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    Chassis cooling resource
    11.
    发明授权
    Chassis cooling resource 有权

    公开(公告)号：US10356959B2

    公开(公告)日：2019-07-16

    申请号：US15665349

    申请日：2017-07-31

    Applicant: Hewlett Packard Enterprise Development LP

    Inventor： John P. Franz ,  Tahir Cader ,  Matthew Richard Slaby

    IPC: H05K7/20 ,  G05B15/02 ,  G01L13/00

    Abstract: Example implementations relate to a chassis cooling resource. In some examples, a chassis cooling resource includes a controller, comprising instructions to detect a failure corresponding to a first cooling system of a first chassis coupled to a server rack, and alter settings of a second cooling system of a second chassis coupled the server rack to provide additional cooling resources to the first cooling system in response to the detected failure.

    THERMAL BUS BAR
    14.
    发明申请
    THERMAL BUS BAR 审中-公开

    公开(公告)号：US20180032113A1

    公开(公告)日：2018-02-01

    申请号：US15550500

    申请日：2015-02-13

    Applicant: Hewlett Packard Enterprise Development LP

    Inventor： John Franz ,  Tahir Cader ,  William K. Norton

    IPC: G06F1/20 ,  G05D23/19 ,  H05K7/20

    CPC classification number: G06F1/20 ,  F28D15/00 ,  G05D23/1928 ,  G06F2200/201 ,  H05K7/20 ,  H05K7/20781

    Abstract: An example method includes positioning a thermal bus bar into a bus bar support channel of a cooling wall, the cooling wall comprising a plurality of thermal bus bars. The positioning comprises removably connecting first portions of at least two dripless connectors coupled to a fluid flow path of the thermal bus bar to second portions of the dripless connectors coupled to coolant transport lines that receive and return coolant from a coolant source. The method further includes flowing coolant received from the coolant transport lines through the fluid flow path and returning the coolant to the coolant transport lines. The thermal bus bar is positioned while coolant provided by the coolant transport lines is flowing through other thermal bus bars of the cooling wall.

    LIQUID COOLING WITH A COOLING CHAMBER
    15.
    发明申请
    LIQUID COOLING WITH A COOLING CHAMBER 审中-公开

    公开(公告)号：US20180027696A1

    公开(公告)日：2018-01-25

    申请号：US15546544

    申请日：2015-03-24

    Applicant: Hewlett Packard Enterprise Development LP

    Inventor： John P. Franz ,  Tahir Cader ,  William K. Norton

    IPC: H05K7/20

    CPC classification number: H05K7/20254 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/20272 ,  H05K7/20772 ,  H05K7/20781

    Abstract: Example implementations relate to liquid cooling with a cooling chamber. For example, a system for liquid cooling with a cooling chamber can include a liquid cooling chamber in contact with a heat generating device within a computing device, the liquid cooling chamber to contain a liquid coolant and transfer heat from the heat generating device into a liquid circulation loop extending around a perimeter of the liquid cooling chamber. The system for liquid cooling with a cooling chamber can further include a comb structure adjacent to the liquid cooling chamber to transfer heat into the liquid circulation loop, and a liquid exit pipe coupled to the liquid circulation loop to direct a flow of the liquid coolant.

    COOLING MODULE AND A METHOD OF COOLING AN ELECTRONIC CIRCUIT MODULE USING THE COOLING MODULE
    16.
    发明申请
    COOLING MODULE AND A METHOD OF COOLING AN ELECTRONIC CIRCUIT MODULE USING THE COOLING MODULE 有权

    公开(公告)号：US20250024636A1

    公开(公告)日：2025-01-16

    申请号：US18902330

    申请日：2024-09-30

    Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

    Inventor： Harvey J. Lunsman ,  Tahir Cader

    IPC: H05K7/20

    Abstract: Example implementations relate to a cooling module, and a method of cooling an electronic circuit module. The cooling module includes first and second cooling components fluidically connected to each other. The first cooling component includes a first fluid channel having supply, return, and body sections, and a second fluid channel. The second cooling component includes an intermediate fluid channel. The body section is bifurcated into first and second body sections, and the first and second body sections are further merged into a third body section. The supply section is connected to the first and second body sections. The return section is connected to the third body section and the intermediate fluid channel via an inlet fluid-flow path established between the first and second cooling components. The second fluid channel is connected to the intermediate fluid channel via an outlet fluid-flow path established between the first and second cooling components.

    Memory cooler
    19.
    发明授权
    Memory cooler 有权

    公开(公告)号：US11877422B2

    公开(公告)日：2024-01-16

    申请号：US17399940

    申请日：2021-08-11

    Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

    Inventor： John Franz ,  Ernesto Ferrer ,  Tahir Cader

    IPC: H05K7/20 ,  F28F9/02 ,  H05K1/02

    CPC classification number: H05K7/20272 ,  F28F9/0224 ,  F28F9/0248 ,  H05K1/0203 ,  H05K7/20218 ,  H05K7/20254 ,  H05K2201/10159

    Abstract: A memory cooler includes a unitary thermal transfer device and a pair of endcaps. The unitary thermal transfer device includes heat transfer tubes, a first end block, a second end block, an inlet chamber, an outlet chamber, an inlet, and an outlet. The first and second end blocks are structurally integrated with each of the heat transfer tubes. The inlet and outlet chambers are partially defined by either the first end block or the second end block. Each of the inlet and outlet chambers are fluidly coupled with the respective liquid flow channel of the at least one heat transfer tube. The respective flow channels to which the inlet and outlet chambers are coupled may be the same or different to define either a direct or a serpentine flow path. Each endcap is affixed to a respective one of the first end block and the second end block to define, in conjunction with the first end block and second end block, the inlet chamber and the outlet chamber.

    COOLING MODULE AND A METHOD OF ASSEMBLING THE COOLING MODULE TO AN ELECTRONIC CIRCUIT MODULE
    20.
    发明公开
    COOLING MODULE AND A METHOD OF ASSEMBLING THE COOLING MODULE TO AN ELECTRONIC CIRCUIT MODULE 审中-公开

    公开(公告)号：US20230180432A1

    公开(公告)日：2023-06-08

    申请号：US17541477

    申请日：2021-12-03

    Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

    Inventor： Harvey J. Lunsman ,  Tahir Cader

    IPC: H05K7/20 ,  H05K1/02

    CPC classification number: H05K7/20272 ,  H05K1/0203

    Abstract: Example implementations relate to a cooling module of a circuit assembly having a frame and an electronic circuit module including first and second chipsets, and a method of assembling the cooling module. The cooling module includes first and second cooling components. The first cooling component is connectable to the frame to establish a first thermal interface between the first cooling component and the first chipset. The first cooling component is positioned within a recess portion of the second cooling component, and each connector of a pair of second fluid connectors in the second cooling component is movably connected to a respective connector of a pair of first fluid connectors in the first cooling component to establish a fluid-flow path between the first and second cooling components. The second cooling component is connectable to the frame to establish a second thermal interface between the second cooling component and the second chipset.

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