-
公开(公告)号：DE10018190A1
公开(公告)日：2001-02-08
申请号：DE10018190
申请日：2000-04-12
Applicant: IBM
Inventor： GOLDRIAN GOTTFRIED
Abstract: Networked computer systems, particularly high-end systems with a number of CECs distributed into several clusters, require perfect phase coincidence of the clock-signals, owing to the sensitivity of the phase-locked loop (PLL) circuits operating at several hundred MHz, with a accuracy of about 20 pico-seconds (ps) required in the phase coincidence. Both clock-phase signals need to be monitored in order to find the exact time at which phase coincidence of the signals occurs, and then to switch over from one clock-source to the other. The signal phases are not compared directly, but an auxiliary signal, or phase-detector signal, is generated from both clock-signals and is used to find the required time-point having the necessary characteristics of the time-dependent phase displacement or shift.
-
公开(公告)号：DE112011100140B4
公开(公告)日：2019-07-11
申请号：DE112011100140
申请日：2011-02-04
Applicant: IBM
Inventor： GOLDRIAN GOTTFRIED , RIES MANFRED
IPC: G06F1/20 , H01L23/473
Abstract: Eine Flüssigkühleinheit (1) zum Kühlen eines DIMM (2) mit einer Vielzahl von Speicherbausteinen (4) umfasst zwei Wärmeverteilelemente (5), die entlang der Vielzahl von Speicherbausteinen (4) angeordnet sind, einen von einer Flüssigkeitsleitung (10) durchzogenen kalten Schienenblock (7), der sich entlang der Wärmeverteilelemente (5) erstreckt, und zwei Thermoadapter (8), die zwischen dem kalten Schienenblock (7) und den Speicherbausteinen (4) des DIMM verschachtelt eingesetzt werden. Die Thermoadapter (8) sind in einer zur Ebene der Leiterplatte des DIMM (2) senkrechten Richtung komprimierbar, so dass die Komponenten (5, 7, 8) der Kühleinheit (1) verschoben und relativ zueinander in einer zur Ebene des DIMM (2) senkrechten Richtung angeglichen werden können. In einer bevorzugten Ausführungsform wird auf einander zugewandte glatte Oberflächen von benachbarten Komponenten (5, 8) in der Kühleinheit (1) ein Schmiermittel aufgebracht, wodurch ein reibungsarmes Verschieben dieser Komponenten (5, 8) relativ zueinander ermöglicht und gestattet wird, das DIMM (2) einfach aus der Kühleinheit (1) auszubauen und ohne Kraftaufwand und Werkzeugeinsatz auszutauschen.
-
公开(公告)号：GB2488738B
公开(公告)日：2014-02-12
申请号：GB201211726
申请日：2011-02-04
Applicant: IBM
Inventor： GOLDRIAN GOTTFRIED , RIES MANFRED
IPC: H01L23/473
-
公开(公告)号：DE112011100140T5
公开(公告)日：2012-10-04
申请号：DE112011100140
申请日：2011-02-04
Applicant: IBM
Inventor： GOLDRIAN GOTTFRIED , RIES MANFRED
IPC: H01L23/473
Abstract: Eine Flüssigkühleinheit (1) zum Kühlen eines DIMM (2) mit einer Vielzahl von Speichermodulen (4) umfasst ein Wärmeverteilelement (5), das entlang der Vielzahl von Speichermodulen (4) angeordnet ist, einen kalten Schienenblock (7), der sich entlang des Wärmeverteilelements (5) erstreckt, und einen Thermoadapter 8), der zwischen dem kalten Schienenblock (7) und den Speichermodulen (4) des DIMM verschachtelt eingesetzt wird. Der Thermoadapter (8) ist in einer zur Ebene der Leiterplatte des DIMM (2) senkrechten Richtung komprimierbar, so dass die Komponenten (5, 7, 8) der Kühleinheit (1) verschoben und relativ zueinander in einer zur Ebene des DIMM (2) senkrechten Richtung angeglichen werden können. In einer bevorzugten Ausführungsform wird auf einander zugewandte glatte Oberflächen von benachbarten Komponenten (5, 8) in der Kühleinheit (1) ein Schmiermittel aufgebracht, wodurch ein reibungsarmes Verschieben dieser Komponenten (5, 8) relativ zueinander ermöglicht und gestattet wird, das DIMM (2) einfach aus der Kühleinheit (1) auszubauen und ohne Kraftaufwand und Werkzeugeinsatz auszutauschen.
-
Patent Agency Ranking
公开(公告)号：GB2488738A
公开(公告)日：2012-09-05
申请号：GB201211726
申请日：2011-02-04
Applicant: IBM
Inventor： GOLDRIAN GOTTFRIED , RIES MANFRED
IPC: H01L23/473
Abstract: A liquid cooling device (1) for cooling a DIMM (2) with a plurality of memory modules (4) comprises a heat spreader (5) disposed along the plurality of memory modules (4), a cold rail block (7) extending along the heat spreader (5) and a thermal adapter(8) interleaved between the cold rail block (7) and the memory modules (4) of the DIMM. The thermal adapter (8) is compressible in a direction perpendicular to the plane of the DIMM (2)board, thus allowing the components (5, 7, 8) of the cooling device (1) to be moved and adjusted relative to each other in a direction perpendicular to the plane of the DIMM (2). In a preferred embodiment, matching smooth surfaces of adjacent components (5, 8) within the cooling device (1) are collated with a lubricant, thus permitting a low-friction gliding of these components (5, 8) relative to each other and allowing the DIMM (2) to be easily removed from the cooling device (1) and to be replaced without effort and without tooling.
-
公开(公告)号：DE69727172T2
公开(公告)日：2004-08-12
申请号：DE69727172
申请日：1997-07-08
Applicant: IBM
Inventor： GOLDRIAN GOTTFRIED
IPC: G06F13/36 , G06F12/08 , G06F13/42 , G06F15/167
Abstract: The exchange of commands and data between I/O devices, such as DASDs, and a computer system, preferrably a multiprocessor computer system, usually takes place via I/O adapters. The question arises of how to couple these I/O adapters to the computer system. In prior art solutions, the I/O adapters were either attached to the second level cache or to a memory bus. The present invention relates to a method of coupling the stream of I/O commands and I/O data to the computer system via the processor busses. Because of the high bandwidth of the processor busses, an additional transmission of I/O data does not disturb regular data traffic on the processor bus. One advantage of using the processor busses for the transmission of I/O data is that pins of the second level cache chips don't have to be used for the attachment of I/O adapters any more and thus become available for other purposes. For example, the bandwidths of processor busses or memory busses can be increased, or additional processor busses can be accomodated. The invention is especially useful with regard to a coupling facility. In a computer system which consists of a multitude of coupled computer systems, a coupling facility is the central computer system responsible for the management of data flow between the attached computer systems and for the management of a rather large central memory. The large amount of I/O and intersystem traffic arising in such a system can be handled by the invention proposed.
-
公开(公告)号：DE69727172D1
公开(公告)日：2004-02-19
申请号：DE69727172
申请日：1997-07-08
Applicant: IBM
Inventor： GOLDRIAN GOTTFRIED
IPC: G06F13/36 , G06F12/08 , G06F13/42 , G06F15/167
Abstract: The exchange of commands and data between I/O devices, such as DASDs, and a computer system, preferrably a multiprocessor computer system, usually takes place via I/O adapters. The question arises of how to couple these I/O adapters to the computer system. In prior art solutions, the I/O adapters were either attached to the second level cache or to a memory bus. The present invention relates to a method of coupling the stream of I/O commands and I/O data to the computer system via the processor busses. Because of the high bandwidth of the processor busses, an additional transmission of I/O data does not disturb regular data traffic on the processor bus. One advantage of using the processor busses for the transmission of I/O data is that pins of the second level cache chips don't have to be used for the attachment of I/O adapters any more and thus become available for other purposes. For example, the bandwidths of processor busses or memory busses can be increased, or additional processor busses can be accomodated. The invention is especially useful with regard to a coupling facility. In a computer system which consists of a multitude of coupled computer systems, a coupling facility is the central computer system responsible for the management of data flow between the attached computer systems and for the management of a rather large central memory. The large amount of I/O and intersystem traffic arising in such a system can be handled by the invention proposed.
-
公开(公告)号：DE3675766D1
公开(公告)日：1991-01-03
申请号：DE3675766
申请日：1986-03-25
Applicant: IBM DEUTSCHLAND
Inventor： FISCHER LUDWIG , GOLDRIAN GOTTFRIED , ZIMMERMANN VOLKER DR
-
公开(公告)号：CA1199219A
公开(公告)日：1986-01-14
申请号：CA422613
申请日：1983-03-01
Applicant: IBM
Inventor： GOLDRIAN GOTTFRIED , WOHNSDORF MANFRED E , RUDOLPH VOLKER
Abstract: METHOD OF AND ARRANGEMENT FOR CONTROLLING A ROW OF PRINT ELECTRODES FOR RECORDING INFORMATION ON AN ELECTROSENSITIVE RECORD CARRIER The invention concerns a method of and an arrangement for controlling a row of print electrodes for recording information on an electrosensitive record carrier, preferably a record carrier covered with a metallic or metalliferous layer, by means of a print head movable relatively parallel to the surface of the record carrier and comprising a row of print electrodes controlled by print pulses, and a control circuit for the timely generation of print pulses from digital or analog signals, whereby each print current pulse consists of a first section of relatively high amplitude and relatively short duration and a second section of relatively low amplitude and relatively long duration in such a manner that the first section of each print current pulse is used as a print pulse and the second section as a self-extinguishing burn-out pulse.
-
-
-
-
-
-
-
-
Search Results
19
records
(took 0.016 seconds)
