公开(公告)号：US20150224620A1

公开(公告)日：2015-08-13

申请号：US14590620

申请日：2015-01-06

Applicant: EBARA CORPORATION

Inventor： Nobuyuki TAKAHASHI ,  Toru MARUYAMA ,  Suguru SAKUGAWA

IPC: B24B37/005 ,  B24B7/22

CPC classification number: B24B37/005 ,  B24B7/228 ,  B24B37/30 ,  B24B49/08 ,  Y10T137/7761

Abstract: A pressure regulator capable of improving both stability of pressure and responsiveness to an input signal is disclosed. A PID controller is configured to stop producing a corrective command value from a point in time when a pressure command value has changed until a PID control starting point and to produce the corrective command value after the PID control starting point. A regulator controller is configured to control operation of a pressure regulation valve so as to eliminate a difference between the pressure command value and a first pressure value from the point in time when the pressure command value has changed until the PID control starting point, and to control the operation of the pressure regulation valve so as to eliminate a difference between the corrective command value and the first pressure value after the PID control starting point.

Abstract translation: 公开了能够提高压力稳定性和对输入信号的响应性的压力调节器。 PID控制器被配置为从压力指令值改变直到PID控制起始点的时间点停止产生校正指令值，并且在PID控制起点之后产生校正指令值。 调节器控制器被配置为控制压力调节阀的操作，以便从压力指令值已经改变到PID控制起始点的时间点消除压力指令值与第一压力值之间的差值，并且 控制压力调节阀的运行，以消除PID控制起点后的校正指令值与第一压力值之间的差异。

公开(公告)号：US20200171618A1

公开(公告)日：2020-06-04

申请号：US16787892

申请日：2020-02-11

Applicant: Ebara Corporation

Inventor： Itsuki KOBATA ,  Katsuhide WATANABE ,  Hozumi YASUDA ,  Yuji YAGI ,  Nobuyuki TAKAHASHI ,  Koichi TAKEDA

IPC: B24B37/013 ,  B24B37/20 ,  B24B37/04

Abstract: One object is to provide a polishing machine and a polishing method capable of improving a processing accuracy on the surface of an object. A method of polishing an object is provided. Such a method comprises a first step of polishing an object by moving the object and a first polishing pad having a smaller dimension than that of the object relative to each other while the first polishing pad is made to contact the object, a second step of polishing the object, after the first step of polishing, by moving the object and a second polishing pad having a larger dimension than that of the object relative to each other while the second polishing pad is made to contact the object, and a step of detecting the state of the surface of the object before the first step of polishing.

公开(公告)号：US20190219381A1

公开(公告)日：2019-07-18

申请号：US16248599

申请日：2019-01-15

Applicant: EBARA CORPORATION

Inventor： Toshifumi KIMBA ,  Nobuyuki TAKAHASHI ,  Masaki KINOSHITA

IPC: G01B11/06 ,  B24B49/12 ,  H01L21/67 ,  B24B37/005 ,  B24B37/34 ,  F21V8/00

Abstract: A polishing apparatus capable of accurately measuring a film thickness by regulating a quantity of light illuminating a wafer is disclosed. The polishing apparatus includes: a light source; an illuminating fiber having distal ends arranged at different locations in the polishing table; and a light-receiving fiber having distal ends arranged at the different locations in the polishing table. The illuminating fiber includes a first illuminating fiber and a second illuminating fiber. A first dimmer is attached to the first illuminating fiber and the second illuminating fiber, and a second dimmer is attached to at least one of the first illuminating fiber and the second illuminating fiber.