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公开(公告)号：US20240032242A1
公开(公告)日：2024-01-25
申请号：US17814453
申请日：2022-07-22
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Ernesto Ferrer Medina
CPC classification number: H05K7/20272 , H05K1/0203
Abstract: Example implementations relate to a cooling module, a circuit assembly having one or more circuit modules and the cooling module, and a method of forming the cooling module. The cooling module includes a first cooling component and a second cooling component disposed on the first cooling component. The first cooling component includes a plurality of microchannel blocks thermally coupled to a plurality of chipsets of the circuit module. The second cooling component includes an inlet port, an outlet port, and a plurality of distribution conduits fluidically coupled to the inlet port and outlet port. Each distribution conduit is disposed on one or more microchannel blocks of the plurality of microchannel blocks and directs coolant from the inlet port to the outlet port through the one or more microchannel blocks to absorb waste heat transferred to the one or more microchannel blocks from at least chipset of the plurality of chipsets.
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公开(公告)号：US11199192B1
公开(公告)日：2021-12-14
申请号：US16943069
申请日：2020-07-30
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： John Franz , Tahir Cader , Ernesto Ferrer Medina
Abstract: Example implementations relate to a method and system for pumping fluid with a pump assembly to cool waste-heat producing system of an apparatus. The pump assembly includes a first housing, a rotor assembly, a stator assembly, a second housing, an outlet connection port coupled to the second housing, and a guide vane insert. The first housing includes a first bore and first inlet guide vanes (IGVs) coupled to inlet of the first bore. The rotor assembly including an impeller, is disposed in the first bore. The stator assembly including a coil, is mounted around a portion of the first housing. The second housing has a second bore fluidically coupled to the first bore, and first outlet guide vanes (OGVs) coupled at an entrance of the second bore. The guide vane insert including second OGVs, is disposed within the outlet connection port and fluidically coupled to outlet of the second bore.
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公开(公告)号：US11157050B1
公开(公告)日：2021-10-26
申请号：US16860926
申请日：2020-04-28
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Harvey J. Lunsman , Ernesto Ferrer Medina , Tahir Cader , Steven Dean
Abstract: Example implementations relate to a method and system for cooling a compute node tray including a board, a plurality of first and second devices, a cooling assembly, and a support structure assembly. The cooling assembly includes a supply section, a return section, and an intermediate section coupled to the supply and return sections. The supply section includes a first conduit extending along a perimeter of the board and forming a thermal contact with the first devices. The intermediate section includes a plurality of cold plates and a plurality of second conduits forming the thermal contact with the second devices. The second conduits extends parallel to one another. The return section includes a third conduit extending parallel to a portion of the first conduit. The support structure encompasses the board and forms the thermal contact with a portion of the board, a plurality of third devices, and the cooling assembly.
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公开(公告)号：US10582640B2
公开(公告)日：2020-03-03
申请号：US15974798
申请日：2018-05-09
Applicant: Hewlett Packard Enterprise Development LP
Inventor： Tahir Cader , Harvey Lunsman , Ernesto Ferrer Medina , John Franz
Abstract: Cold plates are described herein. In one example, a cold plate can include a heat plate bay coupled to a first side and a second side of a coolant channel, a heat plate removably coupled within the heat plate bay, and a gasket coupled to the heat plate to seal the heat plate within the heat plate bay to provide a fluid path between the first side and the second side of the coolant channel.
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