公开(公告)号：US20220110209A1

公开(公告)日：2022-04-07

申请号：US17470038

申请日：2021-09-09

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Shih-Chieh Chang ,  Hui-Yu Huang ,  Chih-Ming Peng ,  Chun-Te Lee

IPC: H05K1/02 ,  H05K1/18 ,  H05K1/14

Abstract: A storage device of the present invention is provided to store flexible circuit packages, each of the flexible circuit packages includes an electronic component and two circuit portions warped at both sides of the electronic component, respectively. The storage device includes a first carrier and a second carrier. The first carrier includes first accommodation elements provided for placement of the flexible circuit packages, and the second carrier includes a first press portion and a second press portion. As the second carrier is placed on the first carrier, the first and second press portions are provided to press the two circuit portions warped upwardly toward the second carrier so as to reduce the warpage of the two circuit portions.

公开(公告)号：US11234328B2

公开(公告)日：2022-01-25

申请号：US17032244

申请日：2020-09-25

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Chia-En Fan ,  Hui-Yu Huang ,  Chih-Ming Peng ,  Chun-Te Lee

IPC: H05K1/02 ,  H05K1/11

Abstract: A circuit board disclosed in the present invention includes a substrate and a circuit layer. The circuit layer is formed on a surface of the substrate and includes at least one test circuit line. The test circuit line includes a main segment and a branch segment connected with each other. The branch segment is provided to be contacted with a test equipment for electrical test so as to protect the main segment from breaking during electrical test.

公开(公告)号：US20210159159A1

公开(公告)日：2021-05-27

申请号：US16833826

申请日：2020-03-30

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Chun-Te Lee ,  Chih-Ming Peng ,  Hui-Yu Huang ,  Yin-Chen Lin

IPC: H01L23/498 ,  H01L23/00

Abstract: A layout structure of double-sided flexible circuit board includes a flexible substrate having a first surface and a second surface, a first circuit layer and a second circuit layer. An inner bonding region is defined on the first surface and an inner supporting region is defined on the second surface according to the inner bonding region. The first circuit layer is located on the first surface and includes first conductive lines which each includes an inner lead located on the inner bonding region. The second circuit layer is located on the second surface and includes second conductive lines which each includes an inner supporting segment located on the inner supporting region. A width difference between any two of the inner supporting segment of the second conductive lines is less than 8 μm.

公开(公告)号：US20240014118A1

公开(公告)日：2024-01-11

申请号：US18214572

申请日：2023-06-27

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Chun-Te Lee ,  Chih-Ming Peng ,  Pi-Yu Peng ,  Hui-Yu Huang ,  Yin-Chen Lin

IPC: H01L23/498 ,  H01L23/00

CPC classification number: H01L23/49838 ,  H01L24/16 ,  H01L24/14 ,  H01L24/13 ,  H01L2224/14163 ,  H01L2224/13013 ,  H01L2224/16227

Abstract: In a flip chip package, lines, an identification line and a dummy line are provided on a first surface of a light-transmissive carrier, and a supportive layer is disposed on a second surface of the light-transmissive carrier. Bumps and an identification bump of a chip are bonded to the lines and the identification line, respectively. Shadows of the dummy line, the identification line and the identification bump which are projected on the second surface are visible from an opening of the supportive layer. The shadows can be inspected through the opening so as to know whether the bumps are bonded to the lines correctly.

公开(公告)号：US20230039895A1

公开(公告)日：2023-02-09

申请号：US17741543

申请日：2022-05-11

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Yin-Chen Lin ,  Hui-Yu Huang ,  Chih-Ming Peng ,  Chun-Te Lee

IPC: H05K1/02 ,  H05K1/11

Abstract: A double-sided flexible circuit board includes a flexible substrate, through circuit lines, first circuit lines and second circuit lines. The first circuit lines are formed on a top surface of the flexible substrate and each includes a first segment, a bent segment and a second segment. One end of the first segment is connected to a first connection end of one of the through circuit lines. Both ends of the bent segment are connected to the other end of the first segment and one end of the second segment, respectively. A second distance between the adjacent second segments is greater than a first distance between the adjacent first segments. The second circuit lines are formed on a bottom surface of the flexible substrate and each is connected to a second connection end of one of the through circuit lines.

公开(公告)号：US11206735B2

公开(公告)日：2021-12-21

申请号：US17160483

申请日：2021-01-28

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Yin-Chen Lin ,  Hui-Yu Huang ,  Chih-Ming Peng ,  Chun-Te Lee

IPC: H05K1/02

Abstract: A flexible circuit board includes a flexible light-permeable carrier, a circuit layer, a mark and a stiffener. The circuit layer and the mark are located on a top surface of the flexible light-permeable carrier. A predetermined area and a stiffener mounting area corresponding to each other are defined on the top surface and a bottom surface of the flexible light-permeable carrier, respectively. The mark is opaque to create a shadow mark having a longitudinal reference side and a lateral reference side on the bottom surface. The stiffener is adhered to the stiffener mounting area defined on the bottom surface by aligning with the longitudinal reference side and the lateral reference side of the shadow mark.

公开(公告)号：US11178756B2

公开(公告)日：2021-11-16

申请号：US17160483

申请日：2021-01-28

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Yin-Chen Lin ,  Hui-Yu Huang ,  Chih-Ming Peng ,  Chun-Te Lee

IPC: H05K1/02

Abstract: A flexible circuit board includes a flexible light-permeable carrier, a circuit layer, a mark and a stiffener. The circuit layer and the mark are located on a top surface of the flexible light-permeable carrier. A predetermined area and a stiffener mounting area corresponding to each other are defined on the top surface and a bottom surface of the flexible light-permeable carrier, respectively. The mark is opaque to create a shadow mark having a longitudinal reference side and a lateral reference side on the bottom surface. The stiffener is adhered to the stiffener mounting area defined on the bottom surface by aligning with the longitudinal reference side and the lateral reference side of the shadow mark.