公开(公告)号：DE69724159T2

公开(公告)日：2004-05-06

申请号：DE69724159

申请日：1997-09-19

Applicant: IBM

Inventor： BIEBUYCK HANS ,  MICHEL BRUNO ,  SCHMID HEINZ

IPC: G03F1/00 ,  G03F7/20 ,  H01L21/027 ,  G03F1/14

Abstract: Optical lithography scheme making use of light coupling structures, and elastomeric light coupling structures in particular. These light coupling structures comprise protruding portions and connecting portions. The protruding elements are designed to be brought into conformal contact with a resist to be exposed such that the light guided into the protruding elements is coupled from there directly into the resist. The lateral shape and size of the protruding elements defines 1:1 the lateral size and shape of small features to be exposed in the resist.

公开(公告)号：DE69817329D1

公开(公告)日：2003-09-25

申请号：DE69817329

申请日：1998-06-02

Applicant: IBM

Inventor： BERNARD ANDRE ,  MICHEL BRUNO ,  BIEBUYCK HANS ,  SCHMID HEINZ ,  DELAMARCHE EMMANUEL

IPC: G01N13/02 ,  G01N33/483

公开(公告)号：DE69624934T2

公开(公告)日：2003-07-31

申请号：DE69624934

申请日：1996-09-06

Applicant: IBM

Inventor： BIEBUYCK HANS ,  DELAMARCHE EMMANUEL ,  MICHEL BRUNO

IPC: G01N33/543 ,  B01J19/00 ,  B05D1/18 ,  B05D1/28 ,  C07K17/14 ,  C40B40/06 ,  C40B40/10 ,  C40B60/14

Abstract: PCT No. PCT/IB96/00908 Sec. 371 Date Apr. 29, 1998 Sec. 102(e) Date Apr. 29, 1998 PCT Filed Sep. 6, 1996 PCT Pub. No. WO98/09735 PCT Pub. Date Mar. 12, 1998A method is proposed with which chemically defined bodies can be deposited on a substrate. Therefor, the bodies are fixed with a predetermined orientation on a stamping means which is then approached to the substrate whereby the bodies are deposited. While releasing the stamping means the bodies remain on the substrate keeping their orientation.

公开(公告)号：DE69615410T2

公开(公告)日：2002-06-20

申请号：DE69615410

申请日：1996-07-10

Applicant: IBM

Inventor： BIEBUYCK HANS ,  HASKAL ELIAV

IPC: B05D3/02 ,  C08G77/06 ,  H01L51/52 ,  H05B33/20 ,  H05B33/22

Abstract: An organic light emitting device (10) is provided which is encapsulated by a Siloxane film (17). This Siloxane film (17) is applied to the light emitting portion of the diode (10) providing for protection against contamination, degradation, oxidation and the like. The Siloxane film (17) carries an optical element, such as a lens (18) for example. This optical element (18) is arranged such that the light generated inside the diode (10) is output through it.