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    METAL-RESIN COMPOSITE AND PREPARATION METHOD THEREOF AND ELECTRONIC PRODUCT HOUSING
    13.
    发明公开
    METAL-RESIN COMPOSITE AND PREPARATION METHOD THEREOF AND ELECTRONIC PRODUCT HOUSING 审中-公开
    金属 - 树脂复合材料及其制备方法和电子产品外壳

    公开(公告)号：EP3243651A1

    公开(公告)日：2017-11-15

    申请号：EP15871779.3

    申请日：2015-10-29

    Applicant: BYD Company Limited

    Inventor： ZHANG, Xiao ,  TAO, Letian ,  SUN, Jian ,  CHEN, Liang

    IPC: B32B15/08 ,  B32B15/20 ,  B29C45/14 ,  C25D11/04

    CPC classification number: B29C45/14311 ,  B29C45/14778 ,  B29C2045/14868 ,  B29K2105/20 ,  B29K2705/08 ,  B29L2031/34 ,  B32B15/08 ,  B32B15/20 ,  C23F1/38 ,  C25D11/26

    Abstract: The present disclosure provides a metal-resin composite and a method of preparing the same. The metal includes titanium or titanium alloy, the composite includes a metal substrate and a resin layer coated on at least part of surface of the metal substrate, a recess is distributed on the part of surface of the metal substrate coated with the resin layer, a part of resin of the resin layer extends downward to fill in the recess, a content of oxygen element on surface of the metal substrate is greater than 1wt%. The method includes dipping a metal substrate in an etching solution containing at least one alkali metal hydroxide so as to form a recess on surface of the metal substrate, and injecting a resin onto surface of the metal substrate after surface treatment sp as to form a resin layer. The metal-resin composite of the present disclosure is suitable for a shell of electronic product.

    Abstract translation: 本公开提供了一种金属 - 树脂复合材料及其制备方法。 所述金属包括钛或钛合金，所述复合物包括金属基材和涂布在所述金属基材的至少一部分表面上的树脂层，在涂布有所述树脂层的金属基材表面的一部分上分布有凹部， 树脂层的部分树脂向下延伸填充凹槽，金属基材表面的氧元素含量大于1wt％。 该方法包括将金属基材浸渍在含有至少一种碱金属氢氧化物的蚀刻溶液中，以在金属基材的表面上形成凹部，并且在表面处理后将金属基材的表面注入树脂以形成树脂 层。 本发明的金属 - 树脂复合材料适用于电子产品的外壳。

    HOUSING AND METHOD FOR FABRICATION THEREOF AND APPLICATION THEREOF
    14.
    发明公开
    HOUSING AND METHOD FOR FABRICATION THEREOF AND APPLICATION THEREOF 审中-公开

    公开(公告)号：EP3481164A1

    公开(公告)日：2019-05-08

    申请号：EP17819127.6

    申请日：2017-06-19

    Applicant: BYD Company Limited

    Inventor： SUN, Jian ,  CHEN, Liang ,  ZHAO, Guiwang ,  WU, Yingyuan ,  JIANG, Xiangrong ,  ZOU, Yunfei

    IPC: H05K5/02

    Abstract: The present disclosure relates to the field of electronic communications, and discloses a housing, a preparation method therefor, and use thereof. The housing includes a metal hard anodic oxide layer (5) and a resin film layer (3) adhering to a first surface of the metal hard anodic oxide layer (5). The metal hard anodic oxide layer (5) and the resin film layer (3) form an integrated structure. The preparation method includes: performing hard anode oxidization treatment on a metal substrate (1), and then successively performing injection molding and etching.

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