Abstract:
A method of laser processing a material to form a separated part is described, with also an article comprising sapphire. The method includes focusing a pulsed laser beam (2a) into a laser beam focal line (2b), viewed along the beam propagation direction, directed into the material (1), the laser beam focal line (7) generating an induced absorption within the material (1), the induced absorption producing a hole or fault line along the laser beam focal line (2b) within the material (1), and directing a defocused carbon dioxide (CO2) laser from a distal edge of the material (1) over the plurality of holes to a proximal edge of the material (1).
Abstract:
The present invention relates to a process for cutting and separating interior contours in thin substrates of transparent materials, in particular glass. The method involves the utilization of an ultra-short pulse laser to form perforation or holes in the substrate, that may be followed by use of a CO2 laser beam to promote full separation about the perforated line.
Abstract:
Strengthened glass articles having laser etched features, electronic devices, and methods of fabricating etched features in strengthened glass articles are disclosed. In one embodiment, a strengthened glass article includes a first strengthened surface layer and a second strengthened surface layer under a compressive stress and extending from a first surface and a second surface, respectively, of the strengthened glass article to a depth of layer, and a central region between the first strengthened surface layer and the second strengthened surface layer that is under tensile stress. The strengthened glass article further includes at least one etched feature formed by laser ablation within the first surface or the second surface having a depth that is less than the depth of layer and a surface roughness that is greater than a surface roughness of the first surface or second surface outside of the at least one etched feature.
Abstract:
Glass interposer panels and methods for forming the same are described herein. The interposer panels include a glass substrate core formed from an ion-exchangeable glass. A first layer of compressive stress may extend from a first surface of the glass substrate into the thickness T of the glass substrate core to a first depth of layer D1. A second layer of compressive stress may be spaced apart from the first layer of compressive stress and extending from a second surface of the glass substrate core into the thickness T of the glass substrate core to a second depth of layer D2. A plurality of through-vias may extend through the thickness T of the glass substrate core. Each through-via is surrounded by an intermediate zone of compressive stress that extends from the first layer of compressive stress to the second layer of compressive stress adjacent to a sidewall of each through-via.
Abstract:
A method of laser drilling, forming a perforation, cutting, separating or otherwise processing a material includes focusing a pulsed laser beam into a laser beam focal line, and directing the laser beam focal line into a workpiece comprising a stack including at least: a first layer, facing the laser beam, the first layer being the material to be laser processed, a second layer comprising a carrier layer, and a laser beam disruption element located between the first and second layers, the laser beam focal line generating an induced absorption within the material of the first layer, the induced absorption producing a defect line along the laser beam focal line within the material of the first layer. The beam disruption element may be a beam disruption layer or a beam disruption interface.
Abstract:
A system and method for amplifying an optical signal within an optical waveguide amplifier including providing at least one optical waveguide amplifier having an input for receiving an optical source signal therein and an output, wherein a forward pumping direction extends from the input to the output and rearward pumping direction extends from the output to the input. The system also includes providing at least one excitation light source in optical communication with the optical waveguide amplifier and capable of generating at least one excitation light. The system further includes amplifying the source signal by pumping a first excitation light from the excitation light source in the rearward pumping direction, and amplifying the source signal by simultaneously pumping a second excitation light from the excitation light source in the forward direction.
Abstract:
A long haul, broadband DWDM system that has been optimized by the proper selection of the distribution of total dispersion compensation. Dispersion compensation is utilized at both the receiver and the transmitter ends. System performance is dependent on the ratio of compensation split between the transmitter and the receiver. A system operated in the non-linear regime can be compensated to operate with low BER and with reduced penalties due to residual dispersion effects, even when the spread of the total accumulated dispersion between the extreme channels in a broadband system exceeds 1,000 ps/nm.
Abstract:
A method for arresting propagation of an incident crack through a transparent material includes focusing pulsed laser beams into a laser beam focal line directed into the transparent material a series of locations corresponding to a predetermined pattern that is designed to arrest an incident crack that propagates through the transparent material, and generating, with the laser beam focal line, an induced absorption within the transparent material in order to produce a defect in the transparent material.
Abstract:
Processes of chamfering and/or beveling an edge of a glass or other substrate of arbitrary shape using lasers are described herein. Three general methods to produce chamfers on glass substrates are disclosed. The first method involves cutting the edge with the desired chamfer shape utilizing an ultra-short pulse laser. Treatment with the ultra-short laser may be optionally followed by a CO2 laser for fully automated separation. The second method is based on thermal stress peeling of a sharp edge corner, and it has been demonstrated to work with different combination of an ultrashort pulse and/or CO2 lasers. A third method relies on stresses induced by ion exchange to effect separation of material along a fault line produced by an ultra-short laser to form a chamfered edge of desired shape.
Abstract:
Methods are provided for laser processing arbitrary shapes of molded 3D thin transparent brittle parts from substrates with particular interest in substrates formed from strengthened or non-strengthened Corning Gorilla® glass (all codes). The developed laser methods can be tailored for manual separation of the parts from the panel or full laser separation by thermal stressing the desired profile. Methods can be used to form 3D surfaces with small radii of curvature. The method involves the utilization of an ultra-short pulse laser that may be optionally followed by a CO2 laser for fully automated separation.