公开(公告)号：US20220072679A1

公开(公告)日：2022-03-10

申请号：US17417294

申请日：2019-12-19

Applicant: EBARA CORPORATION

Inventor： Toru MARUYAMA

IPC: B24B37/015 ,  B24B37/20 ,  B24B49/14

Abstract: The present application relates to a pad-temperature regulating apparatus for regulating a temperature of a surface of a polishing pad. The pad-temperature regulating apparatus includes a pad-contact member, a supply system for supplying a heating liquid and a cooling liquid into the pad contact member, a pad-temperature measuring device for measuring the temperature of the surface of the polishing pad, and a controller for performing a PID control of manipulated variables of a first flow control valve and a second flow control valve. The controller includes a memory in which a learned model constructed to maintain a temperature behavior curve, created based on measured values of the pad-temperature measuring device, within a predetermined allowable range, is stored; and a processing device which inputs at least one temperature behavior parameter to the learned model, and performs a calculation to output a change value of PID parameter for the PID control.

公开(公告)号：US20210370461A1

公开(公告)日：2021-12-02

申请号：US17048674

申请日：2019-04-25

Applicant: EBARA CORPORATION

Inventor： Keisuke KAMIKI ,  Toru MARUYAMA ,  Yasuyuki MOTOSHIMA

IPC: B24B37/005

Abstract: The present invention relates to a polishing apparatus having a surface-property measuring device for measuring surface properties of a polishing pad which is used to polish a substrate, such as semiconductor wafer, and a polishing system including such a polishing apparatus. The polishing apparatus includes a surface-property measuring device (30) for measuring surface properties of a polishing pad (2), a support arm (50) for supporting the surface-property measuring device (30), and a moving unit (53) coupled to the support arm (50) and configured to move the surface-property measuring device (30) from a retreat position to a measure position.

公开(公告)号：US20190168354A1

公开(公告)日：2019-06-06

申请号：US16268984

申请日：2019-02-06

Applicant: EBARA CORPORATION

Inventor： Tadakazu SONE ,  Yasuyuki MOTOSHIMA ,  Toru MARUYAMA ,  Katsutoshi ONO ,  Yoichi SHIOKAWA

IPC: B24B37/015 ,  B24B37/04 ,  B24B37/10 ,  B24B37/34 ,  B24B55/02

Abstract: An apparatus for polishing a substrate includes a rotatable polishing table supporting a polishing pad, a substrate holder configured to hold the substrate and press the substrate against a polishing surface of the polishing pad on the rotating polishing table so as to polish the substrate, and a pad-temperature detector configured to measure a temperature of the polishing surface of the polishing pad. The apparatus also includes a pad-temperature regulator configured to contact the polishing surface to regulate the temperature of the polishing surface, and a temperature controller configured to control the temperature of the polishing surface by controlling the pad-temperature regulator based on information on the temperature of the polishing surface detected by the pad-temperature detector.

公开(公告)号：US20160096250A1

公开(公告)日：2016-04-07

申请号：US14964132

申请日：2015-12-09

Applicant: EBARA CORPORATION

Inventor： Yasuyuki MOTOSHIMA ,  Toru MARUYAMA

IPC: B24B37/005

CPC classification number: B24B37/005 ,  B24B9/065 ,  B24B49/03 ,  B24B49/14

Abstract: A polishing apparatus polishes a substrate by moving the substrate and a polishing pad relative to each other. The apparatus includes: an elastic modulus measuring device configured to measure an elastic modulus of the polishing pad, and a polishing condition adjustor configured to adjust polishing conditions of the substrate based on a measured value of the elastic modulus. The polishing conditions include pressure of a retaining ring, arranged around the substrate, exerted on the polishing pad and a temperature of the polishing pad.

Abstract translation: 抛光装置通过相对于彼此移动基板和抛光垫来抛光基板。 该装置包括：弹性模量测量装置，其被配置为测量抛光垫的弹性模量;以及抛光状态调节器，被配置为基于弹性模量的测量值来调节基板的抛光条件。 抛光条件包括施加在抛光垫上的衬底周围的保持环的压力和抛光垫的温度。

公开(公告)号：US20140127973A1

公开(公告)日：2014-05-08

申请号：US14034495

申请日：2013-09-23

Applicant: EBARA CORPORATION

Inventor： Yasuyuki MOTOSHIMA ,  Toru MARUYAMA

IPC: B24B37/005

CPC classification number: B24B37/005 ,  B24B9/065 ,  B24B49/03 ,  B24B49/14

Abstract: A polishing apparatus polishes a substrate by moving the substrate and a polishing pad relative to each other. The apparatus includes: an elastic modulus measuring device configured to measure an elastic modulus of the polishing pad, and a polishing condition adjustor configured to adjust polishing conditions of the substrate based on a measured value of the elastic modulus. The polishing conditions include pressure of a retaining ring, arranged around the substrate, exerted on the polishing pad and a temperature of the polishing pad.

Abstract translation: 抛光装置通过相对于彼此移动基板和抛光垫来抛光基板。 该装置包括：弹性模量测量装置，其被配置为测量抛光垫的弹性模量;以及抛光状态调节器，被配置为基于弹性模量的测量值来调节基板的抛光条件。 抛光条件包括施加在抛光垫上的衬底周围的保持环的压力和抛光垫的温度。

公开(公告)号：US20140087629A1

公开(公告)日：2014-03-27

申请号：US13948238

申请日：2013-07-23

Applicant: EBARA CORPORATION

Inventor： Nobuyuki TAKAHASHI ,  Toru MARUYAMA

IPC: B24B37/34 ,  B24B37/005

CPC classification number: B24B37/345 ,  B24B7/228 ,  B24B37/005 ,  Y10T137/7761

Abstract: A pressure regulator includes: a pressure-regulating valve configured to regulate pressure of a fluid supplied from a fluid supply source; a first pressure sensor configured to measure the pressure regulated by the pressure-regulating valve; a second pressure sensor located downstream of the first pressure sensor; a PID controller configured to produce a correction pressure command value for eliminating a difference between a pressure command value and a pressure value of the fluid measured by the second pressure sensor; and a regulator controller configured to control operation of the pressure-regulating valve so as to eliminate a difference between the correction pressure command value and a pressure value of the fluid measured by the first pressure sensor.

Abstract translation: 压力调节器包括：压力调节阀，其构造成调节从流体供应源供应的流体的压力; 第一压力传感器，被配置为测量由压力调节阀调节的压力; 位于第一压力传感器下游的第二压力传感器; PID控制器，被配置为产生校正压力指令值，用于消除由第二压力传感器测量的压力指令值和流体的压力值之间的差值; 以及调节器控制器，被配置为控制所述调压阀的操作，以消除所述校正压力指令值与由所述第一压力传感器测量的流体的压力值之间的差。

公开(公告)号：US20210347004A1

公开(公告)日：2021-11-11

申请号：US17242886

申请日：2021-04-28

Applicant: EBARA CORPORATION

Inventor： Shuji UOZUMI ,  Toru MARUYAMA

IPC: B24B37/015

Abstract: A pad-temperature regulating device is disclosed, which can improve a responsiveness of a control for a surface temperature of a polishing pad and regulate the surface temperature of the polishing pad without causing defects, such as scratches, on the substrate. The pad-temperature regulating apparatus includes: a heat exchanger disposed above the polishing pad, whose temperature is maintained at a predetermined temperature; a pad-temperature measuring device configured to measure the surface temperature of the polishing pad; a distance sensor configured to measure a separation distance between the polishing pad and the heat exchanger; an elevating mechanism for moving the heat exchanger vertically with respect to the polishing pad; and a controller configured to control operation of the elevating mechanism based on measured values of the pad-temperature measuring device.

公开(公告)号：US20210229235A1

公开(公告)日：2021-07-29

申请号：US17229106

申请日：2021-04-13

Applicant: EBARA CORPORATION

Inventor： Tadakazu SONE ,  Yasuyuki MOTOSHIMA ,  Toru MARUYAMA ,  Katsutoshi ONO ,  Yoichi SHIOKAWA

IPC: B24B37/015 ,  B24B37/10 ,  B24B37/34 ,  B24B55/02 ,  B24B37/04

Abstract: An apparatus for polishing a substrate includes a rotatable polishing table supporting a polishing pad, a substrate holder configured to hold the substrate and press the substrate against a polishing surface of the polishing pad on the rotating polishing table so as to polish the substrate, and a pad-temperature detector configured to measure a temperature of the polishing surface of the polishing pad. The apparatus also includes a pad-temperature regulator configured to contact the polishing surface to regulate the temperature of the polishing surface, and a temperature controller configured to control the temperature of the polishing surface by controlling the pad-temperature regulator based on information on the temperature of the polishing surface detected by the pad-temperature detector.

公开(公告)号：US20170361420A1

公开(公告)日：2017-12-21

申请号：US15696926

申请日：2017-09-06

Applicant: EBARA CORPORATION

Inventor： Toru MARUYAMA ,  Hisanori MATSUO ,  Yasuyuki MOTOSHIMA

IPC: B24B37/015 ,  B24B49/14 ,  G01J5/02 ,  G01J5/00

CPC classification number: B24B37/015 ,  B24B49/14 ,  B24B55/02 ,  G01J5/025 ,  G01J2005/0085

Abstract: A polishing method and a polishing apparatus which can increase a polishing rate and can control a polishing profile of a substrate being polished by adjusting a surface temperature of a polishing pad are disclosed. The polishing method for polishing a substrate by pressing the substrate against a polishing pad on a polishing table includes a pad temperature adjustment step of adjusting a surface temperature of the polishing pad, and a polishing step of polishing the substrate by pressing the substrate against the polishing pad having the adjusted surface temperature. In the pad temperature adjustment step, the surface temperature of a part of an area of the polishing pad, the area being to be brought in contact with the substrate, is adjusted during the polishing step so that the rate of temperature change of a temperature profile in a radial direction of the surface of the polishing pad becomes constant in the radial direction of the polishing pad.

公开(公告)号：US20170352573A1

公开(公告)日：2017-12-07

申请号：US15615475

申请日：2017-06-06

Applicant: EBARA CORPORATION

Inventor： Zhongxin WEN ,  Toru MARUYAMA ,  Nobuyuki TAKAHASHI ,  Suguru SAKUGAWA ,  Yoichi SHIOKAWA ,  Keita YAGI ,  Itsuki KOBATA ,  Tomohiko TAKEUCHI

IPC: H01L21/687 ,  G03F7/20 ,  B24B41/06 ,  H01L21/683 ,  B24B37/04

CPC classification number: H01L21/68757 ,  B24B37/04 ,  B24B41/068 ,  G03F7/70691 ,  H01L21/67248 ,  H01L21/6838 ,  H01L21/68714

Abstract: It is an object of the present invention to provide a high-flatness substrate holding table. According to a first aspect, a substrate processing apparatus is provided, and such a substrate processing apparatus includes a table for holding a substrate, a resin film attached to a top surface of the table and a heater provided inside the table, and the top surface of the table is formed of ceramics, the top surface of the table includes an opening connectable to a vacuum source, the resin film is formed of polyimide, and a through hole is formed at a position corresponding to the opening of the table when attached to the top surface of the table.