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公开(公告)号：KR20180008675A
公开(公告)日：2018-01-24
申请号：KR20177036146
申请日：2016-05-12
Applicant: CORNING INC
Inventor： GOLLIER JACQUES , LI SHENPING , LI XINGHUA , PIECH GARRETT ANDREW , TSUDA SERGIO
CPC classification number: C03B33/0222 , B23K26/0057 , B23K26/0624 , B23K26/53 , B23K2203/54 , C03B33/091 , Y02P40/57
Abstract: 유리제품으로서, 제1표면, 맞은편의제2표면, 및이들사이에연장하는두께; 및상기유리제품의두께의약 35% 이하의두께를갖는레이저가공영역, 또는상기유리제품의두께의약 15% 이하의높이를갖는챔퍼를포함하는적어도하나의모서리를포함하는, 도광판과같은유리제품이개시된다. 이러한유리제품을디스플레이소자및 이러한유리제품의제조방법이또한개시된다.
Abstract translation: 35.一种玻璃制品，包括：第一表面，相对的第二表面和在其间延伸的厚度; 和玻璃产品，诸如导光板，其包括至少一个边缘包括所述具有的玻璃制品的不超过35％的厚度的药物厚度玻璃制品的15％以上的药物高度的具有激光加工区域的斜面，或厚度 据透露。 还公开了作为显示元件的这种玻璃产品和制造这种玻璃产品的方法。
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公开(公告)号：SG11201604869PA
公开(公告)日：2016-07-28
申请号：SG11201604869P
申请日：2014-12-16
Applicant: CORNING INC
Inventor： MARJANOVIC SASHA , NIEBER ALBERT ROTH , PIECH GARRETT ANDREW , SCHILLINGER HELMUT , TSUDA SERGIO , WAGNER ROBERT STEPHEN
Abstract: The present invention relates to a laser cutting technology for cutting and separating thin substrates of transparent materials, for example to cutting of display glass compositions mainly used for production of Thin Film Transistors (TFT) devices. The described laser process can be used to make straight cuts, for example at a speed of >1 m/sec, to cut sharp radii outer corners (
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公开(公告)号：CA2344543A1
公开(公告)日：2000-03-30
申请号：CA2344543
申请日：1999-09-21
Applicant: CORNING INC
Inventor： ENNSER KARIN M , TSUDA SERGIO , LUCERO ALAN J , LIU YANMING , DASILVA VALERIA L
Abstract: A long haul, broadband DWDM system that has been optimized by the proper selection of the distribution of total dispersion compensation. Dispersion compensation is utilized at both the receiver and the transmitter ends. Syst em performance is dependent on the ratio of compensation split between the transmitter and the receiver. A system operated in the non-linear regime can be compensated to operate with low BER and with reduced penalties due to residual dispersion effects, even when the spread of the total accumulated dispersion between the extreme channels in a broadband system exceeds 1,000 ps/nm.
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公开(公告)号：MY185774A
公开(公告)日：2021-06-07
申请号：MYPI2016001380
申请日：2014-12-16
Applicant: CORNING INC
Inventor： MARJANOVIC SASHA , PIECH GARRETT ANDREW , TSUDA SERGIO , WAGNER ROBERT STEPHEN
Abstract: The present invention relates to a process for cutting and separating interior contours in thin substrates of transparent materials (1, 20, 130, 720), in particular glass. The method involves the utilization of an ultra-short pulse laser (2) to form perforation or holes in the substrate, that may be followed by use of a CO2 laser beam (28) to promote full separation about the perforated line. (Figure 1)
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公开(公告)号：RU2696925C2
公开(公告)日：2019-08-07
申请号：RU2017102927
申请日：2015-07-14
Applicant: CORNING INC
Inventor： BOOKBINDER DANA CRAIG , LOGUNOV STEPHAN LVOVICH , NIEBER ALBERT ROTH , TANDON PUSHKAR , TSUDA SERGIO
IPC: C03B9/12
Abstract: Изобретениеотноситсяк способуизготовленияформованногостеклянногоизделия. Техническимрезультатомявляетсясокращениеобломковприотделениистеклянныхизделийотстекляннойленты. Способизготовленияформованногостеклянногоизделиявключаетв себяэтапы: формуютстекляннуюленту, содержащуюпосуществуплоскуюверхнююсторонуи посуществуплоскуюнижнююсторону, формуютзаготовку, состоящуюизстекластекляннойленты. Заготовкаприкрепленак стекляннойлентев апертуре, сформированнойв стекляннойленте. Заготовкаявляетсяполойс отверстиемв апертурестекляннойлентыи отходитотнижнейстороныстекляннойленты. Далеепридаютформузаготовкедляформованиястеклянногоизделия. Приэтомстеклянноеизделиеприкрепленок стекляннойлентенаучасткекрепления. Участоккреплениясодержитобласть, близкуюк краямапертуры. Участоккрепленияобразуеткрайстеклянногоизделия. Далееобеспечиваютконтактучасткакрепленияс фокальнойлиниейлазерноголучатакимобразом, чтоучастоккрепленияподвергаетсяперфорациилазернымлучом. Фокальнаялинияпосуществуперпендикулярнаплоскостистекляннойленты. Контактвызываетспонтанноеотделениестеклянногоизделияотстекляннойлентынаучасткекрепления. 12 з.п. ф-лы, 5 ил.
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Patent Agency Ranking
公开(公告)号：WO2015095264A2
公开(公告)日：2015-06-25
申请号：PCT/US2014070724
申请日：2014-12-17
Applicant: CORNING INC
Inventor： NIEBER ALBERT ROTH , TSUDA SERGIO
IPC: C03B33/02
CPC classification number: C03B33/0222 , B23K26/006 , B23K26/0063 , B23K26/0087 , B23K26/0622 , B23K26/359 , B23K26/382 , B23K26/386 , B23K26/389 , B23K26/402 , B23K26/55 , B23K26/57 , B23K2203/50 , B23K2203/54 , B23K2203/56 , C03B23/02 , C03B23/023 , C03B23/0252 , C03B23/0357 , Y02P40/57
Abstract: A method of making a glass article having non-flat portions, said method comprising the steps of (i) perforating a glass blank along a contour with a laser and forming multiple perforations in the glass blank; (ii) bending the glass bank along at least one area containing perforations, such that the glass is curved, forming a glass article having the non-flat portion.
Abstract translation: 一种制造具有非平坦部分的玻璃制品的方法，所述方法包括以下步骤：（i）用激光沿着轮廓打孔玻璃坯料并在玻璃坯料中形成多个穿孔; （ii）沿至少一个包含穿孔的区域弯曲玻璃池，使得玻璃弯曲，形成具有非平坦部分的玻璃制品。
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公开(公告)号：SG10201902702XA
公开(公告)日：2019-04-29
申请号：SG10201902702X
申请日：2014-12-16
Applicant: CORNING INC
Inventor： MARJANOVIC SASHA , PIECH GARRETT ANDREW , TSUDA SERGIO , WAGNER ROBERT STEPHEN , HACKERT THOMAS
Abstract: LASER PROCESSING OF SLOTS AND HOLES The present invention relates to a process for cutting and separating interior contours in thin substrates of transparent materials, in particular glass. The method involves the utilization of an ultra-short pulse laser to form perforation or holes in the substrate, that may be followed by use of a CO 2 laser beam to promote full separation about the perforated line. Fig. 1
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公开(公告)号：AU6158899A
公开(公告)日：2000-04-10
申请号：AU6158899
申请日：1999-09-21
Applicant: CORNING INC
Inventor： SILVA VALERIA L DA , ENNSER KARIN M , LIU YANMING , LUCERO ALAN J , TSUDA SERGIO
IPC: G02F1/035 , H04B10/2525 , H04J14/00 , H04J14/02
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9.发明专利
公开(公告)号：LT3311947T
公开(公告)日：2019-12-27
申请号：LT17193886
申请日：2017-09-28
Applicant: CORNING INC
Inventor： PIECH GARRETT ANDREW , TSUDA SERGIO , WEST JAMES ANDREW , AKARAPU RAVINDRA KUMAR
IPC: B23K26/00 , B23K26/06 , B23K26/073 , B23K26/53 , B23K103/00 , C03B33/02
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公开(公告)号：SG11201605864RA
公开(公告)日：2016-08-30
申请号：SG11201605864R
申请日：2014-12-16
Applicant: CORNING INC
Inventor： MARJANOVIC SASHA , PIECH GARRETT ANDREW , TSUDA SERGIO , WAGNER ROBERT STEPHEN
Abstract: The present invention relates to a process for cutting and separating interior contours in thin substrates of transparent materials, in particular glass. The method involves the utilization of an ultra-short pulse laser to form perforation or holes in the substrate, that may be followed by use of a COlaser beam to promote full separation about the perforated line.
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