公开(公告)号：EP3471897A1

公开(公告)日：2019-04-24

申请号：EP17815997.6

申请日：2017-06-19

Applicant: Butterfly Network, Inc.

Inventor： ROTHBERG, Jonathan M. ,  ALIE, Susan A. ,  ZAHORIAN, Jaime Scott ,  CRISTMAN, Paul Francis ,  FIFE, Keith G.

IPC: B06B1/02 ,  A61B8/12 ,  A61B8/14 ,  B06B1/06 ,  G01S15/89 ,  H01R4/02 ,  H01R12/51

公开(公告)号：EP3024594A2

公开(公告)日：2016-06-01

申请号：EP14747787.1

申请日：2014-07-22

Applicant: Butterfly Network Inc.

Inventor： ROTHBERG, Jonathan M. ,  FIFE, Keith G. ,  SANCHEZ, Nevada J. ,  RALSTON, Tyler S. ,  CHARVAT, Gregory L. ,  CORTEVILLE, Gregory

IPC: B06B1/02 ,  A61B8/00 ,  G01S7/00

CPC classification number: A61B8/4444 ,  A61B8/13 ,  A61B8/14 ,  A61B8/4411 ,  A61B8/4477 ,  A61B8/4483 ,  A61B8/4488 ,  A61B8/4494 ,  A61B8/483 ,  A61B8/5207 ,  A61B8/54 ,  A61B8/56 ,  A61N7/02 ,  A61N2007/0078 ,  B06B1/0292 ,  G01S7/003 ,  G01S7/5208 ,  G01S7/52084 ,  G01S15/8915 ,  G03B27/423 ,  G03B27/52 ,  Y10T29/49005

Abstract: Ultrasound devices and methods are described, including a repeatable ultrasound transducer probe having ultrasonic transducers and corresponding circuitry. The repeatable ultrasound transducer probe may be used individually or coupled with other instances of the repeatable ultrasound transducer probe to create a desired ultrasound device. The ultrasound devices may optionally be connected to various types of external devices to provide additional processing and image rendering functionality.

Abstract translation: 描述了超声装置和方法，包括具有超声波换能器和相应电路的可重复的超声换能器探头。 可重复的超声换能器探针可以单独使用或与可重复的超声换能器探头的其它实例相结合以产生所需的超声波装置。 超声设备可以可选地连接到各种类型的外部设备以提供额外的处理和图像呈现功能。

公开(公告)号：EP3880373A1

公开(公告)日：2021-09-22

申请号：EP19885512.4

申请日：2019-11-12

Applicant: Butterfly Network, Inc.

Inventor： FIFE, Keith G. ,  MIAO, Lingyun ,  LIU, Jianwei ,  ROTHBERG, Jonathan M.

IPC: B06B1/02 ,  B81C3/00

公开(公告)号：EP3169450A1

公开(公告)日：2017-05-24

申请号：EP15744805.1

申请日：2015-07-14

Applicant: Butterfly Network Inc.

Inventor： ROTHBERG, Jonathan M. ,  ALIE, Susan A. ,  FIFE, Keith G. ,  SANCHEZ, Nevada J. ,  RALSTON, Tyler S.

IPC: B06B1/02

CPC classification number: G01N29/2406 ,  A61B8/4483 ,  B06B1/0292 ,  B81B7/007 ,  B81B2201/0271 ,  B81C1/00238 ,  B81C1/00301 ,  B81C2201/019 ,  B81C2203/036 ,  B81C2203/0792 ,  H01L2224/4813 ,  H01L2924/0002 ,  H01L2924/146 ,  H01L2924/1461

Abstract: Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities in a substrate. Wafer bonding may also be used to bond the substrate to another substrate, such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature.

Abstract translation: 描述了与互补金属氧化物半导体（CMOS）衬底集成的微机械超声换能器，以及制造这种器件的方法。 制造可能涉及两个独立的晶圆键合步骤。 晶片键合可用于在衬底中制造密封的空腔。 晶圆键合也可用于将衬底键合到另一衬底，例如CMOS晶圆。 至少第二晶片接合可以在低温下进行。

公开(公告)号：EP2972473A2

公开(公告)日：2016-01-20

申请号：EP14718839.5

申请日：2014-03-13

Applicant: Butterfly Network Inc.

Inventor： ROTHBERG, Jonathan M. ,  FIFE, Keith G. ,  RALSTON, Tyler S. ,  CHARVAT, Gregory L ,  SANCHEZ, Nevada J.

IPC: G01S7/52 ,  B06B1/02 ,  G01S15/89 ,  B81C1/00

CPC classification number: A61B8/4494 ,  A61B8/14 ,  A61B8/145 ,  A61B8/4483 ,  A61B8/4488 ,  A61B8/485 ,  A61B8/54 ,  A61N7/00 ,  A61N7/02 ,  B06B1/02 ,  B81C1/00246 ,  G01S7/52019 ,  G01S7/52034 ,  G01S7/52047 ,  G01S7/5208 ,  G01S15/02 ,  G01S15/8915 ,  G01S15/8977 ,  H04R1/00 ,  Y10T29/41

Abstract: To implement a single-chip ultrasonic imaging solution, on-chip signal processing may be employed in the receive signal path to reduce data bandwidth and a high-speed serial data module may be used to move data for all received channels off-chip as digital data stream. The digitization of received signals on-chip allows advanced digital signal processing to be performed on-chip, and thus permits the full integration of an entire ultrasonic imaging system on a single semiconductor substrate. Various novel waveform generation techniques, transducer configuration and biasing methodologies, etc., are likewise disclosed. HIFU methods may additionally or alternatively be employed as a component of the "ultrasound- on- a-chip" solution disclosed herein.

公开(公告)号：EP3132441B1

公开(公告)日：2020-11-25

申请号：EP15722303.3

申请日：2015-04-17

Applicant: Butterfly Network, Inc.

Inventor： ROTHBERG, Jonathan M. ,  RALSTON, Tyler S. ,  SANCHEZ, Nevada J. ,  CASPER, Andrew J.

IPC: G10K11/34 ,  B06B1/06 ,  G01S7/52 ,  G01S7/524 ,  H03K5/13 ,  G01S15/89 ,  H03K5/00

公开(公告)号：EP3678555A1

公开(公告)日：2020-07-15

申请号：EP18852850.9

申请日：2018-09-06

Applicant: Butterfly Network, Inc.

Inventor： ROTHBERG, Jonathan M. ,  FERGUS, Gregg ,  FIFE, Keith G. ,  RALSTON, Tyler S. ,  SANCHEZ, Nevada J. ,  ZAHORIAN, Jaime Scott ,  CHEN, Kailiang ,  MCNULTY, Christopher Thomas

IPC: A61B8/06 ,  A61B8/08 ,  A61B5/02

公开(公告)号：EP3592474A1

公开(公告)日：2020-01-15

申请号：EP18763963.8

申请日：2018-03-07

Applicant: Butterfly Network, Inc.

Inventor： ROTHBERG, Jonathan M. ,  ALIE, Susan A. ,  FIFE, Keith G. ,  SANCHEZ, Nevada J. ,  RALSTON, Tyler S. ,  ZAHORIAN, Jaime Scott

IPC: B06B1/02 ,  B81B1/00 ,  B81C1/00 ,  B81C3/00 ,  H01L21/02 ,  G10K11/18 ,  G10K11/36

公开(公告)号：EP3586093A1

公开(公告)日：2020-01-01

申请号：EP18758144.2

申请日：2018-02-26

Applicant: Butterfly Network, Inc.

Inventor： ROTHBERG, Jonathan M. ,  FIFE, Keith G. ,  ALIE, Susan A. ,  LUTSKY, Joseph ,  GROSJEAN, David

IPC: G01H11/00 ,  B06B1/06 ,  H01L41/04 ,  H01L21/46