invention furthermore relates to a method for the electrolytic coating of at least substrate, which is carried out in a device according to the invention, the band resting on the substrate for the coating and being circulated with a circulation speed which corresponds to the speed with which the substrate is guided through the bath. Lastly, the invention also relates to a use of the device according to the invention for the electrolytic coating of electrically conductive structures on an electrically nonconductive support.

    6.
    发明专利
    未知

    公开(公告)号：DE502006005931D1

    公开(公告)日：2010-03-04

    申请号：DE502006005931

    申请日：2006-08-31

    Applicant: BASF SE

    Inventor： SCHNEIDER NORBERT ,  LIPPERT GERALD ,  LOCHTMAN RENE ,  MAAS HEIKO ,  PFISTER JUERGEN ,  SOBOTKA BETTINA ,  WAGNER NORBERT

    IPC: C09D5/24 ,  C09K23/00

    Abstract: Dispersion for applying a metal layer on an electrically non-conductive substrate comprises an organic binder component (0.01-30 wt.%); a metal component (30-89.99 wt.%) containing a first metal with a first metal particle (0.01-99.99 wt.%) and a second metal with a second metal particle (99.99-0.01 wt.%); and a solvent component (10-69.99 wt.%); where the first metal and -particle and second metal and -particle are different from each other. Independent claims are included for: (1) a method for preparing the dispersion comprising mixing an organic binder component, a metal component containing a first metal with a first metal particle and a second metal with a second metal particle, a solvent component, dispersing agent, filler components and further components, and dispersing the obtained mixture; (2) preparation of metal layer on at least a part of an electrically non-conductive substrate comprising applying the dispersion on the substrate, drying the dispersion applied layer on the substrate and optionally de-energizing and/or galvanically separating the metal on the dried dispersion layer; and (3) a substrate surface comprising at least a partially electrical conductive metal layer.

    7.
    发明专利
    未知

    公开(公告)号：AT455879T

    公开(公告)日：2010-02-15

    申请号：AT07727869

    申请日：2007-04-05

    Applicant: BASF SE

    Inventor： LOCHTMAN RENE ,  KACZUN JUERGEN ,  SCHNEIDER NORBERT ,  PFISTER JUERGEN ,  POHL GERT ,  WAGNER NORBERT

    IPC: C25D7/06 ,  C25D7/00 ,  C25D17/00

    Abstract: The invention relates to a device for the electrolytic coating of at least one electrically conductive substrate or a structured or full-surface electrically conductive surface on a nonconductive substrate, which comprises at least one bath, one anode and one cathode, the bath containing an electrolyte solution containing at least one metal salt, from which metal ions are deposited on electrically conductive surfaces of the substrate to form a metal layer while the cathode is brought in contact with the substrate's surface to be coated and the substrate is transported through the bath, wherein the cathode comprises at least two disks (2, 4, 10) mounted on a respective shaft (1, 5, 14) so that they can rotate, the disks (2, 4, 10) engaging in one another. The invention furthermore relates to a method for the electrolytic coating of at least one substrate, which is carried out in a device according to the invention. Lastly, the invention also relates to a use of the device according to the invention for the electrolytic coating of electrically conductive structures on an electrically nonconductive support.

    8.
    发明专利
    未知

    公开(公告)号：NO20081107L

    公开(公告)日：2008-04-07

    申请号：NO20081107

    申请日：2008-03-04

    Applicant: BASF SE

    Inventor： LOCHTMAN RENE ,  WAGNER NORBERT ,  PFISTER JUERGEN ,  LIPPERT GERALD ,  MAAS HEIKO ,  SCHNEIDER NORBERT ,  SOBOTKA BETTINA

    IPC: C08K3/08 ,  H01B1/22 ,  C08K7/06 ,  C09K23/00

    Abstract: Dispersion for applying a metal layer on an electrically non-conductive substrate comprises an organic binder component (0.01-30 wt.%); a metal component (30-89.99 wt.%) containing a first metal with a first metal particle (0.01-99.99 wt.%) and a second metal with a second metal particle (99.99-0.01 wt.%); and a solvent component (10-69.99 wt.%); where the first metal and -particle and second metal and -particle are different from each other. Independent claims are included for: (1) a method for preparing the dispersion comprising mixing an organic binder component, a metal component containing a first metal with a first metal particle and a second metal with a second metal particle, a solvent component, dispersing agent, filler components and further components, and dispersing the obtained mixture; (2) preparation of metal layer on at least a part of an electrically non-conductive substrate comprising applying the dispersion on the substrate, drying the dispersion applied layer on the substrate and optionally de-energizing and/or galvanically separating the metal on the dried dispersion layer; and (3) a substrate surface comprising at least a partially electrical conductive metal layer.

    10.
    发明专利
    未知

    公开(公告)号：BRPI0712709A2

    公开(公告)日：2012-05-22

    申请号：BRPI0712709

    申请日：2007-06-11

    Applicant: BASF SE

    Inventor： LOCHTMAN RENE ,  KACZUN JUERGEN ,  SCHNEIDER NORBERT ,  PFISTER JUERGEN ,  WAGNER NORBERT ,  HENTSCHEL DIETER

    IPC: H05K3/10 ,  H05K3/24

    Abstract: Method for producing electrically conductive, structured or full-area surfaces on a support, in which a structured or full-area base layer onto the support in a first step by using a dispersion, which contains electrically conductive particles in a matrix material, the matrix material is at least partially cured and/or dried in a second step, the electrically conductive particles are exposed in a third step by at least partially breaking the matrix, and a metal layer is formed on the structured or full-area base layer in a fourth step by electroless and/or electrolytic coating.

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