-
公开(公告)号：US20230044473A1
公开(公告)日：2023-02-09
申请号：US17837145
申请日：2022-06-10
Applicant: CHIPBOND TECHNOLOGY CORPORATION
Inventor： Yin-Chen Lin , Hui-Yu Huang , Chih-Ming Peng , Chun-Te Lee
Abstract: A double-sided flexible circuit board includes a flexible substrate, a first circuit layer, a second circuit layer, an insulating protection layer and a plurality of through circuit lines. The first and second circuit layers are located on a top surface and a bottom surface of the flexible substrate, respectively. The insulating protection layer covers a supporting line of the second circuit layer such that the supporting line is located between the flexible substrate and the insulating protection layer. The insulating protection layer can provide electrical insulation to the supporting line of the second circuit layer to avoid short circuit conditions of the double-sided flexible circuit board during test.
-
公开(公告)号：US20220087017A1
公开(公告)日：2022-03-17
申请号：US17380121
申请日：2021-07-20
Applicant: CHIPBOND TECHNOLOGY CORPORATION
Inventor： Yin-Chen Lin , Ming-Hsiao Ke , Hui-Yu Huang , Chih-Ming Peng , Chun-Te Lee
Abstract: A circuit board tape includes substrate units each including a sprocket-hole region, a layout region and a joining mark. There are odd and more than three sprocket holes on the sprocket-hole region. An imaginary line extended from the joining mark is extended to between a first layout and a second layout located on the layout region. The amount of the sprocket holes between the imaginary lines of the adjacent substrate units is odd. The circuit board tape is cut along the imaginary lines of the different substrate units so as to remove the defective substrate unit from the circuit board tape and divide the circuit board tape into a front tape and a rear tape. After joining the front and rear tapes, the region where a first layout on the front tape and a second layout on the rear tape are located is defined as a combined layout region.
-
公开(公告)号：US12089326B2
公开(公告)日：2024-09-10
申请号：US17741543
申请日：2022-05-11
Applicant: CHIPBOND TECHNOLOGY CORPORATION
Inventor： Yin-Chen Lin , Hui-Yu Huang , Chih-Ming Peng , Chun-Te Lee
CPC classification number: H05K1/0298 , H05K1/115 , H05K1/118 , H05K1/111 , H05K1/189 , H05K2201/10674
Abstract: A double-sided flexible circuit board includes a flexible substrate, through circuit lines, first circuit lines and second circuit lines. The first circuit lines are formed on a top surface of the flexible substrate and each includes a first segment, a bent segment and a second segment. One end of the first segment is connected to a first connection end of one of the through circuit lines. Both ends of the bent segment are connected to the other end of the first segment and one end of the second segment, respectively. A second distance between the adjacent second segments is greater than a first distance between the adjacent first segments. The second circuit lines are formed on a bottom surface of the flexible substrate and each is connected to a second connection end of one of the through circuit lines.
-
公开(公告)号：US11602047B2
公开(公告)日：2023-03-07
申请号：US17380121
申请日：2021-07-20
Applicant: CHIPBOND TECHNOLOGY CORPORATION
Inventor： Yin-Chen Lin , Ming-Hsiao Ke , Hui-Yu Huang , Chih-Ming Peng , Chun-Te Lee
Abstract: A circuit board tape includes substrate units each including a sprocket-hole region, a layout region and a joining mark. There are odd and more than three sprocket holes on the sprocket-hole region. An imaginary line extended from the joining mark is extended to between a first layout and a second layout located on the layout region. The amount of the sprocket holes between the imaginary lines of the adjacent substrate units is odd. The circuit board tape is cut along the imaginary lines of the different substrate units so as to remove the defective substrate unit from the circuit board tape and divide the circuit board tape into a front tape and a rear tape. After joining the front and rear tapes, the region where a first layout on the front tape and a second layout on the rear tape are located is defined as a combined layout region.
-
公开(公告)号：US20210159159A1
公开(公告)日：2021-05-27
申请号：US16833826
申请日：2020-03-30
Applicant: CHIPBOND TECHNOLOGY CORPORATION
Inventor： Chun-Te Lee , Chih-Ming Peng , Hui-Yu Huang , Yin-Chen Lin
IPC: H01L23/498 , H01L23/00
Abstract: A layout structure of double-sided flexible circuit board includes a flexible substrate having a first surface and a second surface, a first circuit layer and a second circuit layer. An inner bonding region is defined on the first surface and an inner supporting region is defined on the second surface according to the inner bonding region. The first circuit layer is located on the first surface and includes first conductive lines which each includes an inner lead located on the inner bonding region. The second circuit layer is located on the second surface and includes second conductive lines which each includes an inner supporting segment located on the inner supporting region. A width difference between any two of the inner supporting segment of the second conductive lines is less than 8 μm.
-
Patent Agency Ranking
公开(公告)号：US11177206B2
公开(公告)日：2021-11-16
申请号：US16833826
申请日：2020-03-30
Applicant: CHIPBOND TECHNOLOGY CORPORATION
Inventor： Chun-Te Lee , Chih-Ming Peng , Hui-Yu Huang , Yin-Chen Lin
IPC: H01L23/498 , H01L23/00
Abstract: A layout structure of double-sided flexible circuit board includes a flexible substrate having a first surface and a second surface, a first circuit layer and a second circuit layer. An inner bonding region is defined on the first surface and an inner supporting region is defined on the second surface according to the inner bonding region. The first circuit layer is located on the first surface and includes first conductive lines which each includes an inner lead located on the inner bonding region. The second circuit layer is located on the second surface and includes second conductive lines which each includes an inner supporting segment located on the inner supporting region. A width difference between any two of the inner supporting segment of the second conductive lines is less than 8 μm.
-
公开(公告)号：US20210267049A1
公开(公告)日：2021-08-26
申请号：US17160483
申请日：2021-01-28
Applicant: CHIPBOND TECHNOLOGY CORPORATION
Inventor： Yin-Chen Lin , Hui-Yu Huang , Chih-Ming Peng , Chun-Te Lee
IPC: H05K1/02
Abstract: A flexible circuit board includes a flexible light-permeable carrier, a circuit layer, a mark and a stiffener. The circuit layer and the mark are located on a top surface of the flexible light-permeable carrier. A predetermined area and a stiffener mounting area corresponding to each other are defined on the top surface and a bottom surface of the flexible light-permeable carrier, respectively. The mark is opaque to create a shadow mark having a longitudinal reference side and a lateral reference side on the bottom surface. The stiffener is adhered to the stiffener mounting area defined on the bottom surface by aligning with the longitudinal reference side and the lateral reference side of the shadow mark.
-
公开(公告)号：US09247635B2
公开(公告)日：2016-01-26
申请号：US14317254
申请日：2014-06-27
Applicant: CHIPBOND TECHNOLOGY CORPORATION
Inventor： Yi-Wen Chen , Yin-Chen Lin , Ming-Hsiao Ke , Yu-Chen Ma
CPC classification number: H05K1/0269 , H05K1/0274 , H05K1/028 , H05K1/0298 , H05K2201/09781 , H05K2201/0989 , H05K2201/09936
Abstract: A flexible substrate includes a base layer, a metallic layer, a solder mask layer and an identifying code, the metallic layer is disposed at a first surface of the base layer, the metallic layer comprises a plurality of traces and at least one bottom block used for defining marked position, wherein the traces and the at least one bottom block are covered with the solder mask layer, wherein above the perpendicular direction of the at least one bottom block of the metallic layer, a pre-marked area is defined on an exposing surface of the solder mask layer and by an outlined edge of the at least one bottom block, and the identifying code is formed within the pre-marked area of the solder mask layer.
Abstract translation: 柔性基板包括基底层，金属层，焊接掩模层和识别代码，金属层设置在基底层的第一表面，金属层包括多个迹线和至少一个使用的底部块 用于限定标记位置，其中所述迹线和所述至少一个底部块被所述焊接掩模层覆盖，其中在所述金属层的所述至少一个底部块的垂直方向上方，预先标记的区域被限定在曝光 焊料掩模层的表面和至少一个底部块的轮廓边缘，并且识别代码形成在焊料掩模层的预先标记的区域内。
-
公开(公告)号：US20240014118A1
公开(公告)日：2024-01-11
申请号：US18214572
申请日：2023-06-27
Applicant: CHIPBOND TECHNOLOGY CORPORATION
Inventor： Chun-Te Lee , Chih-Ming Peng , Pi-Yu Peng , Hui-Yu Huang , Yin-Chen Lin
IPC: H01L23/498 , H01L23/00
CPC classification number: H01L23/49838 , H01L24/16 , H01L24/14 , H01L24/13 , H01L2224/14163 , H01L2224/13013 , H01L2224/16227
Abstract: In a flip chip package, lines, an identification line and a dummy line are provided on a first surface of a light-transmissive carrier, and a supportive layer is disposed on a second surface of the light-transmissive carrier. Bumps and an identification bump of a chip are bonded to the lines and the identification line, respectively. Shadows of the dummy line, the identification line and the identification bump which are projected on the second surface are visible from an opening of the supportive layer. The shadows can be inspected through the opening so as to know whether the bumps are bonded to the lines correctly.
-
公开(公告)号：US20230039895A1
公开(公告)日：2023-02-09
申请号：US17741543
申请日：2022-05-11
Applicant: CHIPBOND TECHNOLOGY CORPORATION
Inventor： Yin-Chen Lin , Hui-Yu Huang , Chih-Ming Peng , Chun-Te Lee
Abstract: A double-sided flexible circuit board includes a flexible substrate, through circuit lines, first circuit lines and second circuit lines. The first circuit lines are formed on a top surface of the flexible substrate and each includes a first segment, a bent segment and a second segment. One end of the first segment is connected to a first connection end of one of the through circuit lines. Both ends of the bent segment are connected to the other end of the first segment and one end of the second segment, respectively. A second distance between the adjacent second segments is greater than a first distance between the adjacent first segments. The second circuit lines are formed on a bottom surface of the flexible substrate and each is connected to a second connection end of one of the through circuit lines.
-
-
-
-
-
-
-
-
-
Search Results
13
records
(took 0.021 seconds)
