12.
    发明专利
    未知

    公开(公告)号:DE60224138D1

    公开(公告)日:2008-01-31

    申请号:DE60224138

    申请日:2002-08-01

    Applicant: FUJIFILM CORP

    Abstract: The present invention relates to a planographic printing plate precursor comprising a substrate comprising a hydrophilic surface having disposed thereon a heat-sensitive layer containing a thermoplastic particulate polymer having functional groups capable of interacting with the hydrophilic surface. Preferably, hydrophilic graft polymer chains are present on the hydrophilic surface of the substrate. The present invention further relates to a planographic printing plate precursor comprising a substrate comprising a hydrophilic surface having disposed thereon a heat-sensitive layer comprising microcapsules comprising a compound having functional groups capable of interacting with the hydrophilic surface. In addition, the present invention relates to methods of printing with the planographic printing plate precursors.

    14.
    发明专利
    未知

    公开(公告)号:DE602004012675T2

    公开(公告)日:2009-04-09

    申请号:DE602004012675

    申请日:2004-08-20

    Applicant: FUJIFILM CORP

    Abstract: The present invention provides: a method of forming a metal fine particle pattern including forming a polymerization initiation layer on a support, wherein a polymer which has, in its side chain, a cross-linking group and a functional group having the ability to initiate polymerization is fixed by a cross-linking reaction, forming a graft polymer region in a pattern on the surface of the polymerization initiation layer, wherein the graft polymer layer has the ability to contain a metal ion or a metal salt, adding a metal ion or a metal salt to the graft polymer layer, and thereafter reducing the metal ion or a metal ion in the metal salt to form a metal fine particle dispersion region; and a method of forming an electroconductive pattern using the method of forming a metal fine particle pattern.

    15.
    发明专利
    未知

    公开(公告)号:DE602004012675D1

    公开(公告)日:2008-05-08

    申请号:DE602004012675

    申请日:2004-08-20

    Applicant: FUJIFILM CORP

    Abstract: The present invention provides: a method of forming a metal fine particle pattern including forming a polymerization initiation layer on a support, wherein a polymer which has, in its side chain, a cross-linking group and a functional group having the ability to initiate polymerization is fixed by a cross-linking reaction, forming a graft polymer region in a pattern on the surface of the polymerization initiation layer, wherein the graft polymer layer has the ability to contain a metal ion or a metal salt, adding a metal ion or a metal salt to the graft polymer layer, and thereafter reducing the metal ion or a metal ion in the metal salt to form a metal fine particle dispersion region; and a method of forming an electroconductive pattern using the method of forming a metal fine particle pattern.

    16.
    发明专利
    未知

    公开(公告)号:AT381432T

    公开(公告)日:2008-01-15

    申请号:AT02016946

    申请日:2002-08-01

    Applicant: FUJIFILM CORP

    Abstract: The present invention relates to a planographic printing plate precursor comprising a substrate comprising a hydrophilic surface having disposed thereon a heat-sensitive layer containing a thermoplastic particulate polymer having functional groups capable of interacting with the hydrophilic surface. Preferably, hydrophilic graft polymer chains are present on the hydrophilic surface of the substrate. The present invention further relates to a planographic printing plate precursor comprising a substrate comprising a hydrophilic surface having disposed thereon a heat-sensitive layer comprising microcapsules comprising a compound having functional groups capable of interacting with the hydrophilic surface. In addition, the present invention relates to methods of printing with the planographic printing plate precursors.

    18.
    发明专利
    未知

    公开(公告)号:DE05745977T1

    公开(公告)日:2007-10-11

    申请号:DE05745977

    申请日:2005-05-31

    Applicant: FUJIFILM CORP

    Abstract: The invention provides a multi-layer circuit board sequentially having an insulating substrate, a first electrically conductive pattern arbitrarily formed, an insulating material layer and a second electrically conductive pattern formed by providing an electrically conductive material on a graft polymer pattern formed on the insulating material layer, and having an electrically conductive path which electrically connects the first electrically conductive pattern present on the insulating substrate and the second electrically conductive pattern. The graft polymer pattern includes a combination of a region where a graft polymer is present and a region where no graft polymer is present, or a combination of a region where a hydrophilic graft polymer is present and a region where a hydrophobic graft polymer is present.

    19.
    发明专利
    未知

    公开(公告)号:DE112005002689T5

    公开(公告)日:2007-09-13

    申请号:DE112005002689

    申请日:2005-11-02

    Applicant: FUJIFILM CORP

    Inventor: KAWAMURA KOICHI

    Abstract: A particle laminated substrate and a method for manufacturing the particle laminated substrate are disclosed. The particle laminated substrate has a particle accumulation layer formed by accumulating and allowing particles to adhere onto a substrate having a surface where a graft polymer chain is present in which either terminal of the polymer is bonded to the surface of the substrate, by means of an electrostatic accumulating phenomenon, such that a particle density in the vicinity of the surface of the particle accumulation layer is higher than a particle density in the vicinity of the substrate.

Patent Agency Ranking