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    METHOD FOR MANUFACTURING CONDUCTIVE PATTERN MATERIAL
    12.
    发明公开
    METHOD FOR MANUFACTURING CONDUCTIVE PATTERN MATERIAL 有权
    用于生产导电结构材料

    公开(公告)号：EP1802184A4

    公开(公告)日：2009-07-15

    申请号：EP05774860

    申请日：2005-08-25

    Applicant: FUJIFILM CORP

    Inventor： KAWAMURA KOICHI ,  KANO TAKEYOSHI

    IPC: H05K3/10 ,  B05D5/12 ,  C08J7/04 ,  G03F7/40 ,  H01B13/00

    CPC classification number: H05K3/185 ,  C08F251/02 ,  C08F255/00 ,  C08F289/00 ,  C08F291/00 ,  C08F292/00 ,  G03F7/0047 ,  G03F7/405 ,  H05K3/102 ,  H05K3/386 ,  H05K2203/1168

    Abstract: A method for manufacturing a conductive pattern material is provided with a process of directly bonding a graft polymer, which has a functional group and a crosslinkable functional group that can mutually interact with conductive particles, on a substrate in a pattern; a process of forming a conductive particle adsorbing layer by permitting the functional group which can mutually interact with conductive particles in the graft polymer to adsorb conductive particles; and a process of forming a crosslinking structure in the conductive particle adsorbing layer by applying energy to the conductive particle adsorbing layer. In this method, a conductive pattern material provided with a conductive pattern which has a high resolution without interruption and has excellent durability can be manufactured. The conductive pattern material can be also obtained by introducing a functional group which can mutually interact with an electroless plating catalyst, instead of the functional group which can mutually interact with conductive particles, and by adsorbing the electroless plating catalyst and the like and performing electroless plating process.

    Multilayer substrate manufacturing method
    17.
    发明专利
    Multilayer substrate manufacturing method 审中-公开
    多层基板制造方法

    公开(公告)号：JP2013051391A

    公开(公告)日：2013-03-14

    申请号：JP2012075462

    申请日：2012-03-29

    Applicant: Fujifilm Corp ,  富士フイルム株式会社

    Inventor： HAMA IFUMI ,  SOTOZONO HIROHISA ,  KANO TAKEYOSHI ,  MATSUMURA SUEHIKO

    IPC: H05K3/46 ,  H05K3/18

    CPC classification number: H05K3/4661 ,  H05K3/0055 ,  H05K2201/0195

    Abstract: PROBLEM TO BE SOLVED: To provide a multilayer substrate manufacturing method which can leave a plating target layer even when a desmear treatment is performed and maintain smoothness of a surface of the plating target layer, and manufacture a multilayer substrate including metal layers excellent in adhesion formed on the plating target layer.SOLUTION: A multilayer substrate manufacturing method comprises: a process (A) of forming a plating target layer having a functional group changing from hydrophobic to hydrophilic by heat, acid or radiation on a surface of a substrate with a conductive layer on the conductive layer side; a process (B) of forming a via hole penetrating the plating target layer to reach the conductive layer; a process (C) of performing a desmear treatment using a desmear treatment liquid; a process (D) of performing heating, supply of acid or irradiation of radiation to transform the functional group from hydrophobic to hydrophilic; a process (E) of applying a plating catalyst or a precursor of the plating catalyst; and a process (F) of performing plating on the plating target layer to which the plating catalyst or the precursor of the plating catalyst is applied.

    Abstract translation: 解决的问题：为了提供即使进行去污处理也能够留下电镀对象层并保持电镀目标层的表面的平滑性的多层基板的制造方法，并且制造包括金属层的多层基板 在电镀靶层上形成的粘合。 解决方案：一种多层基板的制造方法，其特征在于，包括以下步骤：（a）在所述基板的表面上形成具有从疏水性变为亲水性的官能团的电镀对象层，所述基板的表面上具有导电层 导电层侧; 形成穿过所述电镀靶层的通路孔到达所述导电层的工序（B）; 使用去污处理液进行去污处理的工序（C）; 进行加热，供应酸或照射辐射以将官能团从疏水转化成亲水的方法（D）; 施加镀催化剂或电镀催化剂前体的工序（E）; 以及在镀敷催化剂或电镀催化剂的前体所施加的电镀对象层上进行电镀的工序（F）。 版权所有（C）2013，JPO＆INPIT

    Production method for laminate having patterned metal films, and plating layer-forming composition
    18.
    发明专利
    Production method for laminate having patterned metal films, and plating layer-forming composition 审中-公开
    具有图案金属膜的层压板的生产方法，以及镀层形成组合物

    公开(公告)号：JP2012214895A

    公开(公告)日：2012-11-08

    申请号：JP2012077822

    申请日：2012-03-29

    Applicant: Fujifilm Corp ,  富士フイルム株式会社

    Inventor： KANO TAKEYOSHI ,  TAKAMOTO TETSUFUMI ,  UEKI YUKITAKA

    IPC: C23C18/31

    CPC classification number: C25D5/48 ,  C23C18/1653 ,  C23C18/206 ,  C23C18/30 ,  C23C18/405 ,  C23F1/18 ,  C23F1/30 ,  C23F4/00 ,  C25D3/38 ,  C25D5/50 ,  H05K3/06 ,  H05K3/108 ,  H05K2201/0236 ,  H05K2201/0761 ,  H05K2203/072 ,  H05K2203/0789 ,  H05K2203/095

    Abstract: PROBLEM TO BE SOLVED: To provide a production method for a laminate having patterned metal films, capable of readily plasma etching a plating layer and of obtaining a laminate having excellent insulating properties between the patterned metal films.SOLUTION: The production method for the laminate having patterned metal films includes: a plating layer-forming step in which a plating layer is formed on top of a substrate, using a plating layer-forming composition including a polymer having a prescribed unit; a catalyst application step in which a plating catalyst or a precursor thereof is applied to the plating layer; a plating step in which plating is performed and a metal film is formed on top of the plating layer; a pattern-forming step in which an etching fluid is used to form the patterned metal film; an acidic solution contacting step in which the substrate having the patterned metal film and an acidic solution are brought in contact with each other; and a plating layer-removal step in which the plating layer in an area in which no patterned metal film is formed, is removed by plasma etching.

    Abstract translation: 要解决的问题：为了提供一种具有图案化金属膜的层压体的制造方法，能够容易地等离子体蚀刻镀层，并获得在图案化的金属膜之间具有优异的绝缘性的层压体。 解决方案：具有图案化金属膜的层压体的制造方法包括：镀层形成步骤，其中在基板的顶部上形成镀层，使用包含具有规定单位的聚合物的镀层形成组合物 ; 将镀催化剂或其前体施加到镀层的催化剂涂布工序; 电镀步骤，其中在镀层的顶部上形成电镀和金属膜; 图案形成步骤，其中蚀刻流体用于形成图案化的金属膜; 使具有图案化金属膜和酸性溶液的基板彼此接触的酸性溶液接触步骤; 以及通过等离子体蚀刻除去其中没有形成图案化金属膜的区域中的镀层的镀层去除步骤。 版权所有（C）2013，JPO＆INPIT

    Laminate having metal film, manufacturing method therefor, laminate having patterned metal film, and manufacturing method therefor
    19.
    发明专利
    Laminate having metal film, manufacturing method therefor, laminate having patterned metal film, and manufacturing method therefor 审中-公开
    具有金属膜的层压板，其制造方法，具有图案金属膜的层压板及其制造方法

    公开(公告)号：JP2012214889A

    公开(公告)日：2012-11-08

    申请号：JP2012073386

    申请日：2012-03-28

    Applicant: Fujifilm Corp ,  富士フイルム株式会社

    Inventor： MATSUMURA SUEHIKO ,  KANO TAKEYOSHI ,  TAKAMOTO TETSUFUMI

    IPC: C23C18/30 ,  C23C18/31 ,  H05K3/18

    CPC classification number: H05K3/387 ,  C23C18/1603 ,  C23C18/1653 ,  C23C18/1689 ,  C23C18/2086 ,  C23C18/30 ,  C23C18/405 ,  C25D3/38 ,  H05K3/06 ,  H05K3/4661

    Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a laminate having a metal film that inhibits the formation of nodules on a precipitated plating film (metal film).SOLUTION: The method for manufacturing the laminate having the metal film includes: a plating-target-layer formation step of using a plating-target-layer formation composition containing a polymer containing a prescribed functional group to form a plating-target layer 12 on a substrate 10; an aqueous-alkaline-solution contact step of bringing an aqueous alkaline solution containing a prescribed component into contact with the plating-target layer 12; a catalyst-application step of applying a plating catalyst or a precursor therefor to the plating-target layer 12 from which uncured parts have been removed; and a plating step of performing plating process to form the metal film 14 on the plating-target layer 12.

    Abstract translation: 要解决的问题：提供一种用于制造具有抑制沉淀的镀膜（金属膜）上的结核形成的金属膜的层压体的方法。 ＆lt; P＆gt;解决方案：具有金属膜的层压体的制造方法包括：镀覆目标层形成工序，使用含有规定官能团的聚合物的镀覆层形成组合物形成镀覆层 12; 将含有规定成分的碱性水溶液与镀覆层12接触的水 - 碱溶液接触步骤; 将镀催化剂或其前体施加到去除未固化部分的镀覆层12的催化剂施加步骤; 以及电镀步骤，在电镀靶层12上形成金属膜14进行电镀处理。版权所有（C）2013，JPO＆INPIT

    Photosensitive resin composition for plating and method for producing substrate with metal layer using the same
    20.
    发明专利
    Photosensitive resin composition for plating and method for producing substrate with metal layer using the same 审中-公开
    用于制造用于制造具有金属层的基板的镀层的感光性树脂组合物

    公开(公告)号：JP2009161857A

    公开(公告)日：2009-07-23

    申请号：JP2008318644

    申请日：2008-12-15

    Applicant: Fujifilm Corp ,  富士フイルム株式会社

    Inventor： SATO MASATAKA ,  KANO TAKEYOSHI

    IPC: C23C18/16 ,  C08F220/10 ,  C08J7/04 ,  C23C18/20 ,  C25D5/56 ,  H05K1/03 ,  H05K3/18

    Abstract: PROBLEM TO BE SOLVED: To provide a photosensitive resin composition for plating which allows a plating catalyst or its precursor accepting layer to be formed and which is excellent in adhesion with a metal film formed by plating and smoothness of the resin-metal interface and has high film formation sensitivity and good production suitability; and to provide a method for producing a substrate with a metal layer by which the substrate with a metal layer excellent in the adhesion between the metal layer and the substrate can be easily formed with a low energy. SOLUTION: The photosensitive resin composition for plating allowing a plating catalyst or its precursor accepting layer to be formed is characterized by containing a polymer having a functional group forming a coordination bond interaction with the plating catalyst or its precursor and a polymerizable group, and a polyfunctional monomer having at least two polymerizable groups in the molecule. COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题：提供一种能够形成电镀催化剂或其前体接受层的电镀用感光性树脂组合物，其与通过电镀形成的金属膜和树脂 - 金属界面的平滑性具有优异的粘附性 并具有较高的成膜敏感性和良好的生产适应性; 并且提供一种用金属层制造基板的方法，通过该方法可以以低能量容易地形成具有金属层和基板之间的粘合性优异的金属层的基板。 解决方案：使形成电镀催化剂或其前体接受层的电镀用感光性树脂组合物的特征在于含有具有与电镀催化剂或其前体和可聚合基团形成配位键相互作用的官能团的聚合物， 和在分子中具有至少两个可聚合基团的多官能单体。 版权所有（C）2009，JPO＆INPIT

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