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公开(公告)号:US12241007B2
公开(公告)日:2025-03-04
申请号:US17637298
申请日:2020-08-12
Applicant: CORNING INCORPORATED
Inventor: Shinu Baby , Naigeng Chen , Edward John Fewkes , Dhananjay Joshi , Andrew Peter Kittleson , Yousef Kayed Qaroush , Ying Zhang
Abstract: Articles including a substrate, a cover glass layer disposed over a top surface of the substrate, and an adhesive layer having a dynamic elastic modulus disposed between a bottom surface of the cover glass layer and the top surface of the substrate. The cover glass layer may have a thickness in the range of 1 micron to 200 microns. The dynamic elastic modulus of the adhesive layer may include a first elastic modulus in the range of 10 kPa to 1000 kPa measured at a stress frequency in the range of 0 Hertz to 5 Hertz and a temperature of 23 degrees C., and a second elastic modulus of 500 MPa or more measured at a stress frequency in the range of 10 Hertz to 1000 Hertz and a temperature of 23 degrees C. The adhesive layer may be optically transparent. The articles may be bendable electronic display devices or bendable electronic display device modules.
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公开(公告)号:US11014848B2
公开(公告)日:2021-05-25
申请号:US16510850
申请日:2019-07-12
Applicant: CORNING INCORPORATED
Inventor: Carol Ann Click , James Howard Edmonston , Qiang Fu , Jill Marie Hall , Mathieu Gerard Jacques Hubert , Dhananjay Joshi , Andrew Peter Kittleson , Katherine Weber Kroemer , Galan Gregory Moore , Rohit Rai , John Richard Ridge , John Robert Saltzer, Jr. , Charlene Marie Smith , Erika Lynn Stapleton , Matthew Daniel Trosa , Ljerka Ukrainczyk , Shelby Kerin Wilson , Bin Yang , Zheming Zheng
Abstract: A glass ceramic article including a lithium disilicate crystalline phase, a petalite crystalline phased, and a residual glass phase. The glass ceramic article has a warp (μm) 0.91×10(2-0.03t) of electromagnetic radiation wavelengths from 450 nm to 800 nm, where t is the thickness of the glass ceramic article in mm.
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公开(公告)号:US20200017398A1
公开(公告)日:2020-01-16
申请号:US16510850
申请日:2019-07-12
Applicant: CORNING INCORPORATED
Inventor: Carol Ann Click , James Howard Edmonston , Qiang Fu , Jill Marie Hall , Mathieu Gerard Jacques Hubert , Dhananjay Joshi , Andrew Peter Kittleson , Katherine Weber Kroemer , Galan Gregory Moore , Rohit Rai , John Richard Ridge , John Robert Saltzer, JR. , Charlene Marie Smith , Erika Lynn Stapleton , Matthew Daniel Trosa , Ljerka Ukrainczyk , Shelby Kerin Wilson , Bin Yang , Zheming Zheng
Abstract: A glass ceramic article including a lithium disilicate crystalline phase, a petalite crystalline phased, and a residual glass phase. The glass ceramic article has a warp (μm) 0.91×10(2-0.03t) of electromagnetic radiation wavelengths from 450 nm to 800 nm, where t is the thickness of the glass ceramic article in mm.
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公开(公告)号:US12207405B2
公开(公告)日:2025-01-21
申请号:US17923624
申请日:2021-04-29
Applicant: CORNING INCORPORATED
Inventor: Dhananjay Joshi , Chukwudi Azubuike Okoro , Scott Christopher Pollard
Abstract: A substrate including a via with a beveled overburden is disclosed. The substrate can include a substrate having a first surface, a second surface opposite the first surface, and a via passing from the first surface to the second surface. The via can be coated with a metallic layer that includes a first beveled overburden on the first surface, and the first beveled overburden can include a first outer edge that forms a first bevel angle greater than 95° with the first surface. The substrate can include a second beveled overburden that includes a second outer edge that forms a second bevel angle greater than 95° with the second surface. Methods of making the beveled overburdens are also disclosed.
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公开(公告)号:US20240413070A1
公开(公告)日:2024-12-12
申请号:US18700432
申请日:2022-09-28
Applicant: CORNING INCORPORATED
Inventor: Sean Matthew Garner , Dhananjay Joshi , Chukwudi Azubuike Okoro
IPC: H01L23/498 , B22F3/15 , H01L21/48 , H01L23/15 , H01L23/48
Abstract: A via includes a substrate and a porous electrically conductive material. The substrate includes a first surface and a second surface opposite to the first surface. The substrate includes a through-hole extending from the first surface to the second surface. The porous electrically conductive material extends through the through-hole. The porous electrically conductive material includes a first porosity in a central region of the through-hole and a second porosity less than the first porosity proximate the first surface and the second surface of the substrate.
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公开(公告)号:US20180315953A1
公开(公告)日:2018-11-01
申请号:US15768313
申请日:2016-10-13
Applicant: CORNING INCORPORATED
Inventor: Guangli Hu , Dhananjay Joshi , Eunyoung Park , Yousef Kayed Qaroush
CPC classification number: G02F1/133305 , B32B7/12 , B32B17/00 , B32B17/06 , B32B27/06 , B32B27/281 , B32B27/36 , B32B2250/40 , B32B2250/44 , B32B2264/101 , B32B2307/412 , B32B2307/50 , B32B2307/546 , B32B2307/732 , B32B2457/20
Abstract: A foldable electronic device module includes a glass cover element having a thickness from about 25 μm to about 200 μm, an elastic modulus from about 20 GPa to about 140 GPa and a puncture resistance of at least 1.5 kgf. The module further includes a stack with a thickness between about 100 μm and about 600 μm; and a first adhesive joining the stack to the cover element with a shear modulus between about 1 MPa and about 1 GPa. The stack further includes a panel, an electronic device, and a stack element affixed to the panel with a stack adhesive. Further, the device module is characterized by a tangential stress at a primary surface of the cover element of no greater than about 1000 MPa in tension upon bending the module to a radius from about 20 mm to about 2 mm.
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公开(公告)号:US20230242438A1
公开(公告)日:2023-08-03
申请号:US18133106
申请日:2023-04-11
Applicant: CORNING INCORPORATED
Inventor: Carol Ann Click , James Howard Edmonston , Qiang Fu , Jill Marie Hall , Mathieu Gerard Jacques Hubert , Dhananjay Joshi , Andrew Peter Kittleson , Katherine Weber Kroemer , Galan Gregory Moore , Rohit Rai , John Richard Ridge , John Robert Saltzer, JR. , Charlene Marie Smith , Erika Lynn Stapleton , Matthew Daniel Trosa , Ljerka Ukrainczyk , Shelby Kerin Wilson , Bin Yang , Zheming Zheng
CPC classification number: C03C10/0027 , C03C4/18 , H05K5/03 , C03C2204/00 , H05K5/0017
Abstract: A glass ceramic article including a lithium disilicate crystalline phase, a petalite crystalline phased, and a residual glass phase. The glass ceramic article has a warp (μm) 0.91×10(2-0.03t) of electromagnetic radiation wavelengths from 450 nm to 800 nm, where t is the thickness of the glass ceramic article in mm.
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公开(公告)号:US11631828B2
公开(公告)日:2023-04-18
申请号:US16754581
申请日:2018-10-09
Applicant: CORNING INCORPORATED
Inventor: Shinu Baby , Dhananjay Joshi , Yousef Kayed Qaroush , Bin Zhang
Abstract: A foldable electronic device module includes: a glass-containing cover element having a thickness from about (25) μm to about (200) μm, an elastic modulus from about (20) to (140) GPa, and first and second primary surfaces; a stack comprising: (a) an interlayer having an elastic modulus from about (0.01) to (10) GPa and a thickness from about 50 to (200) μm, and (b) a flexible substrate having a thickness from about (100) to (200) μm; and a first adhesive joining the stack to the cover element, and comprising an elastic modulus from about (0.001) to (10) GPa and a thickness from about (5) to (25) μm. Further, the module comprises an impact resistance characterized by tensile stresses of less than about (4100) MPa and less than about (8300) MPa at the first and second primary surfaces of the cover element, respectively, upon an impact in a Pen Drop Test.
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公开(公告)号:US11104601B2
公开(公告)日:2021-08-31
申请号:US16085759
申请日:2017-03-13
Applicant: CORNING INCORPORATED
Inventor: Guangli Hu , Dhananjay Joshi , Eunyoung Park , Yousef Kayed Qaroush
Abstract: A foldable electronic device module that includes a glass cover element having a thickness from about 25 μm to about 200 μm, an elastic modulus from about 20 GPa to about 140 GPa. The module further includes: a stack having a thickness from about 50 μm to about 600 μm; and a first adhesive joining the stack to a second primary surface of the cover element, the adhesive having a shear modulus from about 0.01 MPa to about 1 GPa and a glass transition temperature of at least 80 C. Further, the device module includes a flex-bond residual stress region through the thickness, and within a central region, of the cover element that ranges from a maximum compressive residual stress at the second primary surface to a maximum tensile residual stress at a first primary surface of the element along a central bend axis of the cover element.
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公开(公告)号:US20210238083A1
公开(公告)日:2021-08-05
申请号:US17237272
申请日:2021-04-22
Applicant: CORNING INCORPORATED
Inventor: Carol Ann Click , James Howard Edmonston , Qiang Fu , Jill Marie Hall , Mathieu Gerard Jacques Hubert , Dhananjay Joshi , Andrew Peter Kittleson , Katherine Weber Kroemer , Galan Gregory Moore , Rohit Rai , John Richard Ridge , John Robert Saltzer, JR. , Charlene Marie Smith , Erika Lynn Stapleton , Matthew Daniel Trosa , Ljerka Ukrainczyk , Shelby Kerin Wilson , Bin Yang , Zheming Zheng
Abstract: A glass ceramic article including a lithium disilicate crystalline phase, a petalite crystalline phased, and a residual glass phase. The glass ceramic article has a warp (μm) 0.91×10(2−0.03t) of electromagnetic radiation wavelengths from 450 nm to 800 nm, where t is the thickness of the glass ceramic article in mm.
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