公开(公告)号：US20230044473A1

公开(公告)日：2023-02-09

申请号：US17837145

申请日：2022-06-10

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Yin-Chen Lin ,  Hui-Yu Huang ,  Chih-Ming Peng ,  Chun-Te Lee

IPC: H05K1/02 ,  H05K1/11

Abstract: A double-sided flexible circuit board includes a flexible substrate, a first circuit layer, a second circuit layer, an insulating protection layer and a plurality of through circuit lines. The first and second circuit layers are located on a top surface and a bottom surface of the flexible substrate, respectively. The insulating protection layer covers a supporting line of the second circuit layer such that the supporting line is located between the flexible substrate and the insulating protection layer. The insulating protection layer can provide electrical insulation to the supporting line of the second circuit layer to avoid short circuit conditions of the double-sided flexible circuit board during test.

公开(公告)号：US20210267047A1

公开(公告)日：2021-08-26

申请号：US17032244

申请日：2020-09-25

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Chia-En Fan ,  Hui-Yu Huang ,  Chih-Ming Peng ,  Chun-Te Lee

IPC: H05K1/02 ,  H05K1/11

Abstract: A circuit board disclosed in the present invention includes a substrate and a circuit layer. The circuit layer is formed on a surface of the substrate and includes at least one test circuit line. The test circuit line includes a main segment and a branch segment connected with each other. The branch segment is provided to be contacted with a test equipment for electrical test so as to protect the main segment from breaking during electrical test.

公开(公告)号：US11177206B2

公开(公告)日：2021-11-16

申请号：US16833826

申请日：2020-03-30

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Chun-Te Lee ,  Chih-Ming Peng ,  Hui-Yu Huang ,  Yin-Chen Lin

IPC: H01L23/498 ,  H01L23/00

Abstract: A layout structure of double-sided flexible circuit board includes a flexible substrate having a first surface and a second surface, a first circuit layer and a second circuit layer. An inner bonding region is defined on the first surface and an inner supporting region is defined on the second surface according to the inner bonding region. The first circuit layer is located on the first surface and includes first conductive lines which each includes an inner lead located on the inner bonding region. The second circuit layer is located on the second surface and includes second conductive lines which each includes an inner supporting segment located on the inner supporting region. A width difference between any two of the inner supporting segment of the second conductive lines is less than 8 μm.

公开(公告)号：US20210267049A1

公开(公告)日：2021-08-26

申请号：US17160483

申请日：2021-01-28

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Yin-Chen Lin ,  Hui-Yu Huang ,  Chih-Ming Peng ,  Chun-Te Lee

IPC: H05K1/02

Abstract: A flexible circuit board includes a flexible light-permeable carrier, a circuit layer, a mark and a stiffener. The circuit layer and the mark are located on a top surface of the flexible light-permeable carrier. A predetermined area and a stiffener mounting area corresponding to each other are defined on the top surface and a bottom surface of the flexible light-permeable carrier, respectively. The mark is opaque to create a shadow mark having a longitudinal reference side and a lateral reference side on the bottom surface. The stiffener is adhered to the stiffener mounting area defined on the bottom surface by aligning with the longitudinal reference side and the lateral reference side of the shadow mark.

公开(公告)号：US20230380053A1

公开(公告)日：2023-11-23

申请号：US18134082

申请日：2023-04-13

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Chun-Te Lee ,  Chih-Ming Peng ,  Pi-Yu Peng ,  Hui-Yu Huang

IPC: H05K1/02 ,  H01L21/60 ,  H05K3/00 ,  H05K1/03

CPC classification number: H05K1/0266 ,  H01L21/60 ,  H05K3/0044 ,  H05K1/03 ,  H01L2021/60022 ,  H05K2201/10893

Abstract: A flip-chip bonding structure includes a chip and a circuit board, the chip is bonded to the circuit board by bumps. The circuit board includes a light-transmissive substrate, a first circuit group, a second circuit group, a boundary circuit and an identifying member. The boundary circuit is located between the first and second circuit groups and projects a boundary circuit shadow on light-transmissive substrate. The boundary circuit shadow can be recognized according to the identifying member and is provided to identify the boundary between the first and second circuit groups or identify the position of leads with the smallest pitch.

公开(公告)号：US11792923B2

公开(公告)日：2023-10-17

申请号：US17470038

申请日：2021-09-09

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Shih-Chieh Chang ,  Hui-Yu Huang ,  Chih-Ming Peng ,  Chun-Te Lee

IPC: H05K1/18 ,  H05K1/02 ,  H05K1/14

CPC classification number: H05K1/0277 ,  H05K1/14 ,  H05K1/189 ,  H05K2201/09036

Abstract: A storage device of the present invention is provided to store flexible circuit packages, each of the flexible circuit packages includes an electronic component and two circuit portions warped at both sides of the electronic component, respectively. The storage device includes a first carrier and a second carrier. The first carrier includes first accommodation elements provided for placement of the flexible circuit packages, and the second carrier includes a first press portion and a second press portion. As the second carrier is placed on the first carrier, the first and second press portions are provided to press the two circuit portions warped upwardly toward the second carrier so as to reduce the warpage of the two circuit portions.

公开(公告)号：US20220087017A1

公开(公告)日：2022-03-17

申请号：US17380121

申请日：2021-07-20

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Yin-Chen Lin ,  Ming-Hsiao Ke ,  Hui-Yu Huang ,  Chih-Ming Peng ,  Chun-Te Lee

IPC: H05K1/03 ,  H05K13/04 ,  H05K13/02

Abstract: A circuit board tape includes substrate units each including a sprocket-hole region, a layout region and a joining mark. There are odd and more than three sprocket holes on the sprocket-hole region. An imaginary line extended from the joining mark is extended to between a first layout and a second layout located on the layout region. The amount of the sprocket holes between the imaginary lines of the adjacent substrate units is odd. The circuit board tape is cut along the imaginary lines of the different substrate units so as to remove the defective substrate unit from the circuit board tape and divide the circuit board tape into a front tape and a rear tape. After joining the front and rear tapes, the region where a first layout on the front tape and a second layout on the rear tape are located is defined as a combined layout region.

公开(公告)号：US20210185800A1

公开(公告)日：2021-06-17

申请号：US16866796

申请日：2020-05-05

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Yi-Chen Lien ,  Yen-Ping Huang ,  Hui-Yu Huang ,  Chih-Ming Peng ,  Chun-Te Lee

IPC: H05K1/02 ,  H05K3/00

Abstract: A circuit board includes a substrate having a through hole, a circuit layer, a first measurement mark and a second measurement mark. According to the first and second measurement marks, an electronic detection device can measure a first distance between a first edge of the through hole and the first measurement mark and a second distance between a second edge of the through hole and the second measurement mark to determine whether the through hole has an undesired size or shift.

公开(公告)号：US12089326B2

公开(公告)日：2024-09-10

申请号：US17741543

申请日：2022-05-11

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Yin-Chen Lin ,  Hui-Yu Huang ,  Chih-Ming Peng ,  Chun-Te Lee

IPC: H05K1/11 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0298 ,  H05K1/115 ,  H05K1/118 ,  H05K1/111 ,  H05K1/189 ,  H05K2201/10674

Abstract: A double-sided flexible circuit board includes a flexible substrate, through circuit lines, first circuit lines and second circuit lines. The first circuit lines are formed on a top surface of the flexible substrate and each includes a first segment, a bent segment and a second segment. One end of the first segment is connected to a first connection end of one of the through circuit lines. Both ends of the bent segment are connected to the other end of the first segment and one end of the second segment, respectively. A second distance between the adjacent second segments is greater than a first distance between the adjacent first segments. The second circuit lines are formed on a bottom surface of the flexible substrate and each is connected to a second connection end of one of the through circuit lines.

公开(公告)号：US20240008171A1

公开(公告)日：2024-01-04

申请号：US18143133

申请日：2023-05-04

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Wei-Teng Lin ,  Hui-Yu Huang ,  Ching-Chi Chan ,  Shih-Chieh Chang

IPC: H05K1/02 ,  H01L23/00 ,  H01L23/498

CPC classification number: H05K1/0272 ,  H01L24/32 ,  H01L23/49838 ,  H01L23/4985 ,  H01L2224/32225 ,  H01L2224/26175 ,  H01L2924/15151

Abstract: A semiconductor package includes a chip, a circuit board and a filling material. The circuit board includes a substrate, a patterned metal layer and a protective layer. A circuit area, a chip-mounting area and a flow-guiding area are defined on a surface of the substrate. The chip is mounted on the chip-mounting area. A flow-guiding member of the patterned metal layer is arranged on the flow-guiding area and includes a hollow portion and flow-guiding grooves which are communicated with the hollow portion and arranged radially. The flow-guiding grooves are provided to allow the protective layer to flow toward the hollow portion, and the hollow portion and the flow-guiding grooves are provided to allow the filling material to flow toward the protective layer such that the filling material can cover the protective layer to improve structural strength of the semiconductor package.