公开(公告)号：US20170352573A1

公开(公告)日：2017-12-07

申请号：US15615475

申请日：2017-06-06

Applicant: EBARA CORPORATION

Inventor： Zhongxin WEN ,  Toru MARUYAMA ,  Nobuyuki TAKAHASHI ,  Suguru SAKUGAWA ,  Yoichi SHIOKAWA ,  Keita YAGI ,  Itsuki KOBATA ,  Tomohiko TAKEUCHI

IPC: H01L21/687 ,  G03F7/20 ,  B24B41/06 ,  H01L21/683 ,  B24B37/04

CPC classification number: H01L21/68757 ,  B24B37/04 ,  B24B41/068 ,  G03F7/70691 ,  H01L21/67248 ,  H01L21/6838 ,  H01L21/68714

Abstract: It is an object of the present invention to provide a high-flatness substrate holding table. According to a first aspect, a substrate processing apparatus is provided, and such a substrate processing apparatus includes a table for holding a substrate, a resin film attached to a top surface of the table and a heater provided inside the table, and the top surface of the table is formed of ceramics, the top surface of the table includes an opening connectable to a vacuum source, the resin film is formed of polyimide, and a through hole is formed at a position corresponding to the opening of the table when attached to the top surface of the table.

公开(公告)号：US20170092519A1

公开(公告)日：2017-03-30

申请号：US15311638

申请日：2015-04-06

Applicant: EBARA CORPORATION

Inventor： Suguru SAKUGAWA ,  Nobuyuki TAKAHASHI ,  Toru MARUYAMA

IPC: H01L21/67 ,  H01L21/683 ,  H01L21/677 ,  H01L21/687 ,  B24B37/30 ,  H01L21/306

CPC classification number: H01L21/67253 ,  B24B37/005 ,  B24B37/30 ,  B24B49/08 ,  B24B49/16 ,  H01L21/304 ,  H01L21/30625 ,  H01L21/67051 ,  H01L21/67092 ,  H01L21/67219 ,  H01L21/67778 ,  H01L21/6838 ,  H01L21/68707 ,  H01L21/68764

Abstract: The invention simplifies airbag calibration.A pressure calibration jig calibrates pressure to be applied to a plurality of airbags disposed inside a top ring for holding and pressing a wafer against a polishing pad. The pressure calibration jig includes a plurality of first passages capable of communicating with the plurality of airbags, respectively; a second passage which combines and connects the plurality of first passages to a pressure calibration sensor; and a flow control portion configured to allow a fluid to flow through the first passage of the plurality of first passages, which first passage corresponds to an airbag selected for pressure calibration, in a direction from the selected airbag toward the second passage, and also configured to prevent the fluid from flowing through the first passages other than the first passage corresponding to the selected airbag in a direction from the second passage toward the airbags.

公开(公告)号：US20180236630A1

公开(公告)日：2018-08-23

申请号：US15900140

申请日：2018-02-20

Applicant: Ebara Corporation

Inventor： Hozumi YASUDA ,  Itsuki KOBATA ,  Nobuyuki TAKAHASHI ,  Suguru SAKUGAWA ,  Nobuyuki TAKADA

IPC: B24B37/013 ,  B24B37/10 ,  B24B53/017

CPC classification number: B24B37/013 ,  B24B21/12 ,  B24B27/0084 ,  B24B37/105 ,  B24B37/107 ,  B24B53/017

Abstract: A polisher for locally polishing a substrate is provided. The polisher includes a polishing member having a processing surface that comes into contact with the substrate and is smaller than the substrate, a pressing mechanism for pressing the polishing member against the substrate, a first drive mechanism for imparting motion to the polishing member in a first motion direction parallel to a surface of the substrate, a second drive mechanism for imparting motion to the polishing member in a second motion direction perpendicular to the first motion direction and having a component parallel to the surface of the substrate, and a controller for controlling the action of the polisher.

公开(公告)号：US20140087629A1

公开(公告)日：2014-03-27

申请号：US13948238

申请日：2013-07-23

Applicant: EBARA CORPORATION

Inventor： Nobuyuki TAKAHASHI ,  Toru MARUYAMA

IPC: B24B37/34 ,  B24B37/005

CPC classification number: B24B37/345 ,  B24B7/228 ,  B24B37/005 ,  Y10T137/7761

Abstract: A pressure regulator includes: a pressure-regulating valve configured to regulate pressure of a fluid supplied from a fluid supply source; a first pressure sensor configured to measure the pressure regulated by the pressure-regulating valve; a second pressure sensor located downstream of the first pressure sensor; a PID controller configured to produce a correction pressure command value for eliminating a difference between a pressure command value and a pressure value of the fluid measured by the second pressure sensor; and a regulator controller configured to control operation of the pressure-regulating valve so as to eliminate a difference between the correction pressure command value and a pressure value of the fluid measured by the first pressure sensor.

Abstract translation: 压力调节器包括：压力调节阀，其构造成调节从流体供应源供应的流体的压力; 第一压力传感器，被配置为测量由压力调节阀调节的压力; 位于第一压力传感器下游的第二压力传感器; PID控制器，被配置为产生校正压力指令值，用于消除由第二压力传感器测量的压力指令值和流体的压力值之间的差值; 以及调节器控制器，被配置为控制所述调压阀的操作，以消除所述校正压力指令值与由所述第一压力传感器测量的流体的压力值之间的差。

公开(公告)号：US20170259395A1

公开(公告)日：2017-09-14

申请号：US15453442

申请日：2017-03-08

Applicant: Ebara Corporation

Inventor： Itsuki KOBATA ,  Katsuhide WATANABE ,  Hozumi YASUDA ,  Yuji YAGI ,  Nobuyuki TAKAHASHI ,  Koichi TAKEDA

IPC: B24B37/013 ,  B24B37/20 ,  B24B37/04

CPC classification number: B24B37/013 ,  B24B37/042 ,  B24B37/20

Abstract: One object is to provide a polishing machine and a polishing method capable of improving a processing accuracy on the surface of an object. A method of polishing an object is provided. Such a method comprises: a first step of polishing an object by moving the object and a first polishing pad having a smaller dimension than that of the object relative to each other while the first polishing pad is made to contact the object, a second step of polishing the object, after the first step of polishing, by moving the object and a second polishing pad having a larger dimension than that of the object relative to each other while the second polishing pad is made to contact the object, and a step of detecting the state of the surface of the object before the first step of polishing.

公开(公告)号：US20200269383A1

公开(公告)日：2020-08-27

申请号：US16495010

申请日：2018-01-10

Applicant: Ebara Corporation

Inventor： Hozumi YASUDA ,  Itsuki KOBATA ,  Nobuyuki TAKAHASHI ,  Suguru SAKUGAWA

IPC: B24B53/017 ,  B24B37/005 ,  B24B53/12

Abstract: Provided is a polishing device for appropriately retaining a polishing member in an appropriate state in polishing. The polishing device for partially polishing a substrate includes a polishing member having a processing surface which comes into contact with the substrate and which is smaller than the substrate, a conditioning member for performing conditioning on the polishing member, a first pressing mechanism for pressing the conditioning member against the polishing member in polishing the substrate, and a control unit for controlling an operation of the polishing device. The control unit is configured to control the first pressing mechanism when the substrate is partially polished by the polishing member.

公开(公告)号：US20190118331A1

公开(公告)日：2019-04-25

申请号：US16162063

申请日：2018-10-16

Applicant: EBARA CORPORATION

Inventor： Nobuyuki TAKAHASHI ,  Toshifumi KIMBA ,  Masaki KINOSHITA

IPC: B24B37/013 ,  B24B37/10 ,  B24B49/12 ,  G01J3/42 ,  G01J3/10

Abstract: There is disclosed a polishing apparatus which allows for easy replacement of a light source with another type of light source. The light-source assembly includes: a base fixed to a polishing table and coupled to a light-emitting transmission line; and a light-source module having a lamp for emitting light. The light-source module is removably attached to the base. The base is a common base which is adapted to any of a plurality of light-source modules of different types including the light-source module. The base includes a positioning structure which achieves positioning of the light-source module relative to the base.

公开(公告)号：US20180304434A1

公开(公告)日：2018-10-25

申请号：US15951745

申请日：2018-04-12

Applicant: Ebara Corporation

Inventor： Suguru SAKUGAWA ,  Nobuyuki TAKAHASHI ,  Toru MARUYAMA

IPC: B24B37/005 ,  B24B49/10 ,  H01L21/67 ,  H01L21/683

CPC classification number: B24B37/005 ,  B24B37/10 ,  B24B37/32 ,  B24B49/00 ,  B24B49/08 ,  B24B49/10 ,  G01M3/26 ,  H01L21/304 ,  H01L21/67092 ,  H01L21/6838

Abstract: A leak checking method which is capable of detecting a leak of compressed gas supplied to a polishing head without removing the polishing head from a polishing apparatus is disclosed. The leak checking method includes: supplying a compressed gas into a pressure chamber, which is formed by a membrane of a polishing head, with the membrane placed in contact with a stationary surface; measuring a flow rate of the compressed gas during supplying of the compressed gas into the pressure chamber, while regulating a pressure of the compressed gas by use of a pressure regulator; deciding whether or not the flow rate measured when a variation in the pressure of the compressed gas is within an allowable range of variation, is within a reference range; and generating a leak-detection signal when the flow rate is outside of the reference range.

公开(公告)号：US20180001438A1

公开(公告)日：2018-01-04

申请号：US15636343

申请日：2017-06-28

Applicant: EBARA CORPORATION

Inventor： Suguru SAKUGAWA ,  Toru MARUYAMA ,  Nobuyuki TAKAHASHI ,  Zhongxin WEN ,  Yoichi SHIOKAWA ,  Keita YAGI ,  Itsuki KOBATA ,  Tomohiko TAKEUCHI

IPC: B24B37/005 ,  H01L21/306 ,  B24B37/10

CPC classification number: B24B37/005 ,  B24B37/10 ,  H01L21/30625

Abstract: According to one aspect, a substrate processing apparatus is provided. The substrate processing apparatus includes a table provided with a substrate holding surface for holding a substrate, a pad for processing the substrate held on the table, a head for holding the pad, an actuator for moving the head in a direction perpendicular to the substrate holding surface of the table, and a mechanical stopper device for stopping a movement of the head in the direction perpendicular to the substrate holding surface.

公开(公告)号：US20170047237A1

公开(公告)日：2017-02-16

申请号：US15305088

申请日：2015-04-17

Applicant: EBARA CORPORATION

Inventor： Itsuki KOBATA ,  Keita YAGI ,  Katsuhide WATANABE ,  Yoichi SHIOKAWA ,  Toru MARUYAMA ,  Nobuyuki TAKAHASHI

IPC: H01L21/677 ,  H01L21/3105 ,  B24B37/20 ,  H01L21/67 ,  H01L21/683 ,  H01L21/306 ,  H01L21/321

Abstract: An object of the present invention is to improve a substrate processing apparatus using the CARE method.The present invention provides a substrate processing apparatus for polishing a processing target region of a substrate by bringing the substrate and a catalyst into contact with each other in the presence of processing liquid. The substrate processing apparatus includes a substrate holding unit configured to hold the substrate, a catalyst holding unit configured to hold the catalyst, and a driving unit configured to move the substrate holding unit and the catalyst holding unit relative to each other with the processing target region of the substrate and the catalyst kept in contact with each other. The catalyst is smaller than the substrate.

Abstract translation: 本发明提供了一种用于在处理液体存在下使基板和催化剂彼此接触来研磨基板的加工对象区域的基板处理装置。 基板处理装置包括：基板保持单元，其被构造成保持基板;催化剂保持单元，其构造成保持催化剂;以及驱动单元，被配置为使所述基板保持单元和所述催化剂保持单元相对于所述处理对象区域移动 的基底和催化剂保持彼此接触。 催化剂小于底物。