公开(公告)号：US11785743B2

公开(公告)日：2023-10-10

申请号：US17237732

申请日：2021-04-22

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： John Franz ,  Ernesto Ferrer

IPC: H05K7/20 ,  H05K1/02 ,  H05K5/02

CPC classification number: H05K7/20336 ,  H05K1/0201 ,  H05K5/0213 ,  H05K7/20327

Abstract: A thin, single-layer thermally conductive jacket surrounds a PCA. One or more living springs integrated in the jacket exert compressive force on PCA components where cooling is desired. The compressive force creates and maintains a thermal contact though which heat is conducted out of the PCA components and into the jacket. The jacket conducts the heat (either directly or indirectly) to a liquid-cooled cold plate configured as a cooling frame surrounding one or more of the jacketed PCAs. The jacket, optionally through intermediate thermal transfer devices such as heat spreaders or heat pipes, transfers heat from components on the PCA to the cooling frame. Liquid flowing through the cooling frame's internal channels convects the heat out of the electronic device. Turbulence encouraged by turbulence enhancing artifacts including bends and shape-changes along the internal channels increases the efficiency of the convection.

公开(公告)号：US20220240416A1

公开(公告)日：2022-07-28

申请号：US17155304

申请日：2021-01-22

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Harvey J. Lunsman ,  Ernesto Ferrer ,  John Franz

IPC: H05K7/20

Abstract: Example implementations relate to an electronic system providing thermal management of a removable device when connected to a host device of the electronic system including a receptacle, and a heat transfer device having first and second portions. The host device has a cooling component. The removable device having a heat spreader, is detachably coupled to the host device. The receptacle having spring fingers, is coupled to one of the cooling component or the heat spreader. The first portion is coupled to one of the cooling component or the heat spreader, and the second portion is protruded outwards. When the removable device is connected to the host device, the second portion extends through the receptacle such that the spring fingers establish direct thermal interface with the second portion to allow waste-heat to transfer between the heat transfer device and one of the cooling component or the heat spreader via the receptacle.

公开(公告)号：US20220344239A1

公开(公告)日：2022-10-27

申请号：US17240688

申请日：2021-04-26

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Harvey J. Lunsman ,  Ernesto Ferrer ,  Brady Dulian ,  Steven Dean

IPC: H01L23/373 ,  H05K1/02

Abstract: Examples described herein relate to a cooling assembly. In some examples, the cooling assembly includes a cooling component and a thermal gap pad disposed in thermal contact with the cooling component. The thermal gap pad includes thermally conductive fabric that is curved at a plurality of locations along one or both of its length or its breadth, wherein a first side of the thermal gap pad is disposed in thermal contact with the cooling component and a second side of the thermal gap pad is disposable in thermal contact with a heat generating component. Certain examples described herein also relate to an electronic circuit module having the cooling assembly.

公开(公告)号：US09651275B2

公开(公告)日：2017-05-16

申请号：US15233449

申请日：2016-08-10

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Tahir Cader ,  Ernesto Ferrer ,  Matthew R Slaby ,  Wade D Vinson

IPC: F24F13/04 ,  F24F13/08 ,  H05K7/20 ,  F24F13/15 ,  F25B13/00 ,  B23P19/04 ,  F24F7/08 ,  F24F13/30 ,  F28D19/04 ,  G06F1/20 ,  F24F11/00 ,  F24F13/22

CPC classification number: F24F13/04 ,  F24F11/84 ,  F24F13/08 ,  F24F13/15 ,  F24F2013/221 ,  H05K7/20145 ,  H05K7/20745 ,  Y02B30/542 ,  Y10T137/0318

Abstract: Examples described herein relate to adiabatic cooling units. For example, a method for mixing gases within an adiabatic cooling unit includes allowing a first gas at a first temperature to enter a mixing chamber on a non-exposed side of an adiabatic cooling media and utilizing a first baffle to direct the first gas in a direction away from the adiabatic cooling media. The method includes allowing a second gas at a second temperature to enter the mixing chamber on an exposed side of the adiabatic cooling media and allowing the first gas and the second gas to mix in the mixing chamber creating a mixed gas. The method also includes creating an inlet with the first baffle and a second baffle to direct the mixed gas away from the adiabatic cooling media and allowing the mixed gas to enter through the exposed side of the adiabatic cooling media.

公开(公告)号：US20230345668A1

公开(公告)日：2023-10-26

申请号：US18345213

申请日：2023-06-30

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Harvey J. Lunsman ,  Ernesto Ferrer ,  John Franz

IPC: H05K7/20

CPC classification number: H05K7/20254 ,  H05K7/20336

Abstract: Example implementations relate to an electronic system providing thermal management of a removable device when connected to a host device of the electronic system including a receptacle, and a heat transfer device having first and second portions. The host device has a cooling component. The removable device having a heat spreader, is detachably coupled to the host device. The receptacle having spring fingers, is coupled to one of the cooling component or the heat spreader. The first portion is coupled to one of the cooling component or the heat spreader, and the second portion is protruded outwards. When the removable device is connected to the host device, the second portion extends through the receptacle such that the spring fingers establish direct thermal interface with the second portion to allow waste-heat to transfer between the heat transfer device and one of the cooling component or the heat spreader via the receptacle.

公开(公告)号：US20220369513A1

公开(公告)日：2022-11-17

申请号：US17237732

申请日：2021-04-22

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： John Franz ,  Ernesto Ferrer

IPC: H05K7/20 ,  H05K1/02 ,  H05K5/02

Abstract: A thin, single-layer thermally conductive jacket surrounds a PCA. One or more living springs integrated in the jacket exert compressive force on PCA components where cooling is desired. The compressive force creates and maintains a thermal contact though which heat is conducted out of the PCA components and into the jacket. The jacket conducts the heat (either directly or indirectly) to a liquid-cooled cold plate configured as a cooling frame surrounding one or more of the jacketed PCAs. The jacket, optionally through intermediate thermal transfer devices such as heat spreaders or heat pipes, transfers heat from components on the PCA to the cooling frame. Liquid flowing through the cooling frame's internal channels convects the heat out of the electronic device. Turbulence encouraged by turbulence enhancing artifacts including bends and shape-changes along the internal channels increases the efficiency of the convection.

公开(公告)号：US11877422B2

公开(公告)日：2024-01-16

申请号：US17399940

申请日：2021-08-11

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： John Franz ,  Ernesto Ferrer ,  Tahir Cader

IPC: H05K7/20 ,  F28F9/02 ,  H05K1/02

CPC classification number: H05K7/20272 ,  F28F9/0224 ,  F28F9/0248 ,  H05K1/0203 ,  H05K7/20218 ,  H05K7/20254 ,  H05K2201/10159

Abstract: A memory cooler includes a unitary thermal transfer device and a pair of endcaps. The unitary thermal transfer device includes heat transfer tubes, a first end block, a second end block, an inlet chamber, an outlet chamber, an inlet, and an outlet. The first and second end blocks are structurally integrated with each of the heat transfer tubes. The inlet and outlet chambers are partially defined by either the first end block or the second end block. Each of the inlet and outlet chambers are fluidly coupled with the respective liquid flow channel of the at least one heat transfer tube. The respective flow channels to which the inlet and outlet chambers are coupled may be the same or different to define either a direct or a serpentine flow path. Each endcap is affixed to a respective one of the first end block and the second end block to define, in conjunction with the first end block and second end block, the inlet chamber and the outlet chamber.

公开(公告)号：US11729943B2

公开(公告)日：2023-08-15

申请号：US17155304

申请日：2021-01-22

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Harvey J. Lunsman ,  Ernesto Ferrer ,  John Franz

IPC: H05K7/20

CPC classification number: H05K7/20254 ,  H05K7/20336

Abstract: Example implementations relate to an electronic system providing thermal management of a removable device when connected to a host device of the electronic system including a receptacle, and a heat transfer device having first and second portions. The host device has a cooling component. The removable device having a heat spreader, is detachably coupled to the host device. The receptacle having spring fingers, is coupled to one of the cooling component or the heat spreader. The first portion is coupled to one of the cooling component or the heat spreader, and the second portion is protruded outwards. When the removable device is connected to the host device, the second portion extends through the receptacle such that the spring fingers establish direct thermal interface with the second portion to allow waste-heat to transfer between the heat transfer device and one of the cooling component or the heat spreader via the receptacle.

公开(公告)号：US20230047496A1

公开(公告)日：2023-02-16

申请号：US17399940

申请日：2021-08-11

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP.

Inventor： John Franz ,  Ernesto Ferrer ,  Tahir Cader

IPC: H05K7/20 ,  F28F9/02 ,  H05K1/02

Abstract: A memory cooler includes a unitary thermal transfer device and a pair of endcaps. The unitary thermal transfer device includes heat transfer tubes, a first end block, a second end block, an inlet chamber, an outlet chamber, an inlet, and an outlet. The first and second end blocks are structurally integrated with each of the heat transfer tubes. The inlet and outlet chambers are partially defined by either the first end block or the second end block. Each of the inlet and outlet chambers are fluidly coupled with the respective liquid flow channel of the at least one heat transfer tube. The respective flow channels to which the inlet and outlet chambers are coupled may be the same or different to define either a direct or a serpentine flow path. Each endcap is affixed to a respective one of the first end block and the second end block to define, in conjunction with the first end block and second end block, the inlet chamber and the outlet chamber.