公开(公告)号：DE69118119D1

公开(公告)日：1996-04-25

申请号：DE69118119

申请日：1991-09-27

Applicant: IBM

Inventor： LINDE HAROLD G ,  PREVITI-KELLY ROSEMARY A

IPC: C08G73/10 ,  B32B15/08 ,  B32B15/088 ,  B32B37/00 ,  C08J5/12 ,  C09D183/04 ,  C09D183/08 ,  H01L21/312 ,  H05K1/03 ,  H05K3/38 ,  H05K3/46

Abstract: In order to improve the adhesion of a polyimide layer to an underlying metal surface, an organic solution which cures to a silsesquioxane copolymer is applied to the surface. The polyimide and the copolymer are formed during a simultaneous curing step.