公开(公告)号：DE05745977T1

公开(公告)日：2007-10-11

申请号：DE05745977

申请日：2005-05-31

Applicant: FUJIFILM CORP

Inventor： KAWAMURA KOICHI ,  KANO TAKEYOSHI

IPC: H05K3/46 ,  H05K3/38

Abstract: The invention provides a multi-layer circuit board sequentially having an insulating substrate, a first electrically conductive pattern arbitrarily formed, an insulating material layer and a second electrically conductive pattern formed by providing an electrically conductive material on a graft polymer pattern formed on the insulating material layer, and having an electrically conductive path which electrically connects the first electrically conductive pattern present on the insulating substrate and the second electrically conductive pattern. The graft polymer pattern includes a combination of a region where a graft polymer is present and a region where no graft polymer is present, or a combination of a region where a hydrophilic graft polymer is present and a region where a hydrophobic graft polymer is present.

公开(公告)号：AT545665T

公开(公告)日：2012-03-15

申请号：AT09008260

申请日：2007-10-22

Applicant: FUJIFILM CORP

Inventor： KANO TAKEYOSHI ,  NAGASAKI HIDEO ,  SATO MASATAKA

IPC: C08F220/36 ,  C08F220/28 ,  C08F220/50 ,  C08L33/14 ,  C09D133/14

Abstract: A polymer comprising a unit represented by the following Formula (1), and a unit represented by the following Formula (2): wherein in Formula (1) and Formula (2), R 1 to R 5 each independently represent a hydrogen atom or a substituted or unsubstituted alkyl group; X, Y and Z each independently represent a single bond, a substituted or unsubstituted divalent organic group, an ester group, an amide group or an ether group; and L 1 and L 2 each independently represent a substituted or unsubstituted divalent organic group.

公开(公告)号：DE602005024595D1

公开(公告)日：2010-12-16

申请号：DE602005024595

申请日：2005-08-25

Applicant: FUJIFILM CORP

Inventor： KAWAMURA KOICHI ,  KANO TAKEYOSHI

IPC: B05D5/12 ,  H05K3/10 ,  C08J7/04 ,  G03F7/40 ,  H01B13/00

公开(公告)号：DE602004027854D1

公开(公告)日：2010-08-12

申请号：DE602004027854

申请日：2004-02-05

Applicant: FUJIFILM CORP

Inventor： KAWAMURA KOICHI ,  KANO TAKEYOSHI

IPC: B05D7/00 ,  G02B1/11 ,  A61K9/14 ,  B05D1/18 ,  B32B5/16 ,  C08J7/04 ,  H01L51/50 ,  H05B33/02 ,  H05B33/14

公开(公告)号：DE60311746T2

公开(公告)日：2007-10-31

申请号：DE60311746

申请日：2003-12-17

Applicant: FUJIFILM CORP

Inventor： KAWAMURA KOICHI ,  KANO TAKEYOSHI

IPC: G02B5/22 ,  G03F7/00 ,  B41C1/10 ,  B41N1/14 ,  C08F292/00 ,  C08F293/00 ,  C08J7/16 ,  G03F7/029 ,  G03F7/16 ,  G03F7/40 ,  H05K3/12

Abstract: The present invention relates to a pattern forming method comprising image-wise forming, on a surface of a substrate, a region having an ability to initiate polymerization, forming a graft polymer on the region by atom transfer radical polymerization, and adhering a substance to the graft polymer. The method can be applied for preparing an image forming material; a fine particle adsorption pattern material, a conductive pattern material or the like by selecting a suitable substance.

公开(公告)号：DE05727375T1

公开(公告)日：2007-08-09

申请号：DE05727375

申请日：2005-03-24

Applicant: FUJIFILM CORP

Inventor： KANO TAKEYOSHI ,  KAWAMURA KOICHI

IPC: C08J7/16 ,  C08J7/18 ,  B32B27/34 ,  C23C18/16 ,  C23C18/20 ,  C23C18/28 ,  C25D5/34 ,  H05K3/00 ,  H05K3/06 ,  H05K3/38 ,  H05K3/46

Abstract: The present invention provides a method for forming a surface graft, comprising the process of applying energy to the surface of a substrate containing polyimide having a polymerization initiating moiety in the skeleton thereof, to generate active points on the surface of the substrate and to generate a graft polymer that is directly bonded to the surface of the substrate starting from the active points and that has a polar group, and a surface graft material obtained thereby. The present invention also provides a method for forming a conductive film, comprising the processes of applying energy to the surface of a substrate containing polyimide having a polymerization initiating moiety in the skeleton thereof, to generate active points on the surface of the substrate and to generate a graft polymer that is directly bonded to the surface of the substrate starting from the active points and that has a polar group, and causing a conductive material to adhere to the graft polymer, and a conductive material obtained thereby.

公开(公告)号：EP2078607A4

公开(公告)日：2017-01-18

申请号：EP07830279

申请日：2007-10-22

Applicant: FUJIFILM CORP

Inventor： KANO TAKEYOSHI ,  NAGASAKI HIDEO ,  SATO MASATAKA

IPC: C08F220/28 ,  B32B27/08 ,  C08F22/32 ,  C08F220/36 ,  C08F220/50 ,  C08L33/14 ,  C09D133/14 ,  C23C18/16 ,  C23C18/20 ,  C23C18/30 ,  C23C18/31 ,  C23C18/40 ,  H05K3/38

CPC classification number: B32B27/08 ,  C08F22/32 ,  C08F220/28 ,  C08F220/36 ,  C08F220/50 ,  C09D133/18 ,  C23C18/1603 ,  C23C18/1653 ,  C23C18/2086 ,  C23C18/30 ,  C23C18/31 ,  C23C18/405 ,  H05K3/387 ,  H05K2203/121 ,  Y10T428/31551 ,  Y10T428/31681 ,  Y10T428/31786 ,  Y10T428/31855

Abstract: A process for producing a metal film-coated material, the process including: (a1) forming, on a substrate, a polymer layer formed from a polymer which has a functional group capable of interacting with a plating catalyst or a precursor thereof, and is directly chemically bonded to the substrate;(a2) providing a plating catalyst or a precursor thereof to the polymer layer; and (a3) performing plating with respect to the plating catalyst or a precursor thereof. The polymer layer satisfies all of the following requirements (1) to (4): (1) the saturated water absorption coefficient of the polymer layer as measured in an environment of temperature of 25°C and relative humidity of 50 % is 0.01 to 10% by mass; (2) the saturated water absorption coefficient of the polymer layer as measured in an environment of temperature of 25°C and relative humidity of 95 % is 0.05 to 20% by mass; (3) the water absorption coefficient of the polymer layer as measured after 1 hour of immersion in boiling water at 100°C is 0.1 to 30% by mass; and (4) the surface contact angle of the polymer layer as measured after dropping 5 µL of distilled water thereonto and leaving to stand for 15 seconds in an environment of temperature of 25°C and relative humidity of 50 % is 50 to 150 degrees.

公开(公告)号：EP1742991A4

公开(公告)日：2012-05-16

申请号：EP05727375

申请日：2005-03-24

Applicant: FUJIFILM CORP

Inventor： KANO TAKEYOSHI ,  KAWAMURA KOICHI

IPC: C08J7/16 ,  C08J7/18 ,  B32B27/34 ,  C23C18/16 ,  C23C18/20 ,  C23C18/28 ,  C25D5/34 ,  H05K3/00 ,  H05K3/06 ,  H05K3/38 ,  H05K3/46

CPC classification number: C08J7/12 ,  C08J7/045 ,  C08J7/16 ,  C08J2379/08 ,  C23C18/1601 ,  C23C18/1653 ,  C23C18/1692 ,  C23C18/2006 ,  C23C18/2086 ,  C23C18/28 ,  C25D5/34 ,  H05K3/389 ,  H05K3/4661 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/4921 ,  Y10T428/25 ,  Y10T428/31721

Abstract: The present invention provides a method for forming a surface graft, comprising the process of applying energy to the surface of a substrate containing polyimide having a polymerization initiating moiety in the skeleton thereof, to generate active points on the surface of the substrate and to generate a graft polymer that is directly bonded to the surface of the substrate starting from the active points and that has a polar group, and a surface graft material obtained thereby. The present invention also provides a method for forming a conductive film, comprising the processes of applying energy to the surface of a substrate containing polyimide having a polymerization initiating moiety in the skeleton thereof, to generate active points on the surface of the substrate and to generate a graft polymer that is directly bonded to the surface of the substrate starting from the active points and that has a polar group, and causing a conductive material to adhere to the graft polymer, and a conductive material obtained thereby.

公开(公告)号：EP2889340A4

公开(公告)日：2016-04-13

申请号：EP13830427

申请日：2013-08-01

Applicant: FUJIFILM CORP

Inventor： KANO TAKEYOSHI ,  SHIMOHARA NORIHIDE

IPC: C09D11/00 ,  B41J2/01 ,  B41M5/00 ,  C08F20/36 ,  C08F20/60 ,  C09D4/00 ,  C09D11/101 ,  C09D11/107 ,  C09D11/30

CPC classification number: C09D11/107 ,  C09D4/00 ,  C09D11/101 ,  C09D11/30 ,  C09D11/322 ,  C09D11/36 ,  Y10T428/24802

公开(公告)号：EP2980169A4

公开(公告)日：2016-04-06

申请号：EP14773247

申请日：2014-03-10

Applicant: FUJIFILM CORP

Inventor： HAYATA YUUICHI ,  KANO TAKEYOSHI ,  WATANABE TORU

IPC: C09D5/24 ,  C08J7/04 ,  C09D1/00 ,  C09D5/00 ,  C09D7/12 ,  C09D201/00 ,  H01B1/00 ,  H01B1/02 ,  H01B1/22 ,  H01B13/00 ,  H01B13/30 ,  H05K1/09 ,  H05K3/12

CPC classification number: C09D5/24 ,  C08J7/04 ,  C09D1/00 ,  C09D5/00 ,  C09D7/40 ,  C09D7/68 ,  C09D201/00 ,  H01B1/026 ,  H01B1/22 ,  H01B13/30 ,  H05K1/092 ,  H05K3/1283 ,  H05K2201/0209

Abstract: Provided is a composition for forming a conductive film, said composition containing: copper oxide particles (A) having an average particle size of 10-500 nm; copper particles (B) having an average particle size of 100-1000 nm; a polyol compound (C) which has two or more hydroxyl groups in the molecule; and at least one solvent (D) selected from the group consisting of water, and a water-soluble solvent. The ratio of the total mass (W A ) of the copper oxide particles (A) to the total mass (W B ) of the copper particles (B) is W A :W B =1:3-3:1, and the ratio of the sum total mass (W AB ) of the copper oxide particles (A) and the copper particles (B) to the total mass (W C ) of the polyol compound (C) is W AB :W C =20:1-2:1. The composition is capable of forming a conductive film which has high conductivity, and exhibits excellent adhesion to a substrate. Also provided is a conductive film manufacturing method using the composition.