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公开(公告)号：US20240329342A1
公开(公告)日：2024-10-03
申请号：US18740236
申请日：2024-06-11
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Harvey John Lunsman , Steven Dean
CPC classification number: G02B6/4269 , H05K7/20254 , H05K7/2049 , H05K7/20409
Abstract: A first electronic device may comprise a chassis and first fins. The chassis may be configured to removably couple with a second electronic device. The first fins are configured to interleave with second fins of the second electronic device in a coupled state of the first and second electronic devices. A corrugated thermal interface device comprises folded fins. The folded fins are coupled to the first fins and are also removably couplable to the second fins in the coupled state of the first and second electronic devices. Each folded fin comprises one or more lateral walls, and the corrugated thermal interface device further comprises a plurality of spring fingers coupled to and extending at least partially in a lateral direction from the lateral walls. The spring finger contacts may be contacted and displaced by the second fins in the coupled state of the first and second electronic devices.
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公开(公告)号：US11323787B1
公开(公告)日：2022-05-03
申请号：US17086044
申请日：2020-10-30
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Kevin B. Leigh , Luca Ramini , Mir Ashkan Seyedi , Steven Dean , Marco Fiorentino
Abstract: A photonic node includes a first circuit disposed on a first substrate and a second circuit disposed on a second substrate different from the first substrate. The first circuit is configured to route light signals originated from the photonic node to local nodes of a local group in which the photonic node is a member. The second circuit is configured to route light signals received from a node of an external group in which the photonic node is not a member, to one of the local nodes.
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公开(公告)号：US11307627B2
公开(公告)日：2022-04-19
申请号：US16863217
申请日：2020-04-30
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Torsten Wilde , Andy Warner , Steven Dean , Steven Martin , Pat Donlin
IPC: G06F1/26 , G06F1/3203 , G06F1/30 , H04L41/0833 , G06Q50/06 , G06F9/50 , G06F1/3287
Abstract: Systems and methods described herein make previously stranded power capacity (power that is provisioned for a data center according to a computing system's nameplate power consumption but is currently not useable) available to the data center. Systems described herein generate empirical power profiles that specify expected upper bounds for the power consumption levels that applications trigger. Using the upper bounds for application power-consumption levels, a computing system described herein can reliably release part of its provisioned nameplate power for other systems or data center consumers, reducing the amount of stranded power in a data center. The method described herein avoids performance penalties for most jobs by using sensor measurements made at a rapid rate explained herein to ensure that a system power cap based on running application's measured peak power consumption is reliable with reference to the power capacitance inherent in the computing system.
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公开(公告)号：US20240397667A1
公开(公告)日：2024-11-28
申请号：US18790187
申请日：2024-07-31
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Harvey J. Lunsman , Steven Dean
Abstract: Example implementations relate to a cooling assembly of a host circuit device, a circuit assembly including the host circuit device and a removable circuit device, and a method for thermal management of the removable circuit device removably connected to the host circuit device. The cooling assembly includes a cooling component and a thermal gap pad having an elastomer component movably connected to the cooling component and a plurality of beams embedded in the elastomer component. Each beam includes a first end portion, a second end portion, and a body portion extended between the first and second end portions. The first end portion of each of one or more beams is disposed in a first thermal contact with the cooling component and a second end portion of each of the one or more beams is disposed in a second thermal contact with a heat sink of the removable circuit device.
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公开(公告)号：US20230262928A1
公开(公告)日：2023-08-17
申请号：US17669753
申请日：2022-02-11
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Steven Dean , Michael Scott , Harvey J. Lunsman
CPC classification number: H05K7/20272 , F15B1/04 , H05K7/20781 , F15B2201/405 , F15B2201/605
Abstract: Examples described herein relate to compact and replaceable accumulator to be utilized in a chassis-level cooling device. The accumulator is a low pressurized device having a housing, a bladder, and a compressible fluid. The housing has an inner surface defining a volume and an opening. The bladder is disposed within a volume portion and attached to the opening. The bladder includes a plurality of elongated wall sections foldably coupled to each other and defining a bladder volume therebetween. The bladder inflates by unfolding the plurality of elongated wall sections to increase the bladder volume in response to an increase in a pressure of a working fluid inside the bladder volume. The compressible fluid is contained in a remaining volume portion between the inner surface of the housing and the bladder. The compressible fluid is compressed to an offset pressure in response to inflation of the plurality of elongated wall sections.
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Patent Agency Ranking
公开(公告)号：US11579668B2
公开(公告)日：2023-02-14
申请号：US17030677
申请日：2020-09-24
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Harvey J. Lunsman , Steven Dean , John Franz , Brady Dulian
Abstract: Example implementations relate to a host device and a method for thermal management of a removable device, such as a pluggable electronic transceiver comprising a plurality of spring fingers that provide multipoint contact conduction cooling of the removable device. The host device includes a host circuit board having a connector, and a thermal management unit having a cooling component and the plurality of spring fingers. The cooling component is coupled to a portion of the host circuit board and includes a partially protruded portion. Each of the plurality of spring fingers includes a first end coupled to the partially protruded portion, and a second end having a dry contact surface to establish a direct thermal interface with a peripheral surface of the removable device to allow waste-heat to transfer from the removable device to the cooling component through each spring finger.
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公开(公告)号：US20210333846A1
公开(公告)日：2021-10-28
申请号：US16860926
申请日：2020-04-28
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Harvey J. Lunsman , Ernesto Ferrer Medina , Tahir Cader , Steven Dean
Abstract: Example implementations relate to a method and system for cooling a compute node tray including a board, a plurality of first and second devices, a cooling assembly, and a support structure assembly. The cooling assembly includes a supply section, a return section, and an intermediate section coupled to the supply and return sections. The supply section includes a first conduit extending along a perimeter of the board and forming a thermal contact with the first devices. The intermediate section includes a plurality of cold plates and a plurality of second conduits forming the thermal contact with the second devices. The second conduits extends parallel to one another. The return section includes a third conduit extending parallel to a portion of the first conduit. The support structure encompasses the board and forms the thermal contact with a portion of the board, a plurality of third devices, and the cooling assembly.
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公开(公告)号：US10955883B1
公开(公告)日：2021-03-23
申请号：US16653335
申请日：2019-10-15
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： John Franz , Robert Mascia , Harvey Lunsman , Steven Dean , Michael Scott
Abstract: A computing apparatus includes an enclosure to house computing nodes; a slot to receive a power supply unit that is to provide power to the computing nodes; and a cold plate assembly positioned in the slot. The cold plate assembly includes a first thermal exchange surface and a cooling loop. The first thermal exchange surface is inclined relative to a horizontal dimension of the slot and is to make thermal contact with a complementary thermal exchange surface of the power supply unit when the power supply unit is received by the slot, the complementary thermal exchange surface also being inclined relative to a horizontal dimension of the slot. The cooling loop is thermally coupled to the first interface and through which liquid coolant is to flow.
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公开(公告)号：US20250159840A1
公开(公告)日：2025-05-15
申请号：US19019687
申请日：2025-01-14
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Steven Dean , Michael Scott , Harvey J. Lunsman
Abstract: Examples described herein relate to compact and replaceable accumulator to be utilized in a chassis-level cooling device. The accumulator is a low pressurized device having a housing, a bladder, and a compressible fluid. The housing has an inner surface defining a volume and an opening. The bladder is disposed within a volume portion and attached to the opening. The bladder includes a plurality of elongated wall sections foldably coupled to each other and defining a bladder volume therebetween. The bladder inflates by unfolding the plurality of elongated wall sections to increase the bladder volume in response to an increase in a pressure of a working fluid inside the bladder volume. The compressible fluid is contained in a remaining volume portion between the inner surface of the housing and the bladder. The compressible fluid is compressed to an offset pressure in response to inflation of the plurality of elongated wall sections.
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公开(公告)号：US11157050B1
公开(公告)日：2021-10-26
申请号：US16860926
申请日：2020-04-28
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Harvey J. Lunsman , Ernesto Ferrer Medina , Tahir Cader , Steven Dean
Abstract: Example implementations relate to a method and system for cooling a compute node tray including a board, a plurality of first and second devices, a cooling assembly, and a support structure assembly. The cooling assembly includes a supply section, a return section, and an intermediate section coupled to the supply and return sections. The supply section includes a first conduit extending along a perimeter of the board and forming a thermal contact with the first devices. The intermediate section includes a plurality of cold plates and a plurality of second conduits forming the thermal contact with the second devices. The second conduits extends parallel to one another. The return section includes a third conduit extending parallel to a portion of the first conduit. The support structure encompasses the board and forms the thermal contact with a portion of the board, a plurality of third devices, and the cooling assembly.
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