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    Photostructured optical devices and methods for making same
    11.
    发明授权
    Photostructured optical devices and methods for making same 有权
    光结构光学器件及其制造方法

    公开(公告)号：US09146377B2

    公开(公告)日：2015-09-29

    申请号：US12686986

    申请日：2010-01-13

    Applicant: Henry Helvajian

    Inventor： Henry Helvajian

    IPC: B29D11/00 ,  G02B7/00 ,  G02B6/12

    CPC classification number: G02B27/142 ,  G02B5/0236 ,  G02B5/0268 ,  G02B5/1852 ,  G02B6/105 ,  G02B7/00 ,  G02B27/1073 ,  G02B2006/12035 ,  G02B2006/12171 ,  G02F1/011

    Abstract: A photostructurable ceramic is processed using photostructuring process steps for embedding devices within a photostructurable ceramic volume, the devices including chemical, mechanical, electronic, electromagnetic, optical, and acoustic devices, all made in part by creating device material within the ceramic or by disposing a device material through surface ports of the ceramic volume, with the devices being interconnected using internal connections and surface interfaces.

    Abstract translation: 使用光电结构化工艺步骤处理可光致结构陶瓷，用于将可见光陶瓷体积中的器件嵌入，所述器件包括化学，机械，电子，电磁，光学和声学器件，其部分通过在陶瓷内产生器件材料或通过设置 器件材料通过陶瓷体积的表面端口，其中设备使用内部连接和表面接口互连。

    Photostructured Optical Devices and Methods for Making Same
    13.
    发明申请
    Photostructured Optical Devices and Methods for Making Same 有权
    光电装置及其制造方法

    公开(公告)号：US20110170210A1

    公开(公告)日：2011-07-14

    申请号：US12686986

    申请日：2010-01-13

    Applicant: Henry Helvajian

    Inventor： Henry Helvajian

    IPC: G02B7/00 ,  B29D11/00

    CPC classification number: G02B27/142 ,  G02B5/0236 ,  G02B5/0268 ,  G02B5/1852 ,  G02B6/105 ,  G02B7/00 ,  G02B27/1073 ,  G02B2006/12035 ,  G02B2006/12171 ,  G02F1/011

    Abstract: A photostructurable ceramic is processed using photostructuring process steps for embedding devices within a photostructurable ceramic volume, the devices including chemical, mechanical, electronic, electromagnetic, optical, and acoustic devices, all made in part by creating device material within the ceramic or by disposing a device material through surface ports of the ceramic volume, with the devices being interconnected using internal connections and surface interfaces.

    Abstract translation: 使用光电结构化工艺步骤处理可光致结构陶瓷，用于将可见光陶瓷体积中的器件嵌入，所述器件包括化学，机械，电子，电磁，光学和声学器件，其部分通过在陶瓷内产生器件材料或通过设置 器件材料通过陶瓷体积的表面端口，其中设备使用内部连接和表面接口互连。

    Ultraminiature broadband light source and method of manufacturing same
    14.
    发明授权
    Ultraminiature broadband light source and method of manufacturing same 失效
    超微型宽带光源及其制造方法

    公开(公告)号：US07755292B1

    公开(公告)日：2010-07-13

    申请号：US11625545

    申请日：2007-01-22

    Applicant: Margaret L. Tuma ,  Joseph S. Collura ,  Henry Helvajian ,  Michael D. Pocha ,  Glenn A. Meyer ,  Charles F. McConaghy ,  Barry L. Olsen ,  William W Hansen

    Inventor： Margaret L. Tuma ,  Joseph S. Collura ,  Henry Helvajian ,  Michael D. Pocha ,  Glenn A. Meyer ,  Charles F. McConaghy ,  Barry L. Olsen ,  William W Hansen

    IPC: H01J17/04 ,  H01J61/04

    CPC classification number: H01K1/14 ,  G01J3/10 ,  H01K1/18 ,  H01K7/00

    Abstract: An ultraminiature light source using a double-spiral shaped tungsten filament includes end contact portions which are separated to allow for radial and length-wise unwinding of the spiral. The double-spiral filament is spaced relatively far apart at the end portions thereof so that contact between portions of the filament upon expansion is avoided. The light source is made by fabricating a double-spiral ultraminiature tungsten filament from tungsten foil and housing the filament in a ceramic package having a reflective bottom and a well wherein the filament is suspended. A vacuum furnace brazing process attaches the filament to contacts of the ceramic package. Finally, a cover with a transparent window is attached onto the top of the ceramic package by solder reflow in a second vacuum furnace process to form a complete hermetically sealed package.

    Abstract translation: 使用双螺旋形钨丝的超微型光源包括端部接触部分，其被分离以允许螺旋的径向和纵向展开。 双螺旋丝在其端部处间隔相对较远，从而避免了在膨胀时细丝部分之间的接触。 光源通过从钨箔制造双螺旋超薄钨丝制成，并将灯丝容纳在具有反射底部和阱的陶瓷封装中，其中灯丝被悬挂。 真空炉钎焊工艺将灯丝连接到陶瓷封装的触点。 最后，通过在第二真空炉工艺中通过回流焊接将具有透明窗口的盖子附接到陶瓷封装的顶部，以形成完整的密封封装。

    Laser assisted chemical etching method for release microscale and nanoscale devices
    15.
    发明授权
    Laser assisted chemical etching method for release microscale and nanoscale devices 有权
    激光辅助化学蚀刻方法用于释放微米级和纳米级器件

    公开(公告)号：US07419915B2

    公开(公告)日：2008-09-02

    申请号：US11061485

    申请日：2005-02-17

    Applicant: Margaret H. Abraham ,  Henry Helvajian ,  Siegfried W. Janson

    Inventor： Margaret H. Abraham ,  Henry Helvajian ,  Siegfried W. Janson

    IPC: H01L21/302

    CPC classification number: H01L21/31116 ,  B81C1/00484 ,  B81C2201/0132 ,  B81C2201/0143 ,  H01L21/26533

    Abstract: A method using an etchant and a laser for localized precise heating enables precise etching and release of MEMS devices with improved process control while expanding the number of materials used to make MEMS, including silicon-dioxide patterned films buried in and subsequently released from bulk silicon, as a direct write method of release of patterned structures that enables removal of only that material needed to allow the device to perform to be precisely released, after which, the bulk material can be further processed for additional electrical or packaging functions.

    Abstract translation: 使用蚀刻剂和激光器进行局部精确加热的方法使得可以通过改进的工艺控制精确地蚀刻和释放MEMS器件，同时扩大用于制造MEMS的材料的数量，包括埋入并随后从体硅释放的二氧化硅图案化膜， 作为图案化结构的释放的直接写入方法，其能够仅去除允许器件执行精确释放所需的材料，之后可以进一步处理散装材料以用于额外的电气或封装功能。

    Laser assisted chemical etching method for release of microscale and nanoscale devices
    16.
    发明申请
    Laser assisted chemical etching method for release of microscale and nanoscale devices 有权
    激光辅助化学蚀刻方法用于微尺寸和纳米级器件的释放

    公开(公告)号：US20060183330A1

    公开(公告)日：2006-08-17

    申请号：US11061485

    申请日：2005-02-17

    Applicant: Margaret Abraham ,  Henry Helvajian ,  Siegfried Janson

    Inventor： Margaret Abraham ,  Henry Helvajian ,  Siegfried Janson

    IPC: H01L21/302 ,  B23K26/16

    CPC classification number: H01L21/31116 ,  B81C1/00484 ,  B81C2201/0132 ,  B81C2201/0143 ,  H01L21/26533

    Abstract: A method using an etchant and a laser for localized precise heating enables precise etching and release of MEMS devices with improved process control while expanding the number of materials used to make MEMS, including silicon-dioxide patterned films buried in and subsequently released from bulk silicon, as a direct write method of release of patterned structures that enables removal of only that material needed to allow the device to perform to be precisely released, after which, the bulk material can be further processed for additional electrical or packaging functions.

    Abstract translation: 使用蚀刻剂和激光器进行局部精确加热的方法使得可以通过改进的工艺控制精确地蚀刻和释放MEMS器件，同时扩大用于制造MEMS的材料的数量，包括埋入并随后从体硅释放的二氧化硅图案化膜， 作为图案化结构的释放的直接写入方法，其能够仅去除允许器件执行精确释放所需的材料，之后可以进一步处理散装材料以用于额外的电气或封装功能。

    Integrated glass ceramic systems
    17.
    发明申请
    Integrated glass ceramic systems 有权
    集成玻璃陶瓷系统

    公开(公告)号：US20050135724A1

    公开(公告)日：2005-06-23

    申请号：US10741795

    申请日：2003-12-19

    Applicant: Henry Helvajian ,  Siegfried Janson

    Inventor： Henry Helvajian ,  Siegfried Janson

    IPC: B64G1/10 ,  B64G1/26 ,  B64G1/36 ,  B64G1/40 ,  B64G1/42 ,  B64G1/44 ,  B64G1/66 ,  C03C10/00 ,  C03C15/00 ,  G02B6/42 ,  G02B6/12

    CPC classification number: B64G1/10 ,  B64G1/26 ,  B64G1/361 ,  B64G1/402 ,  B64G1/425 ,  B64G1/443 ,  B64G1/66 ,  C03C10/00 ,  C03C15/00 ,  G02B6/4246

    Abstract: Integrated glass ceramic spacecraft include a plurality of glass ceramic components including molded, tempered, annealed, and patterned glass ceramic components coupled together for forming a support structure or frame or housing through which is communicated optical signals through an optical communications grid and electrical signals through an electrical communications grid, with the optical communications grid and electrical communication grid forming a composite electrooptical communications grid for spacecraft wide intercommunications. The support structure multifunctions as a frame, a housing, a support, a thermal control system, and as part of an electrooptical communications grid while encapsulating a plurality of optical, electronic, electrical, and MEMS devices between which is communicated the electrical and optical signals over the electrooptical communication grid.

    Abstract translation: 集成的玻璃陶瓷航天器包括多个玻璃陶瓷部件，包括耦合在一起的模制，回火，退火和图案化的玻璃陶瓷部件，用于形成支撑结构或框架或壳体，通过该支撑结构或框架或壳体通过光通信网格传送光信号，并通过 电气通信网格，与光通信网格和电气通信网格形成复合电光通信网格，用于航天器广泛的通信。 支撑结构作为框架，壳体，支撑件，热控制系统以及作为电光通信网格的一部分而多功能，同时封装多个光学，电子，电气和MEMS器件，在其间传送电和光信号 在电光通信网格上。

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