Abstract:
A chemical reaction apparatus includes a solid body which has an outer surface, and in which at least one flow path which allows a chemical medium to flow is formed. This body has a heating element which heats the chemical medium in the flow path to accelerate a chemical reaction of the chemical medium, and a heat radiation preventing film which covers at least a portion of the outer surface of the body, and prevents radiation of heat generated by the heating element from a portion of the outer surface.
Abstract:
PROBLEM TO BE SOLVED: To provide a spintronics device high in charge current to spin current conversion efficiency, and capable of providing a high-intensity spin current. SOLUTION: This spintronics device includes: a spin current generation region 30 having a first end face and a second end face facing each other, and formed of a nonmagnetic bipolar conductive metal wherein a hole and an electron have carrier densities and mobilities at comparable levels, and a hole coefficient is zero; a first main electrode 20 arranged on the first end face and formed of a ferromagnetic material for injecting spin-polarized holes into the spin current generation region 30; and a second main electrode 40 arranged on the second end face for injecting electrons into the spin current generation region 30. Holes and electrons are made to be transported in the same direction by Lorentz force, and charge of the holes and that of the electrons are neutralized with each other to provide the spin current. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a light-emitting device and a method of manufacturing the same, compact with a structure of high heat dissipation efficiency, capable of restraining degradation of element life and emission characteristics of light-emitting elements, as well as an electronic equipment having a light-emitting panel with fluctuation of luminance restrained. SOLUTION: A display panel 100 is provided with a panel structure in which an array substrate 10 with pixel arrays 21 fitted and a sealing substrate 30 with recessed parts 36 fitted are jointed in opposition to each other. The array substrate 10 is provided with high-radiation thin film 22 so as to cover the pixel arrays 21, and the sealing substrate 30 is provided with high-radiation thin film 32 so as to be opposed to the pixel arrays 21. Further, a high thermal-conductivity gas is sealed in a sealing space 35 formed by jointing the array substrate 10 and the sealing substrate 30. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a device and method for manufacturing a thin film electrode, in which the thin film electrode having uniform film quality of high quality is formed with satisfactory reproducibility while stably controlling film-deposition speed. SOLUTION: As for an electron beam vacuum deposition device 100, a raw material housing part comprising a water cooled hearth 111, an insertion crucible 112A and an adhesion tool 113A is provided in a vacuum chamber 110. The adhesion tool 113A is interposed between the water cooled hearth 111 and the insertion crucible 112A and has a shape uniformly adhering to a part between an inner surface (a side surface and a bottom surface) of a recessed part 111a of the water cooled hearth 111 and an outer peripheral surface (a side surface and a bottom surface) of the insertion crucible 112A. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a fuel cell device suppressing heat conducted from a power generation cell to the outside in starting while suppressing power loss in stationary operation. SOLUTION: The fuel cell device includes the power generation cell generating electric power by reaction between a fuel and oxygen, an output electrode electrically connected to an electrode of the power generation cell and a conductive member provided to be connected to/disconnected from the output electrode at one end and electrically connected to the electrode of the power generation cell at the other end. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To suppress heat energy loss in a chemical reaction apparatus supplying heat energy to a catalyst layer installed inside a minute passage formed on one surface of a substrate. SOLUTION: Substrates 11, 21 are joined each other. A reaction catalyst layer 15 is installed inside the meandering minute passage 12 formed on the inner surface of the first substrate 11. A heat radiation preventing film 16 is installed on the outer surface of the first substrate 11. A thin film heater 22 is installed on a surface facing the first substrate of the second substrate 21. A heat radiation preventing film 23 is installed on the outer surface of the second substrate 21. Specified heat energy is supplied to the reaction catalyst layer 15 inside the passage 12 by the thin film heater 22 during chemical reaction, and heat radiation from the outer surfaces of the substrates 11, 21 is suppressed with both heat radiation preventing films 16, 23 to suppress the heat energy loss. COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide a metallic mask optimum for dry etching, a high performance ink-jet printer head provided with the metallic mask, and a production method thereof. SOLUTION: A silicon wafer having an orifice plate laminated on the uppermost laver of a large number of head chips, is set on a stage of a film forming chamber of a sputterina device so as to execute a film forming pretreatment of heating at l00 deg.C-150 deg.C for 30 minutes or more and cooling down to 20-30 deg.C (room temperature). Then, a sputtering operation is executed on the orifice plate with Ti of a 99.999% or more purity, 4.0±1.2 Pa vacuum pressure, 70±25W main sputtering power, Ar sputtering gas conditions so as to form a Ti thin film with characteristics of a 3-4 mΩcm specific resistance and a non-hexagnal close-packed structure without an optical multiple reflection. After forming a mask pattern corresponding to an ejection nozzle on the Ti film, a perforating process is executed by a helicon wave dry etching device.
Abstract:
PROBLEM TO BE SOLVED: To provide a heating resistor having a protecting film of a film thickness of 100-500 Å and a high resistance to cavitation damage and electrolytic etching and its manufacture. SOLUTION: An approximately 7000 Å film of a double-layer structure of TaSiO is first formed by a thin film formation technique, on which an electrode film is formed. An electrode pattern of a common electrode 18 and an individual wiring electrode 21 is formed to the electrode film by a photolithographic technique, and a heating element pattern of a 40 μm×40 μm heating part 22 is formed to a resistor film of the double-layer structure. An Si/Ta mole ratio of an upper layer 22b of the resistor film of the double-layer structure is set smaller than an Si/Ta mole ratio of a lower layer 22a. The upper layer 22b including much Ta is oxidized with heat by annealing (heat treatment) for 10 minutes at a substrate temperature of 400 deg.C. In consequence, a 100-500 Åautoxidation protecting layer 22b-1 of a TaSiO film is formed on the heating part 22.
Abstract:
PURPOSE:To provide an electron emitting electrode capable of operating at a low voltage by forming a plurality of tapered projections on the electrode. CONSTITUTION:An electron emitting electrode 1 is provided, on the surface of an electrode main body 2, with projections 3 each made of substance having a work function smaller than that constituting the electrode main body 2. The projection 3 is formed into a conical shape becoming smaller from the electrode main body 2 toward the tip thereof. The plurality of projections 3 are aligned in the longitudinal direction of the electrode main body 2. In the electron emitting electrode 1, electric field strength of the conical projection 3, particularly at the tip thereof becomes large, and operating at a low voltage can be realized. Since the projection 3 is made of substance having a work function smaller than that constituting the electrode main body 2, the electric field strength of the projection 3 becomes further large and a drive voltage becomes further lower.
Abstract:
PURPOSE:To provide high carrier mobility and high carrier concentration and to accelerate a switching speed by forming a carrier moving layer in a doping superlattice structure formed of a doped layer and an undoped layer. CONSTITUTION:A carrier moving layer 14 has a doping superlattice structure formed by alternately laminating N-type GaAs layers 21 in which an impurity such as Si is doped and GaAs layers 22 in which it is not doped. In this case, the thickness of each layer is preferably extremely thin such as 100Angstrom or less. Particularly, the layer 21 is preferably 1 to 50Angstrom , and the layer 22 is preferably 50-100Angstrom thick. The number of the laminated layers is preferably 4 to 30. In this case, the layer 14 can obtain electrons as moving carrier from the layer 21. A potential difference between the layers 21 and 22 is very small. The layer 22 is not affected by the influence of the ionized impurity, and the electrons can move at a high speed.