公开(公告)号：GB2485718A

公开(公告)日：2012-05-23

申请号：GB201203499

申请日：2010-08-12

Applicant: IBM

Inventor： DING HANYI ,  JOSEPH ALVIN ,  WOODS WAYNE H

IPC: H01P5/16 ,  H01L23/48 ,  H01P11/00

Abstract: A method, structure, and design structure for a through-silicon- via Wilkinson power divider (100). A method includes: forming an input (105) on a first side of a substrate(200); forming a first leg (110a) comprising a first through-silicon- via (120a) formed in the substrate, wherein the first leg electrically connects the input and a first output (115a); forming a second leg (110b) comprising a second through-silicon- via (120b) formed in the substrate, wherein the second leg electrically connects the input and a second output (115b), and forming a resistor (125) electrically connected between the first output and the second output.