WATER SUPPLY DEVICE OF DISHWASHER AND DISHWASHER COMPRISING THE SAME
    5.
    发明申请
    WATER SUPPLY DEVICE OF DISHWASHER AND DISHWASHER COMPRISING THE SAME 审中-公开
    洗碗机的供水装置和包含该洗碗机的洗碗机

    公开(公告)号:WO2012065535A1

    公开(公告)日:2012-05-24

    申请号:PCT/CN2011/082173

    申请日:2011-11-14

    CPC classification number: A47L15/4217 A47L15/4229

    Abstract: A water supply device of a dishwasher and a dishwasher comprising the same may be provided. The water supply device may comprise: a soft water container (b) defining a softener cavity for positioning a softener therein, the softener cavity having a first water inlet (2), a first water outlet (6) for outputting softened water and a softener processing water outlet; a regenerating container (a) defining a regenerating cavity for positioning a regenerating agent therein, the regenerating cavity having a second water inlet (3) and a second water outlet in communication with the softener cavity; a hard water container (c) defining a hard water cavity for positioning a hardener therein, the harder cavity having a third water inlet (9), a third water outlet (7) and a softener processing water inlet in communication with the softener processing water outlet; a first valve (10-1) disposed between the second water outlet and the softener cavity; and a second valve (10-2) disposed between the softener processing water inlet of the hard water cavity and the softener processing water outlet of the softener cavity.

    Abstract translation: 可以提供洗碗机的供水装置和包括其的洗碗机。 供水装置可以包括:软水容器(b),其限定用于将软化剂定位在其中的软化器腔,所述软化器腔具有第一进水口(2),用于输出软化水的第一出水口(6)和软化剂 加工出水口; 再生容器(a)限定用于在其中定位再生剂的再生腔,再生腔具有与软化器腔连通的第二进水口(3)和第二出水口; 限定用于在其中定位硬化剂的硬水腔的硬水容器(c),所述较硬腔体具有与软化剂处理水连通的第三进水口(9),第三出水口(7)和软化剂加工水入口 出口; 设置在第二出水口和软化器腔之间的第一阀(10-1); 以及设置在硬水腔的软化剂处理水入口与软化器腔的软化剂处理水出口之间的第二阀(10-2)。

    METAL-RESIN COMPOSITE AND METHOD OF PREPARING THE SAME
    6.
    发明申请
    METAL-RESIN COMPOSITE AND METHOD OF PREPARING THE SAME 审中-公开
    金属树脂组合物及其制备方法

    公开(公告)号:WO2016000574A1

    公开(公告)日:2016-01-07

    申请号:PCT/CN2015/082541

    申请日:2015-06-26

    Abstract: A metal-resin composite and method of producing the same are provided. The method includes : providing a metal substrate, the metal substrate including a metal base made of copper or copper alloy and an oxide layer attached to at least a part of a surface of the metal base; chemically etching the metal substrate to form corrosion pores on a surface of the oxide layer to obtain a surface-treated metal substrate with a treated surface; and injecting a resin composition to fill in the corrosion pores, then molding to obtain a resin layer.

    Abstract translation: 提供了一种金属树脂复合物及其制造方法。 所述方法包括:提供金属基板,所述金属基板包括由铜或铜合金制成的金属基体和附着到所述金属基底表面的至少一部分的氧化物层; 化学蚀刻金属基底以在氧化物层的表面上形成腐蚀孔,以获得具有处理表面的经表面处理的金属基底; 并注入树脂组合物以填充腐蚀孔,然后成型以获得树脂层。

    HOUSING AND METHOD FOR FABRICATION THEREOF AND APPLICATION THEREOF

    公开(公告)号:EP3481165A1

    公开(公告)日:2019-05-08

    申请号:EP17819128.4

    申请日:2017-06-19

    Abstract: The present disclosure relates to the field of electronic communications, and discloses a housing, a preparation method therefor, and use thereof. The housing includes a metal oxide layer (5) and a resin film layer (3) adhering to a first surface of the metal anodic oxide layer (5). The metal anodic oxide layer (5) and the resin film layer (3) form an integrated structure. The preparation method includes: performing anode oxidization treatment on a substrate (1), and then successively performing injection molding and etching.

    METAL RESIN COMPLEX AND PREPARATION METHOD AND USE OF SAME

    公开(公告)号:EP3527346A1

    公开(公告)日:2019-08-21

    申请号:EP17860354.4

    申请日:2017-09-22

    Abstract: The present disclosure provides a metal resin composite. The metal resin composite includes a metal substrate. The upper surface of the metal substrate is provided with at least one upper surface slit, the lower surface of the metal substrate is provided with at least one lower surface groove in a position opposite to the upper surface slit, and the upper surface slit is communicated with the lower surface groove. A first injection molding resin is formed in the upper surface slit by injection molding, and a second injection molding resin is formed in the lower surface groove by injection molding. The present disclosure also provides a preparation method of the metal resin composite, a personal electronic device shell including the metal resin composite, a personal electronic device, and a metal resin composite processing component.

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