Beveled overburden for vias and method of making the same

    公开(公告)号:US12207405B2

    公开(公告)日:2025-01-21

    申请号:US17923624

    申请日:2021-04-29

    Abstract: A substrate including a via with a beveled overburden is disclosed. The substrate can include a substrate having a first surface, a second surface opposite the first surface, and a via passing from the first surface to the second surface. The via can be coated with a metallic layer that includes a first beveled overburden on the first surface, and the first beveled overburden can include a first outer edge that forms a first bevel angle greater than 95° with the first surface. The substrate can include a second beveled overburden that includes a second outer edge that forms a second bevel angle greater than 95° with the second surface. Methods of making the beveled overburdens are also disclosed.

    Foldable electronic device modules with impact and bend resistance

    公开(公告)号:US11631828B2

    公开(公告)日:2023-04-18

    申请号:US16754581

    申请日:2018-10-09

    Abstract: A foldable electronic device module includes: a glass-containing cover element having a thickness from about (25) μm to about (200) μm, an elastic modulus from about (20) to (140) GPa, and first and second primary surfaces; a stack comprising: (a) an interlayer having an elastic modulus from about (0.01) to (10) GPa and a thickness from about 50 to (200) μm, and (b) a flexible substrate having a thickness from about (100) to (200) μm; and a first adhesive joining the stack to the cover element, and comprising an elastic modulus from about (0.001) to (10) GPa and a thickness from about (5) to (25) μm. Further, the module comprises an impact resistance characterized by tensile stresses of less than about (4100) MPa and less than about (8300) MPa at the first and second primary surfaces of the cover element, respectively, upon an impact in a Pen Drop Test.

    Bendable electronic device modules, articles and bonding methods of making the same

    公开(公告)号:US11104601B2

    公开(公告)日:2021-08-31

    申请号:US16085759

    申请日:2017-03-13

    Abstract: A foldable electronic device module that includes a glass cover element having a thickness from about 25 μm to about 200 μm, an elastic modulus from about 20 GPa to about 140 GPa. The module further includes: a stack having a thickness from about 50 μm to about 600 μm; and a first adhesive joining the stack to a second primary surface of the cover element, the adhesive having a shear modulus from about 0.01 MPa to about 1 GPa and a glass transition temperature of at least 80 C. Further, the device module includes a flex-bond residual stress region through the thickness, and within a central region, of the cover element that ranges from a maximum compressive residual stress at the second primary surface to a maximum tensile residual stress at a first primary surface of the element along a central bend axis of the cover element.

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