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公开(公告)号：KR20180052646A
公开(公告)日：2018-05-18
申请号：KR20187008111
申请日：2016-08-19
Applicant: CORNING INC
Inventor： GARNER SEAN MATTHEW , OWUSU SAMUEL ODEI , PIECH GARRETT ANDREW , POLLARD SCOTT CHRISTOPHER
CPC classification number: H05K1/024 , C03B33/0222 , C03C17/008 , C03C23/007 , C03C2217/445 , H01L21/4807 , H01L23/15 , H05K1/0306 , H05K1/036 , H05K3/107 , H05K3/4629 , H05K2201/0195 , H05K2203/1194 , H05K2203/1545 , Y02P40/57
Abstract: 플렉서블기판들내의피쳐들의연속적제조방법들이개시된다. 일실시예에서, 기판웹 내에피쳐들을제조하는방법은제1 스풀어셈블리상에서제1 스풀내에배열되는기판웹을제공하는단계, 상기제1 스풀로부터레이저를포함하는제1 레이저처리어셈블리를통해상기기판웹을진행시키는단계, 및상기레이저를사용하여상기기판웹 내에복수의결함들을생성하는단계를포함한다. 상기방법은식각어셈블리를통해상기기판웹을진행시키고, 상기복수의결함들에서유리물질을제거하여상기기판웹 내에복수의결함들을형성하도록상기식각어셈블리에서상기기판웹을식각하는단계를더 포함한다. 상기방법은최종스풀내로상기기판웹을롤링하는단계를더 포함한다.
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公开(公告)号：KR20200140856A
公开(公告)日：2020-12-16
申请号：KR20207031679
申请日：2019-04-04
Applicant: CORNING INC
Inventor： GARNER SEAN MATTHEW , LEVESQUE DANIEL WAYNE JR , MANLEY ROBERT GEORGE , PIECH GARRETT ANDREW , VADDI RAJESH , VANSELOUS HEATHER NICOLE
IPC: H01L27/12 , H01L25/075 , H01L25/16 , H01L27/15 , H01L33/62
Abstract: 실시예들은기판내에비아들을형성하기위한시스템들및 방법들, 및보다구체적으로비아형성동안기판표면파괴를감소시키기위한시스템들및 방법들에관한것이다.
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公开(公告)号：KR20180008675A
公开(公告)日：2018-01-24
申请号：KR20177036146
申请日：2016-05-12
Applicant: CORNING INC
Inventor： GOLLIER JACQUES , LI SHENPING , LI XINGHUA , PIECH GARRETT ANDREW , TSUDA SERGIO
CPC classification number: C03B33/0222 , B23K26/0057 , B23K26/0624 , B23K26/53 , B23K2203/54 , C03B33/091 , Y02P40/57
Abstract: 유리제품으로서, 제1표면, 맞은편의제2표면, 및이들사이에연장하는두께; 및상기유리제품의두께의약 35% 이하의두께를갖는레이저가공영역, 또는상기유리제품의두께의약 15% 이하의높이를갖는챔퍼를포함하는적어도하나의모서리를포함하는, 도광판과같은유리제품이개시된다. 이러한유리제품을디스플레이소자및 이러한유리제품의제조방법이또한개시된다.
Abstract translation: 35.一种玻璃制品，包括：第一表面，相对的第二表面和在其间延伸的厚度; 和玻璃产品，诸如导光板，其包括至少一个边缘包括所述具有的玻璃制品的不超过35％的厚度的药物厚度玻璃制品的15％以上的药物高度的具有激光加工区域的斜面，或厚度 据透露。 还公开了作为显示元件的这种玻璃产品和制造这种玻璃产品的方法。
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公开(公告)号：MY185774A
公开(公告)日：2021-06-07
申请号：MYPI2016001380
申请日：2014-12-16
Applicant: CORNING INC
Inventor： MARJANOVIC SASHA , PIECH GARRETT ANDREW , TSUDA SERGIO , WAGNER ROBERT STEPHEN
Abstract: The present invention relates to a process for cutting and separating interior contours in thin substrates of transparent materials (1, 20, 130, 720), in particular glass. The method involves the utilization of an ultra-short pulse laser (2) to form perforation or holes in the substrate, that may be followed by use of a CO2 laser beam (28) to promote full separation about the perforated line. (Figure 1)
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公开(公告)号：SG10201902702XA
公开(公告)日：2019-04-29
申请号：SG10201902702X
申请日：2014-12-16
Applicant: CORNING INC
Inventor： MARJANOVIC SASHA , PIECH GARRETT ANDREW , TSUDA SERGIO , WAGNER ROBERT STEPHEN , HACKERT THOMAS
Abstract: LASER PROCESSING OF SLOTS AND HOLES The present invention relates to a process for cutting and separating interior contours in thin substrates of transparent materials, in particular glass. The method involves the utilization of an ultra-short pulse laser to form perforation or holes in the substrate, that may be followed by use of a CO 2 laser beam to promote full separation about the perforated line. Fig. 1
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Patent Agency Ranking
公开(公告)号：SG11201809797PA
公开(公告)日：2018-12-28
申请号：SG11201809797P
申请日：2017-05-04
Applicant: CORNING INC
Inventor： BOWDEN BRADLEY FREDERICK , GUO XIAOJU , HACKERT THOMAS , PIECH GARRETT ANDREW , WIELAND KRISTOPHER ALLEN
Abstract: A method for cutting, separating and removing interior contoured shapes in thin substrates, particularly glass substrates. The method involves the utilization of an ultra-short pulse laser to form defect lines in the substrate that may be followed by use of a second laser beam to promote isolation of the part defined by the interior contour.
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公开(公告)号：SG11201604869PA
公开(公告)日：2016-07-28
申请号：SG11201604869P
申请日：2014-12-16
Applicant: CORNING INC
Inventor： MARJANOVIC SASHA , NIEBER ALBERT ROTH , PIECH GARRETT ANDREW , SCHILLINGER HELMUT , TSUDA SERGIO , WAGNER ROBERT STEPHEN
Abstract: The present invention relates to a laser cutting technology for cutting and separating thin substrates of transparent materials, for example to cutting of display glass compositions mainly used for production of Thin Film Transistors (TFT) devices. The described laser process can be used to make straight cuts, for example at a speed of >1 m/sec, to cut sharp radii outer corners (
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公开(公告)号：HUE055461T2
公开(公告)日：2021-11-29
申请号：HUE16714696
申请日：2016-03-23
Applicant: CORNING INC
Inventor： HACKERT THOMAS , LI XINGHUA , MARJANOVIC SASHA , N'GOM MOUSSA , PASTEL DAVID ANDREW , PIECH GARRETT ANDREW , SCHNITZLER DANIEL , WAGNER ROBERT STEPHEN , WATKINS JAMES JOSEPH
IPC: C03B33/02 , B23K26/00 , B23K103/00
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公开(公告)号：LT3169477T
公开(公告)日：2020-05-25
申请号：LT15750162
申请日：2015-07-14
Applicant: CORNING INC
Inventor： GOLLIER JACQUES , PIECH GARRETT ANDREW
IPC: B23K26/00 , B23K26/06 , B23K26/067 , B23K26/073 , B23K103/00 , C03B33/02 , C03B33/09 , G02B5/00 , G02B7/14 , G02B27/09
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10.发明专利
公开(公告)号：LT3311947T
公开(公告)日：2019-12-27
申请号：LT17193886
申请日：2017-09-28
Applicant: CORNING INC
Inventor： PIECH GARRETT ANDREW , TSUDA SERGIO , WEST JAMES ANDREW , AKARAPU RAVINDRA KUMAR
IPC: B23K26/00 , B23K26/06 , B23K26/073 , B23K26/53 , B23K103/00 , C03B33/02
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