公开(公告)号：DE10164494A1

公开(公告)日：2003-07-17

申请号：DE10164494

申请日：2001-12-28

Applicant: EPCOS AG

Inventor： PORTMANN JUERGEN ,  KRUEGER HANS ,  HOFFMANN CHRISTIAN

IPC: H01L23/12 ,  H01L29/06 ,  H03H3/02 ,  H03H3/06 ,  H03H3/08 ,  H03H9/02 ,  H03H9/05 ,  H03H9/10 ,  H03H9/25 ,  H03H9/56 ,  H01L23/50 ,  H01L23/055 ,  H01L21/60 ,  H01L21/52

Abstract: The aim of the invention is to encapsulate components in a simple and reliable manner. To this end, the connection between a chip and a carrier substrate is made by means of bump contacts which are sunk in recesses on the carrier substrate. The component is placed directly on the carrier substrate, especially on a frame defining the component structures on the chip.