11.
    发明专利
    未知

    公开(公告)号:DE3587055D1

    公开(公告)日:1993-03-18

    申请号:DE3587055

    申请日:1985-07-23

    Applicant: IBM

    Abstract: A method for distributing wire load among the layers of a multilayer interconnection package such that in each region of the package, the wire load is balanced among all layers and such that specified subsets of two-pin connections may be constrained to lie within the same layer.More specifically a method is disclosed for distributing connections within the layers of a multilayer circuit board, the method comprising the steps of: a) reading connection data relating to the location of pins on the interconnection board at which the connections terminate; b) defining a connection type for each connection based on the locations of the pins of said connection; and c) distributing connections of one or more connection types among the layers of the interconnection board such that for each connection type, the difference in the number of connections of that type distributed to each of the several layers is less than or equal to 1.

    ITERATIVE METHOD FOR ESTABLISHING CONNECTIONS BETWEEN NODES AND THE RESULTING PRODUCT

    公开(公告)号:DE3479540D1

    公开(公告)日:1989-09-28

    申请号:DE3479540

    申请日:1984-11-06

    Applicant: IBM

    Inventor: LINSKER RALPH

    Abstract: A method for establishing connections by automatically routing a plurality of paths between individual components using Initially simple connection path shapes. The method is used to create an interconnection package with better use of wiring space. Each connection, in turn, is removed is previously routed, rerouted and evaluated according to specified penalty costs to minimize undesribale routing characteristics. This method is particularly advantageous in providing automatic path routing in directionally uncommitted planes for wiring highly integrated electric circuits, or the like.

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