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公开(公告)号：US20210221100A1
公开(公告)日：2021-07-22
申请号：US16304940
申请日：2017-06-01
Applicant: Corning Incorporated
Inventor： Dhananjay Joshi , Micheal William Price , James Ernest Webb , Chunhe Zhang
Abstract: A laminated glass structure is provided that includes: a substrate, a flexible glass sheet, a buffer layer, a first adhesive and a second adhesive. The substrate has a thickness from about 2.5 mm to about 50 mm and primary surfaces. The buffer layer has a thickness from about 0.1 mm to about 2.5 mm and is laminated to the substrate with the first adhesive. The flexible glass sheet has a thickness of no greater than 0.3 mm and is laminated to the buffer layer with the second adhesive. Further, the buffer layer is characterized by an elastic modulus of at least 70 GPa and a coefficient of thermal expansion between about 4 and 25 ppm*° C.−1.
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公开(公告)号：US11031574B2
公开(公告)日：2021-06-08
申请号：US16122009
申请日：2018-09-05
Applicant: CORNING INCORPORATED
Inventor： Guangli Hu , Dhananjay Joshi , Eunyoung Park , Yousef Kayed Qaroush
IPC: H01L51/52 , B32B17/06 , G02F1/1333 , B32B7/12 , B32B27/36 , B32B27/28 , B32B27/06 , B32B17/00 , B32B27/34 , G02F1/1335 , H01L27/32
Abstract: A foldable electronic device module includes a glass cover element having a thickness from about 25 μm to about 200 μm, an elastic modulus from about 20 GPa to about 140 GPa and a puncture resistance of at least 1.5 kgf. The module further includes a stack with a thickness between about 100 μm and about 600 μm; and a first adhesive joining the stack to the cover element with a shear modulus between about 1 MPa and about 1 GPa. The stack further includes a panel, an electronic device, and a stack element affixed to the panel with a stack adhesive. Further, the device module is characterized by a tangential stress at a primary surface of the cover element of no greater than about 1000 MPa in tension upon bending the module to a radius from about 20 mm to about 2 mm.
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公开(公告)号：US12071364B2
公开(公告)日：2024-08-27
申请号：US18133106
申请日：2023-04-11
Applicant: CORNING INCORPORATED
Inventor： Carol Ann Click , James Howard Edmonston , Qiang Fu , Jill Marie Hall , Mathieu Gerard Jacques Hubert , Dhananjay Joshi , Andrew Peter Kittleson , Katherine Weber Kroemer , Galan Gregory Moore , Rohit Rai , John Richard Ridge , John Robert Saltzer, Jr. , Charlene Marie Smith , Erika Lynn Stapleton , Matthew Daniel Trosa , Ljerka Ukrainczyk , Shelby Kerin Wilson , Bin Yang , Zheming Zheng
CPC classification number: C03C10/0027 , C03C4/18 , H05K5/03 , C03C2204/00 , H05K5/0017
Abstract: A glass ceramic article including a lithium disilicate crystalline phase, a petalite crystalline phased, and a residual glass phase. The glass ceramic article has a warp (μm) 0.91×10(2-0.03t) of electromagnetic radiation wavelengths from 450 nm to 800 nm, where t is the thickness of the glass ceramic article in mm.
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公开(公告)号：US11649187B2
公开(公告)日：2023-05-16
申请号：US17237272
申请日：2021-04-22
Applicant: CORNING INCORPORATED
Inventor： Carol Ann Click , James Howard Edmonston , Qiang Fu , Jill Marie Hall , Mathieu Gerard Jacques Hubert , Dhananjay Joshi , Andrew Peter Kittleson , Katherine Weber Kroemer , Galan Gregory Moore , Rohit Rai , John Richard Ridge , John Robert Saltzer, Jr. , Charlene Marie Smith , Erika Lynn Stapleton , Matthew Daniel Trosa , Ljerka Ukrainczyk , Shelby Kerin Wilson , Bin Yang , Zheming Zheng
CPC classification number: C03C10/0027 , C03C4/18 , H05K5/03 , C03C2204/00 , H05K5/0017
Abstract: A glass ceramic article including a lithium disilicate crystalline phase, a petalite crystalline phased, and a residual glass phase. The glass ceramic article has a warp (μm) 0.91×10(2−0.03t) of electromagnetic radiation wavelengths from 450 nm to 800 nm, where t is the thickness of the glass ceramic article in mm.
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公开(公告)号：US20200147932A1
公开(公告)日：2020-05-14
申请号：US16620360
申请日：2018-06-01
Applicant: CORNING INCORPORATED
Inventor： Shinu Baby , Dhananjay Joshi , Inna Igorevna Kouzmina , Yousef Kayed Qaroush , Arlin Lee Weikel
Abstract: A laminated glass article including a base layer, an anisotropic layer disposed over a top surface of the base layer, and a glass layer disposed over the anisotropic layer. The anisotropic layer may include homogeneous mechanical anisotropic properties measured at intervals of 250 microns. In some embodiments, the anisotropic layer may be an orthotropic layer including homogeneous mechanical orthotropic properties measured at intervals of 250 microns. The homogenous mechanical anisotropic or orthotropic properties of the anisotropic layer may provide a flexible laminated glass article with a high resistance to impact and puncture forces. In some embodiments, the laminated glass article may define all or a portion of a cover substrate for a consumer product.
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Patent Agency Ranking
公开(公告)号：US20190047900A1
公开(公告)日：2019-02-14
申请号：US16085759
申请日：2017-03-13
Applicant: CORNING INCORPORATED
Inventor： Guangli Hu , Dhananjay Joshi , Eunyoung Park , Yousef Kayed Qaroush
Abstract: A foldable electronic device module that includes a glass cover element having a thickness from about 25 μm to about 200 μm, an elastic modulus from about 20 GPa to about 140 GPa. The module further includes: a stack having a thickness from about 50 μm to about 600 μm; and a first adhesive joining the stack to a second primary surface of the cover element, the adhesive having a shear modulus from about 0.01 MPa to about 1 GPa and a glass transition temperature of at least 80 C. Further, the device module includes a flex-bond residual stress region through the thickness, and within a central region, of the cover element that ranges from a maximum compressive residual stress at the second primary surface to a maximum tensile residual stress at a first primary surface of the element along a central bend axis of the cover element.
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17.发明申请公开(公告)号：US20220288893A1
公开(公告)日：2022-09-15
申请号：US17632344
申请日：2020-08-03
Applicant: CORNING INCORPORATED
Inventor： Dhananjay Joshi , Khaled Layouni , Jinfa Mou , Jong Se Park
IPC: B32B17/10 , B32B1/00 , B32B7/12 , C03B23/035
Abstract: A method for forming a vehicle interior system. In the method, a first glass layer is provided in which the first glass layer has a first major surface and a second major surface. The second major surface is opposite to the first major surface. A second glass layer is provided in which the second glass layer has a third major surface and a fourth major surface. The fourth major surface is opposite to the third major surface. The second major surface is bonded to the third major surface with an adhesive layer to form a glass laminate. The glass laminate is placed on a mold, and the glass laminate is formed at a temperature below a glass transition temperature of each glass layer to form a first curvature.
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公开(公告)号：US20220282130A1
公开(公告)日：2022-09-08
申请号：US17637298
申请日：2020-08-12
Applicant: CORNING INCORPORATED
Inventor： Shinu Baby , Naigeng Chen , Edward John Fewkes , Dhananjay Joshi , Andrew Peter Kittleson , Yousef Kayed Qaroush , Ying Zhang
Abstract: Articles including a substrate, a cover glass layer disposed over a top surface of the substrate, and an adhesive layer having a dynamic elastic modulus disposed between a bottom surface of the cover glass layer and the top surface of the substrate. The cover glass layer may have a thickness in the range of 1 micron to 200 microns. The dynamic elastic modulus of the adhesive layer may include a first elastic modulus in the range of 10 kPa to 1000 kPa measured at a stress frequency in the range of 0 Hertz to 5 Hertz and a temperature of 23 degrees C., and a second elastic modulus of 500 MPa or more measured at a stress frequency in the range of 10 Hertz to 1000 Hertz and a temperature of 23 degrees C. The adhesive layer may be optically transparent. The articles may be bendable electronic display devices or bendable electronic display device modules.
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19.发明申请公开(公告)号：US20200017399A1
公开(公告)日：2020-01-16
申请号：US16512953
申请日：2019-07-16
Applicant: CORNING INCORPORATED
Inventor： Carol Ann Click , Indrajit Dutta , James Howard Edmonston , Michael S. Fischer , Qiang Fu , Ozgur Gulbiten , Jill Marie Hall , Mathieu Gerard Jacques Hubert , Dhananjay Joshi , Andrew Peter Kittleson , Rohit Rai , John Robert Saltzer, JR. , Charlene Marie Smith , Matthew Daniel Trosa , Matthew Artus Tuggle , James Clark Walck, JR. , Alana Marie Whittier , Zheming Zheng
Abstract: A glass-ceramic article having one or more crystalline phases; a residual glass phase; a compressive stress layer extending from a first surface to a depth of compression (DOC); a maximum central tension greater than 70 MPa; a stored tensile energy greater than 22 J/m2; a fracture toughness greater than 1.0 MPa√m; and a haze less than 0.2.
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公开(公告)号：US20190006619A1
公开(公告)日：2019-01-03
申请号：US16122009
申请日：2018-09-05
Applicant: CORNING INCORPORATED
Inventor： Guangli Hu , Dhananjay Joshi , Eunyoung Park , Yousef Kayed Qaroush
IPC: H01L51/52 , G02F1/1333 , B32B17/06 , B32B27/34 , B32B27/36 , B32B7/12 , G02F1/1335 , H01L27/32
Abstract: A foldable electronic device module includes a glass cover element having a thickness from about 25 μm to about 200 μm, an elastic modulus from about 20 GPa to about 140 GPa and a puncture resistance of at least 1.5 kgf. The module further includes a stack with a thickness between about 100 μm and about 600 μm; and a first adhesive joining the stack to the cover element with a shear modulus between about 1 MPa and about 1 GPa. The stack further includes a panel, an electronic device, and a stack element affixed to the panel with a stack adhesive. Further, the device module is characterized by a tangential stress at a primary surface of the cover element of no greater than about 1000 MPa in tension upon bending the module to a radius from about 20 mm to about 2 mm.
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