公开(公告)号：EP3527346A1

公开(公告)日：2019-08-21

申请号：EP17860354.4

申请日：2017-09-22

Applicant: BYD Company Limited

Inventor： WU, Yingyuan ,  ZHANG, Guoqiang ,  ZHAO, Guiwang ,  SUN, Jian ,  CHEN, Liang

IPC: B29C45/14 ,  B29C69/00 ,  B29L31/34

Abstract: The present disclosure provides a metal resin composite. The metal resin composite includes a metal substrate. The upper surface of the metal substrate is provided with at least one upper surface slit, the lower surface of the metal substrate is provided with at least one lower surface groove in a position opposite to the upper surface slit, and the upper surface slit is communicated with the lower surface groove. A first injection molding resin is formed in the upper surface slit by injection molding, and a second injection molding resin is formed in the lower surface groove by injection molding. The present disclosure also provides a preparation method of the metal resin composite, a personal electronic device shell including the metal resin composite, a personal electronic device, and a metal resin composite processing component.

公开(公告)号：EP3481164A1

公开(公告)日：2019-05-08

申请号：EP17819127.6

申请日：2017-06-19

Applicant: BYD Company Limited

Inventor： SUN, Jian ,  CHEN, Liang ,  ZHAO, Guiwang ,  WU, Yingyuan ,  JIANG, Xiangrong ,  ZOU, Yunfei

IPC: H05K5/02

Abstract: The present disclosure relates to the field of electronic communications, and discloses a housing, a preparation method therefor, and use thereof. The housing includes a metal hard anodic oxide layer (5) and a resin film layer (3) adhering to a first surface of the metal hard anodic oxide layer (5). The metal hard anodic oxide layer (5) and the resin film layer (3) form an integrated structure. The preparation method includes: performing hard anode oxidization treatment on a metal substrate (1), and then successively performing injection molding and etching.

公开(公告)号：EP3240111B1

公开(公告)日：2019-12-11

申请号：EP15871941.9

申请日：2015-12-22

Applicant: BYD Company Limited

Inventor： ZHAO, Guiwang ,  LI, Konglin ,  LIU, Chencen ,  WU, Tao

IPC: H01Q1/44 ,  H01Q1/24 ,  H01Q13/10 ,  H01Q1/38

公开(公告)号：EP3481165A1

公开(公告)日：2019-05-08

申请号：EP17819128.4

申请日：2017-06-19

Applicant: BYD Company Limited

Inventor： SUN, Jian ,  CHEN, Liang ,  ZHAO, Guiwang ,  ZHU, Shuai ,  JIANG, Xiangrong

IPC: H05K5/02

Abstract: The present disclosure relates to the field of electronic communications, and discloses a housing, a preparation method therefor, and use thereof. The housing includes a metal oxide layer (5) and a resin film layer (3) adhering to a first surface of the metal anodic oxide layer (5). The metal anodic oxide layer (5) and the resin film layer (3) form an integrated structure. The preparation method includes: performing anode oxidization treatment on a substrate (1), and then successively performing injection molding and etching.

公开(公告)号：EP3240379A1

公开(公告)日：2017-11-01

申请号：EP15871947.6

申请日：2015-12-22

Applicant: BYD Company Limited

Inventor： LI, Konglin ,  ZHAO, Guiwang ,  GUO, Lifen ,  LIU, Chencen ,  DONG, Mingjie

IPC: H05K5/04 ,  B29C45/76

CPC classification number: B29C45/76 ,  B29C45/0055 ,  B29C45/1671 ,  B29C2045/0058 ,  B29C2045/1693 ,  B29C2945/76036 ,  B29L2031/3481 ,  H05K5/04

Abstract: The present disclosure provides a method of manufacturing a metal shell of a communication equipment and a metal shell of a communication equipment thus obtained, the method includes steps of: 1) performing a first injection molding on a non-slit region of an inner surface of a metal substrate; 2) forming at least one slit on a slit region of the inner surface of the metal substrate; and 3) performing a second injection molding on the slit region of the inner surface of the metal substrate.

Abstract translation: 本发明提供了一种通信设备的金属壳体的制造方法以及由此获得的通信设备的金属壳体，所述方法包括以下步骤：1）对所述通信设备的内表面的非狭缝区域进行第一次注射成型， 金属基材; 2）在金属衬底的内表面的狭缝区域上形成至少一个狭缝; 以及3）在金属基板的内表面的狭缝区域上进行第二次注射成型。

公开(公告)号：EP3240111A1

公开(公告)日：2017-11-01

申请号：EP15871941.9

申请日：2015-12-22

Applicant: BYD Company Limited

Inventor： ZHAO, Guiwang ,  LI, Konglin ,  LIU, Chencen ,  WU, Tao

IPC: H01Q13/00

Abstract: The present disclosure provides a metal shell of communication equipment. The metal shell of communication equipment includes a metal substrate, a slit penetrating inner and outer surfaces of the metal substrate, a plastic-supporting layer formed on an inner surface of the metal substrate and a decorative layer formed on an outer surface of the metal substrate, wherein a width of the slit on the outer surface of the metal substrate is 15-500µm, the width of the slit on the inner surface of the metal substrate is 20-600µm, a ratio of the width of the slit on the inner surface of the metal substrate to the width of the slit on the outer surface of the metal substrate is between 1.05:1 and 1.5:1.

Abstract translation: 本公开提供了通信设备的金属外壳。 通信设备的金属外壳包括金属基板，穿透金属基板内外表面的狭缝，形成于金属基板内表面的塑料支撑层和形成于金属基板外表面的装饰层 其特征在于，所述金属基板的外表面的狭缝的宽度为15〜500μm，所述金属基板的内表面的狭缝的宽度为20〜600μm，所述狭缝的宽度在内表面 所述金属基板的宽度与所述金属基板的外表面上的所述狭缝的宽度之比在1.05:1至1.5:1之间。