Abstract:
Aspects of the technology described herein relate to ultrasound device circuitry as may form part of a single substrate ultrasound device having integrated ultrasonic transmission units, a delay mesh circuitry integrated with the substrate, coupled to inputs of the plurality of ultrasound transmission units and configured to output to the plurality of ultrasound transmission units a plurality of time-delayed versions of a delay mesh circuitry input signal corresponding to a waveform generated by a waveform generator.
Abstract:
Aspects of the technology described herein relate to ultrasound data collection using tele-medicine. An instructor electronic device may generate for display an instructor augmented reality interface and receive, on the instructor augmented reality interface, an instruction for moving an ultrasound imaging device. The instructor augmented reality interface may include a video showing the ultrasound imaging device and a superposition of arrows on the video, where each of the arrows corresponds to a possible instruction for moving the ultrasound imaging device. A user electronic device may receive, from the instructor electronic device, an instruction for moving an ultrasound imaging device, and generate for display, on a user augmented reality interface shown on the user electronic device, the instruction for moving the ultrasound imaging device. The user augmented reality interface may include the video showing the ultrasound imaging device and an arrow superimposed on the video that corresponds to the instruction.
Abstract:
Aspects of the technology described herein relate to methods and apparatuses for identifying gestures based on ultrasound data. Performing gesture recognition may include obtaining, with a wearable device, ultrasound data corresponding to an anatomical gesture; and identifying the anatomical gesture based on the obtained ultrasound data. Interfacing with a computing device may include identifying, with a wearable device, an anatomical gesture using ultrasound data obtained by the wearable device; and causing the computing device to perform a specific function based on the anatomical gesture identified by the wearable device. Training a wearable device to perform gesture recognition may include obtaining, with the wearable device, ultrasound data corresponding to an anatomical gesture; obtaining non-ultrasound data corresponding to the anatomical gesture; and training a machine learning model accessed by the wearable device to recognize the anatomical gesture based on correlating the non-ultrasound data and the ultrasound data.
Abstract:
Ultrasound devices including piezoelectric micromachined ultrasonic transducers (PMUTs) are described. Frequency tunable PMUT arrays are provided. The PMUTs may be formed on the same substrate or a different substrate than an integrated circuit substrate. The PMUTs may be formed in a variety of ways and from various suitable piezoelectric materials.
Abstract:
Aspects of the technology described herein relate to techniques for guiding an operator to use an ultrasound device. Thereby, operators with little or no experience operating ultrasound devices may capture medically relevant ultrasound images and/or interpret the contents of the obtained ultrasound images. For example, some of the techniques disclosed herein may be used to identify a particular anatomical view of a subject to image with an ultrasound device, guide an operator of the ultrasound device to capture an ultrasound image of the subject that contains the particular anatomical view, and/or analyze the captured ultrasound image to identify medical information about the subject.
Abstract:
Micromachined ultrasonic transducers formed in complementary metal oxide semiconductor (CMOS) wafers are described, as are methods of fabricating such devices. A metallization layer of a CMOS wafer may be removed by sacrificial release to create a cavity of an ultrasonic transducer. Remaining layers may form a membrane of the ultrasonic transducer.
Abstract:
CMOS Ultrasonic Transducers and processes for making such devices are described. The processes may include forming cavities on a first wafer and bonding the first wafer to a second wafer. The second wafer may be processed to form a membrane for the cavities. Electrical access to the cavities may be provided.
Abstract:
A method of forming an ultrasonic transducer device includes forming a patterned metal electrode layer over a substrate, the patterned metal electrode layer comprising a lower layer and an upper layer formed on the lower layer; forming an insulation layer over the patterned metal electrode layer; and planarizing the insulation layer to the upper layer of the patterned metal electrode layer, wherein the upper layer comprises a electrically conductive material that serves as a chemical mechanical polishing (CMP) stop layer that has CMP selectivity with respect to the insulation layer and the lower layer, and wherein the upper layer has a CMP removal rate slower than that of the insulation layer.
Abstract:
Ultrasound devices including piezoelectric micromachined ultrasonic transducers (PMUTs) are described. Frequency tunable PMUT arrays are provided. The PMUTs may be formed on the same substrate or a different substrate than an integrated circuit substrate. The PMUTs may be formed in a variety of ways and from various suitable piezoelectric materials.
Abstract:
Aspects of the technology described herein relate to an ultrasound device including a first die that includes an ultrasonic transducer, a first application- specific integrated circuit (ASIC) that is bonded to the first die and includes a pulser, and a second ASIC in communication with the second ASIC that includes integrated digital receive circuitry. In some embodiments, the first ASIC may be bonded to the second ASIC and the second ASIC may include analog processing circuitry and an analog-to-digital converter. In such embodiments, the second ASIC may include a through-silicon via (TSV) facilitating communication between the first ASIC and the second ASIC. In some embodiments, SERDES circuitry facilitates communication between the first ASIC and the second ASIC and the first ASIC includes analog processing circuitry and an analog-to-digital converter. In some embodiments, the technology node of the first ASIC is different from the technology node of the second ASIC.